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Patent applications and USPTO patent grants for Sung; Tsai Wen.The latest application filed is for "spacer etching process".
Patent | Date |
---|---|
Silicon mandrel etch after native oxide punch-through Grant 11,387,115 - Yan , et al. July 12, 2 | 2022-07-12 |
Spacer etching process Grant 11,276,560 - Sung , et al. March 15, 2 | 2022-03-15 |
Spacer open process by dual plasma Grant 11,195,718 - Sung , et al. December 7, 2 | 2021-12-07 |
Spacer Etching Process App 20210066047 - Sung; Tsai Wen ;   et al. | 2021-03-04 |
Processing Of Workpieces Using Deposition Process And Etch Process App 20210020445 - Wang; Shanyu ;   et al. | 2021-01-21 |
Spacer Open Process By Dual Plasma App 20210005456 - Sung; Tsai Wen ;   et al. | 2021-01-07 |
Silicon Mandrel Etch After Native Oxide Punch-through App 20200203182 - Yan; Chun ;   et al. | 2020-06-25 |
Ultrasound Responsive Micro-composite Markers App 20190192253 - Yang; Jian ;   et al. | 2019-06-27 |
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