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Semiconductor Structure And Manufacturing Method Thereof
App 20220285210 - Lin; Yu-Kai ; et al. | 2022-09-08 |
Method For Forming Semiconductor Device With Multi-layer Etch Stop Structure
App 20220208603 - SHIH; Po-Cheng ; et al. | 2022-06-30 |
Semiconductor device with multi-layer etch stop structure and method for forming the same
Grant 11,282,742 - Shih , et al. March 22, 2 | 2022-03-22 |
Capping layer for improved deposition selectivity
Grant 11,264,328 - Wang , et al. March 1, 2 | 2022-03-01 |
Nitrogen Plasma Treatment For Improving Interface Between Etch Stop Layer And Copper Interconnect
App 20210257293 - Lee; Hui ; et al. | 2021-08-19 |
Semiconductor Device With Multi-layer Etch Stop Structure And Method For Forming The Same
App 20210118728 - SHIH; Po-Cheng ; et al. | 2021-04-22 |
Electro-migration Barrier For Interconnect
App 20210082831 - Sung; Su-Jen ; et al. | 2021-03-18 |
Electro-migration barrier for Cu interconnect
Grant 10,867,920 - Sung , et al. December 15, 2 | 2020-12-15 |
Interconnect Structure and Method of Forming Same
App 20200111744 - Sung; Su-Jen | 2020-04-09 |
Interconnect structure and method of forming same
Grant 10,510,666 - Sung Dec | 2019-12-17 |
Electro-migration Barrier For Cu Interconnect
App 20190148308 - Sung; Su-Jen ; et al. | 2019-05-16 |
Capping Layer For Improved Deposition Selectivity
App 20190148307 - Wang; Chao-Chun ; et al. | 2019-05-16 |
Capping layer for improved deposition selectivity
Grant 10,163,794 - Wang , et al. Dec | 2018-12-25 |
Electro-migration barrier for Cu interconnect
Grant 10,163,795 - Sung , et al. Dec | 2018-12-25 |
Systems and methods for uniform gas flow in a deposition chamber
Grant 9,852,905 - Sung December 26, 2 | 2017-12-26 |
Interconnect Structure and Method of Forming Same
App 20170162506 - Sung; Su-Jen | 2017-06-08 |
Electro-migration Barrier For Cu Interconnect
App 20170053875 - Sung; Su-Jen ; et al. | 2017-02-23 |
Semiconductor devices and methods of manufacture thereof
Grant 9,530,728 - Sung , et al. December 27, 2 | 2016-12-27 |
Electro-migration barrier for Cu interconnect
Grant 9,490,209 - Sung , et al. November 8, 2 | 2016-11-08 |
Capping Layer For Improved Deposition Selectivity
App 20160254226 - Wang; Chao-Chun ; et al. | 2016-09-01 |
Capping layer for improved deposition selectivity
Grant 9,396,990 - Wang , et al. July 19, 2 | 2016-07-19 |
Interconnect structure and method of forming the same
Grant 9,355,894 - Sung , et al. May 31, 2 | 2016-05-31 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20150380352 - Sung; Su-Jen ; et al. | 2015-12-31 |
Semiconductor devices and methods of manufacture thereof
Grant 9,129,965 - Sung , et al. September 8, 2 | 2015-09-08 |
Interconnect Structure and Method of Forming the Same
App 20150235894 - Sung; Su-Jen ; et al. | 2015-08-20 |
Systems and Methods for Uniform Gas Flow in a Deposition Chamber
App 20150197846 - SUNG; Su-Jen | 2015-07-16 |
Interconnect structure and method of forming the same
Grant 9,041,216 - Sung , et al. May 26, 2 | 2015-05-26 |
Deposition Injection Masking
App 20140272135 - Chang; Chih-Chiang ; et al. | 2014-09-18 |
Electro-Migration Barrier for Cu Interconnect
App 20140264874 - Sung; Su-Jen ; et al. | 2014-09-18 |
Interconnect Structure And Method Of Forming The Same
App 20140264880 - Sung; Su-Jen ; et al. | 2014-09-18 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20140264895 - Sung; Su-Jen ; et al. | 2014-09-18 |
Capping Layer for Improved Deposition Selectivity
App 20140210085 - Wang; Chao-Chun ; et al. | 2014-07-31 |
Structure of porous low-k layer and interconnect structure
Grant 8,350,246 - Chen , et al. January 8, 2 | 2013-01-08 |
Method of fabricating an ultra dielectric constant (K) dielectric layer
Grant 8,092,861 - Chen , et al. January 10, 2 | 2012-01-10 |
Method for manufacturing a dual damascene opening comprising a trench opening and a via opening
Grant 8,084,357 - Chen , et al. December 27, 2 | 2011-12-27 |
Forming Method And Structure Of Porous Low-k Layer, Interconnect Process And Interconnect Structure
App 20110147948 - Chen; Mei-Ling ; et al. | 2011-06-23 |
Forming method of porous low-k layer and interconnect process
Grant 7,947,565 - Chen , et al. May 24, 2 | 2011-05-24 |
Fabrication Method Of Porous Low-k Dielectric Film
App 20090275211 - Chen; Mei-Ling ; et al. | 2009-11-05 |
Ultra Low Dielectric Constant (k) Dielectric Layer And Method Of Fabricating The Same
App 20090061201 - Chen; Mei-Ling ; et al. | 2009-03-05 |
Multi Cap Layer And Manufacturing Method Thereof
App 20080251931 - Chen; Wei-Chih ; et al. | 2008-10-16 |
Forming Method And Structure Of Porous Low-k Layer, Interconnect Process And Interconnect Structure
App 20080188088 - Chen; Mei-Ling ; et al. | 2008-08-07 |
Method Of Curing Porous Low-k Layer
App 20080166498 - Chen; Mei-Ling ; et al. | 2008-07-10 |
Porous Low-k Dielectric Film And Fabrication Method Thereof
App 20070173070 - Chen; Mei-Ling ; et al. | 2007-07-26 |
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