SUNG; Shu-Hui

Patent Applications and Registrations

Patent applications and USPTO patent grants for SUNG; Shu-Hui.The latest application filed is for "integrated circuits and manufacturing methods thereof".

Company Profile

2.6.7

SUNG; Shu-Hui - Hsinchu County TW
Sung; Shu-Hui - Baoshan Township TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Circuits And Manufacturing Methods Thereof App 20200126986 - KESHAVARZI; Ali ; et al.	2020-04-23
Integrated circuits and manufacturing methods thereof Grant 10,535,655 - Keshavarzi , et al. Ja	2020-01-14
Semiconductor device including source/drain contact having height below gate stack Grant 9,917,050 - Chen , et al. March 13, 2	2018-03-13
Designed-based interconnect structure in semiconductor structure Grant 9,754,881 - Chen , et al. September 5, 2	2017-09-05
Thermal analysis for tiered semiconductor structure Grant 9,659,115 - Chen , et al. May 23, 2	2017-05-23
Structure And Method For Semiconductor Device App 20170040259 - Chen; Chih-Liang ; et al.	2017-02-09
Integrated Circuits And Manufacturing Methods Thereof App 20160372469 - Keshavarzi; Ali ; et al.	2016-12-22
Method of forming semiconductor device including source/drain contact having height below gate stack Grant 9,478,636 - Chen , et al. October 25, 2	2016-10-25
Designed-based Interconnect Structure In Semiconductor Structure App 20160172297 - CHEN; Chih-Liang ; et al.	2016-06-16
Designed-based interconnect structure in semiconductor structure Grant 9,281,273 - Chen , et al. March 8, 2	2016-03-08
Designed-based Interconnect Structure In Semiconductor Structure App 20160064322 - CHEN; Chih-Liang ; et al.	2016-03-03
Structure and Method for Semiconductor Device App 20150332962 - Chen; Chih-Liang ; et al.	2015-11-19
Thermal Analysis For Tiered Semiconductor Structure App 20150179529 - Chen; Chih-Liang ; et al.	2015-06-25

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