Sung; Pil Je

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sung; Pil Je.The latest application filed is for "semiconductor device and manufacturing method thereof".

Company Profile

2.10.11

Sung; Pil Je - Seoul KR
Sung; Pil Je - Dongjak-gu N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device And Manufacturing Method Thereof App 20220148886 - Paek; Jong Sik ; et al.	2022-05-12
Semiconductor device and manufacturing method thereof Grant 11,101,144 - Paek , et al. August 24, 2	2021-08-24
Semiconductor Device And Manufacturing Method Thereof App 20200303212 - Paek; Jong Sik ; et al.	2020-09-24
Semiconductor device and manufacturing method thereof Grant 10,515,825 - Paek , et al. Dec	2019-12-24
Semiconductor Device And Manufacturing Method Thereof App 20190067035 - Paek; Jong Sik ; et al.	2019-02-28
Semiconductor device and manufacturing method thereof Grant 10,079,157 - Paek , et al. September 18, 2	2018-09-18
Semiconductor device and manufacturing method thereof Grant 9,793,180 - Ahn , et al. October 17, 2	2017-10-17
Semiconductor device and manufacturing method thereof Grant 9,449,946 - Sung , et al. September 20, 2	2016-09-20
Semiconductor Device And Manufacturing Method Thereof App 20160189980 - Paek; Jong Sik ; et al.	2016-06-30
Semiconductor device utilizing redistribution layers to couple stacked die Grant 9,190,370 - Paek , et al. November 17, 2	2015-11-17
Semiconductor Device Utilizing Redistribution Layers To Couple Stacked Die App 20150262945 - Paek; Jong Sik ; et al.	2015-09-17
Semiconductor Device With Reduced Warpage App 20150255426 - Son; Seung Nam ; et al.	2015-09-10
Semiconductor Device And Manufacturing Method Thereof App 20150206807 - Ahn; Seo Yeon ; et al.	2015-07-23
Semiconductor device utilzing redistribution layers to couple stacked die Grant 9,048,241 - Paek , et al. June 2, 2	2015-06-02
Semiconductor Package with Reduced Thickness App 20150041980 - Ahn; Seo Yeon ; et al.	2015-02-12
Semiconductor Device Utilzing Redistribution Layers To Couple Stacked Die App 20150014830 - Paek; Jong Sik ; et al.	2015-01-15
Semiconductor Device And Manufacturing Method Thereof App 20140284785 - Sung; Pil Je ; et al.	2014-09-25
Concentrated photovoltaic receiver package with stacked internal support features Grant 8,502,361 - Nickelsen, Jr. , et al. August 6, 2	2013-08-06

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