Sung; Ming-Chung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sung; Ming-Chung.The latest application filed is for "package-on-package structure and methods for forming the same".

Company Profile

0.19.21

Sung; Ming-Chung - Taichung TW
Sung; Ming-Chung - Taichung City TW
Sung, Ming-Chung - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package-on-package structure and methods for forming the same Grant 9,985,013 - Lee , et al. May 29, 2	2018-05-29
Package-on-Package Structure and Methods for Forming the Same App 20160013175 - Lee; Chien-Hsun ; et al.	2016-01-14
Package-on-package structure and methods for forming the same Grant 9,165,876 - Lee , et al. October 20, 2	2015-10-20
Rotating curing Grant 9,147,584 - Lu , et al. September 29, 2	2015-09-29
Looped interconnect structure Grant 8,927,877 - Shen , et al. January 6, 2	2015-01-06
Package-on-Package Structure and Methods for Forming the Same App 20140252609 - Lee; Chien-Hsun ; et al.	2014-09-11
Package on package devices and methods of packaging semiconductor dies Grant 8,823,180 - Wang , et al. September 2, 2	2014-09-02
System and method for forming uniform rigid interconnect structures Grant 8,796,132 - Sung , et al. August 5, 2	2014-08-05
Methods and apparatus for alignment in flip chip bonding Grant 8,664,039 - Sung , et al. March 4, 2	2014-03-04
Method and apparatus for die assembly Grant 8,652,939 - Sung , et al. February 18, 2	2014-02-18
Looped Interconnect Structure App 20140041918 - Shen; Hsin-An ; et al.	2014-02-13
System and Method for Forming Uniform Rigid Interconnect Structures App 20140004660 - Sung; Ming-Chung ; et al.	2014-01-02
Package on Package Devices and Methods of Packaging Semiconductor Dies App 20130168856 - Wang; Tsung-Ding ; et al.	2013-07-04
Rotating Curing App 20130119565 - Lu; Jing Ruei ; et al.	2013-05-16
Method and Apparatus for Die Assembly App 20130093094 - Sung; Ming-Chung ; et al.	2013-04-18
Methods and Apparatus For Alignment In Flip Chip Bonding App 20130095607 - Sung; Ming-Chung ; et al.	2013-04-18
Process and apparatus for wafer-level flip-chip assembly Grant 8,232,183 - Lee , et al. July 31, 2	2012-07-31
Wafer-level flip-chip assembly methods Grant 7,977,155 - Lee , et al. July 12, 2	2011-07-12
Performing die-to-wafer stacking by filling gaps between dies Grant 7,951,647 - Yang , et al. May 31, 2	2011-05-31
Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer Grant 7,642,631 - Lu , et al. January 5, 2	2010-01-05
Performing Die-to-Wafer Stacking by Filling Gaps Between Dies App 20090311829 - Yang; Ku-Feng ; et al.	2009-12-17
Process and apparatus for wafer-level flip-chip assembly App 20080274592 - Lee; Chien-Hsiun ; et al.	2008-11-06
Wafer-level flip-chip assembly methods App 20080274589 - Lee; Chien-Hsiun ; et al.	2008-11-06
Packaged Semiconductor Chip Comprising An Integrated Circuit Chip Ablated With Laser And Cut With Saw Blade From Wafer App 20070257365 - Lu; Szu Wei ; et al.	2007-11-08
Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade Grant 7,265,034 - Lu , et al. September 4, 2	2007-09-04
Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade App 20060189099 - Lu; Szu Wei ; et al.	2006-08-24
Wafer level chip scale package and method of fabricating the same App 20030071354 - Tsai, Chin-Ying ; et al.	2003-04-17
Method for secure online transaction App 20020178121 - Sung, Ming-Chung ; et al.	2002-11-28

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