loadpatents
name:-0.01571798324585
name:-0.009566068649292
name:-0.0044350624084473
Sung; Ki Jung Patent Filings

Sung; Ki Jung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sung; Ki Jung.The latest application filed is for "printed circuit board".

Company Profile
4.7.15
  • Sung; Ki Jung - Suwon-si KR
  • Sung; Ki-Jung - Seoul KR
  • SUNG; Ki-Jung - Suwon KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Printed circuit board
Grant 11,229,119 - Sung , et al. January 18, 2
2022-01-18
Printed circuit board
Grant 11,102,886 - Sung , et al. August 24, 2
2021-08-24
Printed Circuit Board
App 20210127494 - CHOI; Jae Woong ;   et al.
2021-04-29
Printed circuit board
Grant 10,980,125 - Choi , et al. April 13, 2
2021-04-13
Printed Circuit Board
App 20210100105 - Sung; Ki Jung ;   et al.
2021-04-01
Printed Circuit Board
App 20210100104 - SUNG; Ki Jung ;   et al.
2021-04-01
Fan-out semiconductor package
Grant 10,833,041 - Hwang , et al. November 10, 2
2020-11-10
Fan-out semiconductor device
Grant 10,396,037 - Hwang , et al. A
2019-08-27
Fan-out Semiconductor Package
App 20190035758 - HWANG; Jun Oh ;   et al.
2019-01-31
Fan-out Semiconductor Device
App 20180350747 - HWANG; Jun Oh ;   et al.
2018-12-06
Circuit board, electronic component and method of manufacturing circuit board
Grant 9,832,885 - Kang , et al. November 28, 2
2017-11-28
Circuit board and method of manufacturing the same
Grant 9,788,409 - Lee , et al. October 10, 2
2017-10-10
Circuit Board And Method Of Manufacturing The Same
App 20160302299 - LEE; Young-Kwan ;   et al.
2016-10-13
Printed Circuit Board And Method Of Fabricating The Same
App 20160105956 - HWANG; Jun Oh ;   et al.
2016-04-14
Printed Circuit Board And Method Of Manufacturing The Same
App 20160050752 - KANG; Myung Sam ;   et al.
2016-02-18
Printed Circuit Board And Method Of Manufacturing The Same
App 20160029488 - KANG; Myung Sam ;   et al.
2016-01-28
Package Structure And Manufacturing Method Thereof
App 20160007467 - LEE; Seung-Eun ;   et al.
2016-01-07
Package Board And Method For Manufacturing The Same
App 20150351228 - PARK; Jin Seon ;   et al.
2015-12-03
Circuit Board And Method Of Manufacturing Circuit Board
App 20150351231 - LEE; Young Kwan ;   et al.
2015-12-03
Circuit Board, Electronic Component And Method Of Manufacturing Circuit Board
App 20150342047 - KANG; Myung Sam ;   et al.
2015-11-26
Package Board, Method Of Manufacturing The Same, And Semiconductor Package Using The Same
App 20150195905 - KANG; Myung Sam ;   et al.
2015-07-09
Printed Circuit Board And Manufacturing Method Thereof
App 20150156891 - SUNG; Ki Jung ;   et al.
2015-06-04

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed