loadpatents
Patent applications and USPTO patent grants for Sung; Ki Jung.The latest application filed is for "printed circuit board".
Patent | Date |
---|---|
Printed circuit board Grant 11,229,119 - Sung , et al. January 18, 2 | 2022-01-18 |
Printed circuit board Grant 11,102,886 - Sung , et al. August 24, 2 | 2021-08-24 |
Printed Circuit Board App 20210127494 - CHOI; Jae Woong ;   et al. | 2021-04-29 |
Printed circuit board Grant 10,980,125 - Choi , et al. April 13, 2 | 2021-04-13 |
Printed Circuit Board App 20210100105 - Sung; Ki Jung ;   et al. | 2021-04-01 |
Printed Circuit Board App 20210100104 - SUNG; Ki Jung ;   et al. | 2021-04-01 |
Fan-out semiconductor package Grant 10,833,041 - Hwang , et al. November 10, 2 | 2020-11-10 |
Fan-out semiconductor device Grant 10,396,037 - Hwang , et al. A | 2019-08-27 |
Fan-out Semiconductor Package App 20190035758 - HWANG; Jun Oh ;   et al. | 2019-01-31 |
Fan-out Semiconductor Device App 20180350747 - HWANG; Jun Oh ;   et al. | 2018-12-06 |
Circuit board, electronic component and method of manufacturing circuit board Grant 9,832,885 - Kang , et al. November 28, 2 | 2017-11-28 |
Circuit board and method of manufacturing the same Grant 9,788,409 - Lee , et al. October 10, 2 | 2017-10-10 |
Circuit Board And Method Of Manufacturing The Same App 20160302299 - LEE; Young-Kwan ;   et al. | 2016-10-13 |
Printed Circuit Board And Method Of Fabricating The Same App 20160105956 - HWANG; Jun Oh ;   et al. | 2016-04-14 |
Printed Circuit Board And Method Of Manufacturing The Same App 20160050752 - KANG; Myung Sam ;   et al. | 2016-02-18 |
Printed Circuit Board And Method Of Manufacturing The Same App 20160029488 - KANG; Myung Sam ;   et al. | 2016-01-28 |
Package Structure And Manufacturing Method Thereof App 20160007467 - LEE; Seung-Eun ;   et al. | 2016-01-07 |
Package Board And Method For Manufacturing The Same App 20150351228 - PARK; Jin Seon ;   et al. | 2015-12-03 |
Circuit Board And Method Of Manufacturing Circuit Board App 20150351231 - LEE; Young Kwan ;   et al. | 2015-12-03 |
Circuit Board, Electronic Component And Method Of Manufacturing Circuit Board App 20150342047 - KANG; Myung Sam ;   et al. | 2015-11-26 |
Package Board, Method Of Manufacturing The Same, And Semiconductor Package Using The Same App 20150195905 - KANG; Myung Sam ;   et al. | 2015-07-09 |
Printed Circuit Board And Manufacturing Method Thereof App 20150156891 - SUNG; Ki Jung ;   et al. | 2015-06-04 |
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