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Patent applications and USPTO patent grants for Sung; Junghwan.The latest application filed is for "deposition of tungsten nitride".
Patent | Date |
---|---|
Deposition of tungsten nitride Grant 7,691,749 - Levy , et al. April 6, 2 | 2010-04-06 |
Method of forming low-resistivity tungsten interconnects Grant 7,262,125 - Wongsenakhum , et al. August 28, 2 | 2007-08-28 |
Method for reducing tungsten film roughness and improving step coverage Grant 7,141,494 - Lee , et al. November 28, 2 | 2006-11-28 |
Method for preventing and cleaning ruthenium-containing deposits in a CVD apparatus Grant 7,107,998 - Greer , et al. September 19, 2 | 2006-09-19 |
Deposition of tungsten nitride App 20060094238 - Levy; Karl B. ;   et al. | 2006-05-04 |
Deposition of tungsten nitride Grant 7,005,372 - Levy , et al. February 28, 2 | 2006-02-28 |
Methods of forming tungsten nucleation layer Grant 6,905,543 - Fair , et al. June 14, 2 | 2005-06-14 |
Method for preventing and cleaning ruthenium-containing deposits in a CVD apparatus App 20050081882 - Greer, Harold F.R. ;   et al. | 2005-04-21 |
Method for reducing tungsten film roughness and improving step coverage App 20050031786 - Lee, Sang-Hyeob ;   et al. | 2005-02-10 |
Method of forming low-resistivity tungsten interconnects App 20040202786 - Wongsenakhum, Panya ;   et al. | 2004-10-14 |
Deposition of tungsten nitride App 20040142557 - Levy, Karl B. ;   et al. | 2004-07-22 |
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