SUNG; Chien Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for SUNG; Chien Ming.The latest application filed is for "semiconductor device with buffer layer and method of forming".
- SUNG; Chien Ming - Tainan City TW
- Sung; Chien Ming - Tainan TW
- Sung; Chien-Ming - Taoyuan City TW
- Sung; Chien-Ming - Taipei TW
- Sung; Chien-Ming - Taipei Shien TW
- Sung; Chien-Ming - Taipei County TW
- Sung, Chien-Ming - Feng-Yuan City TW
| Patent | Date |
|---|---|
| Semiconductor Device With Buffer Layer And Method Of Forming App 20220085090 - TENG; Ya Chun ; et al. | 2022-03-17 |
| Semiconductor device with buffer layer and method of forming Grant 11,189,653 - Teng , et al. November 30, 2 | 2021-11-30 |
| Semiconductor Device With Buffer Layer And Method Of Forming App 20210082985 - TENG; Ya Chun ; et al. | 2021-03-18 |
| Seal ring for bonded dies Grant 10,515,908 - Teng , et al. Dec | 2019-12-24 |
| Seal Ring For Bonded Dies App 20190131255 - TENG; Ya-Chun ; et al. | 2019-05-02 |
| Hydroponic Device App 20170258021 - Chiu; Chia-Hsiang ; et al. | 2017-09-14 |
| Preventing contamination in integrated circuit manufacturing lines Grant 9,177,843 - Sung , et al. November 3, 2 | 2015-11-03 |
| Multilayer Si/Graphene Composite Anode Structure App 20150004494 - Tatsuhiro; Mori ; et al. | 2015-01-01 |
| Hinge for portable computer Grant 7,712,188 - Sung May 11, 2 | 2010-05-11 |
| Preventing Contamination in Integrated Circuit Manufacturing Lines App 20080304944 - Sung; Chien-Ming ; et al. | 2008-12-11 |
| Supporting device used for sustaining an apparatus within a portable computer Grant 7,448,588 - Sung November 11, 2 | 2008-11-11 |
| Hinge For Portable Computer App 20070234516 - Sung; Chien-Ming | 2007-10-11 |
| Tools for polishing and associated methods App 20070215486 - Sung; Chien-Ming | 2007-09-20 |
| Supporting device App 20060237623 - Sung; Chien-Ming | 2006-10-26 |
| Surface treatment method for preparing water-resistant aluminum nitride powder App 20030118501 - Chung, Shyan-Lung ; et al. | 2003-06-26 |
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