Sung; Chia-Hao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sung; Chia-Hao.The latest application filed is for "thin pump".
- Sung; Chia-Hao - New Taipei TW
- SUNG; Chia-Hao - New Taipei City TW
- SUNG; Chia-Hao - Kaohsiung TW
| Patent | Date |
|---|---|
| Liquid supply device and liquid cooling system Grant 11,337,334 - Sung , et al. May 17, 2 | 2022-05-17 |
| Thin Pump App 20210308346 - YEH; Chiu Yu ; et al. | 2021-10-07 |
| Semiconductor Device Package And Method Of Manufacturing The Same App 20210288002 - SUNG; Chia-Hao ; et al. | 2021-09-16 |
| Fan Device, Fan System, And Control Methods Thereof App 20210265929 - KUO; Chu-Yi ; et al. | 2021-08-26 |
| Semiconductor device package and method of manufacturing the same Grant 11,101,189 - Lee , et al. August 24, 2 | 2021-08-24 |
| Semiconductor device package and method of manufacturing the same Grant 11,024,586 - Sung , et al. June 1, 2 | 2021-06-01 |
| Fan and control method thereof Grant 10,816,005 - Chen , et al. October 27, 2 | 2020-10-27 |
| Semiconductor Device Package And Method Of Manufacturing The Same App 20200283288 - LEE; Ming Yen ; et al. | 2020-09-10 |
| Fluid connector assembly Grant 10,739,833 - Chai , et al. A | 2020-08-11 |
| Semiconductor Device Package And Method Of Manufacturing The Same App 20200235056 - SUNG; Chia-Hao ; et al. | 2020-07-23 |
| Semiconductor device package and method of manufacturing the same Grant 10,689,248 - Lee , et al. | 2020-06-23 |
| Connector Assembly App 20190369681 - CHAI; Chun-Yu ; et al. | 2019-12-05 |
| Fan And Control Method Thereof App 20190293078 - CHEN; Chung-Yang ; et al. | 2019-09-26 |
| Fan and control method thereof Grant 10,364,817 - Chen , et al. July 30, 2 | 2019-07-30 |
| Semiconductor Device Package And Method Of Manufacturing The Same App 20180265347 - LEE; Ming Yen ; et al. | 2018-09-20 |
| Fan And Control Method Thereof App 20180187689 - CHEN; Chung-Yang ; et al. | 2018-07-05 |
| Liquid Supply Device And Liquid Cooling System App 20170034950 - Sung; Chia-Hao ; et al. | 2017-02-02 |
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