Sundlof; Brian R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sundlof; Brian R..The latest application filed is for "multilayer pillar for reduced stress interconnect and method of making same".

Company Profile

4.41.40

Sundlof; Brian R. - Verbank NY
Sundlof; Brian R. - Hopewell Junction NY
Sundlof; Brian R - Verbank NY
Sundlof; Brian R. - Beacon NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multilayer pillar for reduced stress interconnect and method of making same Grant 11,244,917 - Jadhav , et al. February 8, 2	2022-02-08
Multilayer pillar for reduced stress interconnect and method of making same Grant 11,171,102 - Jadhav , et al. November 9, 2	2021-11-09
Multilayer pillar for reduced stress interconnect and method of making same Grant 11,094,657 - Jadhav , et al. August 17, 2	2021-08-17
Multi terminal capacitor within input output path of semiconductor package interconnect Grant 10,622,299 - Arvin , et al.	2020-04-14
Multilayer Pillar For Reduced Stress Interconnect And Method Of Making Same App 20190326243 - JADHAV; Virendra R. ; et al.	2019-10-24
Multilayer Pillar For Reduced Stress Interconnect And Method Of Making Same App 20190326242 - JADHAV; Virendra R. ; et al.	2019-10-24
Multilayer pillar for reduced stress interconnect and method of making same Grant 10,403,590 - Jadhav , et al. Sep	2019-09-03
Multilayer pillar for reduced stress interconnect and method of making same Grant 10,396,051 - Jadhav , et al. A	2019-08-27
Multi Terminal Capacitor Within Input Output Path Of Semiconductor Package Interconnect App 20190172784 - Arvin; Charles L. ; et al.	2019-06-06
Multilayer Pillar For Reduced Stress Interconnect And Method Of Making Same App 20190157230 - JADHAV; Virendra R. ; et al.	2019-05-23
Multi terminal capacitor within input output path of semiconductor package interconnect Grant 10,224,273 - Arvin , et al.	2019-03-05
Multi terminal capacitor within input output path of semiconductor package interconnect Grant 10,224,274 - Arvin , et al.	2019-03-05
Determining crackstop strength of integrated circuit assembly at the wafer level Grant 9,947,598 - Tunga , et al. April 17, 2	2018-04-17
Multi Terminal Capacitor Within Input Output Path Of Semiconductor Package Interconnect App 20180068945 - Arvin; Charles L. ; et al.	2018-03-08
Multi Terminal Capacitor Within Input Output Path Of Semiconductor Package Interconnect App 20180053717 - Arvin; Charles L. ; et al.	2018-02-22
Multi terminal capacitor within input output path of semiconductor package interconnect Grant 9,899,313 - Arvin , et al. February 20, 2	2018-02-20
Multi Terminal Capacitor Within Input Output Path Of Semiconductor Package Interconnect App 20180012838 - Arvin; Charles L. ; et al.	2018-01-11
Multilayer Pillar For Reduced Stress Interconnect And Method Of Making Same App 20170170135 - JADHAV; Virendra R. ; et al.	2017-06-15
Multilayer Pillar For Reduced Stress Interconnect And Method Of Making Same App 20170133338 - JADHAV; Virendra R. ; et al.	2017-05-11
Multilayer pillar for reduced stress interconnect and method of making same Grant 9,640,501 - Jadhav , et al. May 2, 2	2017-05-02
Multilayer pillar for reduced stress interconnect and method of making same Grant 9,472,520 - Jadhav , et al. October 18, 2	2016-10-18
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Grant 9,263,363 - Hougham , et al. February 16, 2	2016-02-16
Multilayer pillar for reduced stress interconnect and method of making same Grant 9,111,816 - Jadhav , et al. August 18, 2	2015-08-18
Solder interconnect with non-wettable sidewall pillars and methods of manufacture Grant 9,018,760 - Arvin , et al. April 28, 2	2015-04-28
Multilayer Pillar For Reduced Stress Interconnect And Method Of Making Same App 20150054152 - JADHAV; Virendra R. ; et al.	2015-02-26
Additives for grain fragmentation in Pb-free Sn-based solder Grant 8,910,853 - Arvin , et al. December 16, 2	2014-12-16
Solder Interconnect With Non-wettable Sidewall Pillars And Methods Of Manufacture App 20140077367 - Arvin; Charles L. ; et al.	2014-03-20
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive App 20140038362 - Hougham; Gareth ; et al.	2014-02-06
Solder interconnect with non-wettable sidewall pillars and methods of manufacture Grant 8,637,392 - Arvin , et al. January 28, 2	2014-01-28
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Grant 8,604,623 - Hougham , et al. December 10, 2	2013-12-10
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER App 20130284495 - Arvin; Charles L. ; et al.	2013-10-31
Additives for grain fragmentation in Pb-free Sn-based solder Grant 8,493,746 - Arvin , et al. July 23, 2	2013-07-23
Self Orienting Micro Plates Of Thermally Conducting Material As Component In Thermal Paste Or Adhesive App 20130016479 - Hougham; Gareth ; et al.	2013-01-17
Multilayer Pillar For Reduced Stress Interconnect And Method Of Making Same App 20120312447 - JADHAV; Virendra R. ; et al.	2012-12-13
Multilayer pillar for reduced stress interconnect and method of making same Grant 8,293,587 - Jadhav , et al. October 23, 2	2012-10-23
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Grant 8,268,282 - Hougham , et al. September 18, 2	2012-09-18
Self Orienting Micro Plates Of Thermally Conducting Material As Component In Thermal Paste Or Adhesive App 20120211159 - Hougham; Gareth ; et al.	2012-08-23
Method Of Forming Underbump Metallurgy Structure Employing Sputter-deposited Nickel Copper Alloy App 20120202343 - Belanger; Luc ; et al.	2012-08-09
Multilayer Pillar For Reduced Stress Interconnect And Method Of Making Same App 20120181071 - JADHAV; Virendra R. ; et al.	2012-07-19
Optimization of metallurgical properties of a solder joint Grant 8,197,612 - Busby , et al. June 12, 2	2012-06-12
Solder Interconnect with Non-Wettable Sidewall Pillars and Methods of Manufacture App 20110193218 - Arvin; Charles L. ; et al.	2011-08-11
Compliant penetrating packaging interconnect Grant 7,897,878 - Coteus , et al. March 1, 2	2011-03-01
Method and process for reducing undercooling in a lead-free tin-rich solder alloy Grant 7,784,669 - Hougham , et al. August 31, 2	2010-08-31
Self Orienting Micro Plates Of Thermally Conducting Material As Component In Thermal Paste Or Adhesive Adhesive App 20100207056 - Hougham; Gareth ; et al.	2010-08-19
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER App 20100200271 - Arvin; Charles L. ; et al.	2010-08-12
Method And Process For Reducing Undercooling In A Lead-free Tin-rich Solder Alloy App 20100155456 - HOUGHAM; GARETH G. ; et al.	2010-06-24
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Grant 7,708,909 - Hougham , et al. May 4, 2	2010-05-04
Method and process for reducing undercooling in a lead-free tin-rich solder alloy Grant 7,703,661 - Hougham , et al. April 27, 2	2010-04-27
Intermetallic diffusion block device and method of manufacture Grant 7,683,493 - Arvin , et al. March 23, 2	2010-03-23
Method and apparatus for forming stacked die and substrate structures for increased packing density Grant 7,611,923 - Fasano , et al. November 3, 2	2009-11-03
Intermetallic Diffusion Block Device And Method Of Manufacture App 20090267228 - Arvin; Charles L. ; et al.	2009-10-29
Optimization Of Metallurgical Properties Of A Solder Joint App 20090266447 - BUSBY; JAMES A. ; et al.	2009-10-29
Underbump Metallurgy Employing Sputter-deposited Nickel Titanium Alloy App 20090140423 - Belanger; Luc ; et al.	2009-06-04
Underbump Metallurgy Employing Sputter-deposited Nickel Titanium Copper Alloy App 20090134016 - Belanger; Luc ; et al.	2009-05-28
Multilayer Pillar For Reduced Stress Interconnect And Method Of Making Same App 20090095502 - JADHAV; VIRENDRA R. ; et al.	2009-04-16
Method And Process For Reducing Undercooling In A Lead-free Tin-rich Solder Alloy App 20080290142 - Hougham; Gareth G. ; et al.	2008-11-27
Method and apparatus for filling vias Grant 7,449,067 - Andry , et al. November 11, 2	2008-11-11
Self Orienting Micro Plates Of Thermally Conducting Material As Component In Thermal Paste Or Adhesive App 20080202386 - Hougham; Gareth ; et al.	2008-08-28
Compliant Penetrating Packaging Interconnect App 20080180927 - Coteus; Paul ; et al.	2008-07-31
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Grant 7,351,360 - Hougham , et al. April 1, 2	2008-04-01
Electronic package repair process Grant 7,294,909 - Casey , et al. November 13, 2	2007-11-13
Suspension for filling via holes in silicon and method for making the same Grant 7,288,474 - Casey , et al. October 30, 2	2007-10-30
Method And Apparatus For Forming Stacked Die And Substrate Structures For Increased Packing Density App 20070196953 - Fasano; Benjamin V. ; et al.	2007-08-23
Method and apparatus for forming stacked die and substrate structures for increased packing density Grant 7,250,675 - Fasano , et al. July 31, 2	2007-07-31
Suspension for filling via holes in silicon and method for making the same Grant 7,202,154 - Casey , et al. April 10, 2	2007-04-10
Suspension for filling via holes in silicon and method for making the same App 20070032078 - Casey; Jon A. ; et al.	2007-02-08
Method And Apparatus For Forming Stacked Die And Substrate Structures For Increased Packing Density App 20060249827 - Fasano; Benjamin V. ; et al.	2006-11-09
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive App 20060112857 - Hougham; Gareth ; et al.	2006-06-01
Electronic package repair process App 20050176255 - Casey, Jon A. ; et al.	2005-08-11
Electronic package repair process Grant 6,916,670 - Casey , et al. July 12, 2	2005-07-12
A Suspension For Filling Via Holes In Silicon And Method For Making The Same App 20050148164 - CASEY, JON A. ; et al.	2005-07-07
Method and apparatus for filling vias App 20050106834 - Andry, Paul S. ; et al.	2005-05-19
Method of selective plating on a substrate Grant 6,823,585 - LaPlante , et al. November 30, 2	2004-11-30
Selective plating using dual lift-off mask App 20040187303 - LaPlante, Mark J. ; et al.	2004-09-30
Electronic package repair process App 20040148765 - Casey, Jon A. ; et al.	2004-08-05

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