loadpatents
Patent applications and USPTO patent grants for Sunderland; Nicolas.The latest application filed is for "in mold electronic printed circuit board encapsulation and assembly".
Patent | Date |
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In mold electronic printed circuit board encapsulation and assembly Grant 11,112,103 - Davis , et al. September 7, 2 | 2021-09-07 |
In Mold Electronic Printed Circuit Board Encapsulation And Assembly App 20190093874 - Davis; Terry G. ;   et al. | 2019-03-28 |
In mold electronic printed circuit board encapsulation and assembly Grant 10,156,352 - Davis , et al. Dec | 2018-12-18 |
In Mold Electronic Printed Circuit Board Encapsulation And Assembly App 20160084490 - DAVIS; Terry G. ;   et al. | 2016-03-24 |
Flame retardant, optically clear thermoplastic molding composition Grant 8,691,895 - Rogunova , et al. April 8, 2 | 2014-04-08 |
Flame Retardant, Optically Clear Thermoplastic Molding Composition App 20110071241 - Rogunova; Marina ;   et al. | 2011-03-24 |
Flame retardant, optically clear thermoplastic molding composition App 20090326129 - Rogunova; Marina ;   et al. | 2009-12-31 |
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