Sundaram; Venkatesh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sundaram; Venkatesh.The latest application filed is for "continuous coils containing a thin anodized film layer and systems and methods for making the same".

Company Profile

2.18.24

Sundaram; Venkatesh - Alpharetta GA
Sundaram; Venkatesh - Johns Creek GA
Sundaram; Venkatesh - Atlanta GA
Sundaram; Venkatesh - John's Creek GA
Sundaram; Venkatesh - Norcross GA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same Grant 10,672,718 - Sundaram , et al.	2020-06-02
Continuous Coils Containing A Thin Anodized Film Layer And Systems And Methods For Making The Same App 20200082972 - Bull; Michael Jackson ; et al.	2020-03-12
Interposer with polymer-filled or polymer-lined optical through-vias in thin glass substrate Grant 9,417,415 - Tummala , et al. August 16, 2	2016-08-16
Through-package-via (tpv) Structures On Inorganic Interposer And Methods For Fabricating Same App 20160141257 - Sundaram; Venkatesh ; et al.	2016-05-19
Package-level Electromagnetic Interference Shielding Structures For A Substrate App 20160113108 - SUNDARAM; Venkatesh ; et al.	2016-04-21
Optical Interconnects And Methods Of Fabricating Same App 20160109653 - Vis; William A. ; et al.	2016-04-21
New Structure Of Microelectronic Packages With Edge Protection By Coating App 20160111380 - SUNDARAM; Venkatesh ; et al.	2016-04-21
Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same Grant 9,275,934 - Sundaram , et al. March 1, 2	2016-03-01
Interconnect structures and methods of making the same Grant 9,173,282 - Raj , et al. October 27, 2	2015-10-27
Glass-Polymer Optical Interposer App 20140355931 - Tummala; Rao R. ; et al.	2014-12-04
Magnetic Device Utilizing Nanocomposite Films Layered With Adhesives App 20140347157 - Pulugurtha; Markondeya Raj ; et al.	2014-11-27
Interconnect Assemblies And Methods Of Making And Using Same App 20140145328 - Tummala; Rao ; et al.	2014-05-29
Chip-last embedded interconnect structures Grant 8,536,695 - Liu , et al. September 17, 2	2013-09-17
Through-Package-Via (TPV) Structures On Inorganic Interposer And Methods For Fabricating Same App 20130119555 - Sundaram; Venkatesh ; et al.	2013-05-16
Interconnect Structures And Methods Of Making The Same App 20130107485 - Raj; Pulugurtha Markondeya ; et al.	2013-05-02
Thin-film capacitor structures embedded in semiconductor packages and methods of making Grant 8,391,017 - McGregor , et al. March 5, 2	2013-03-05
Heterogeneous organic laminate stack ups for high frequency applications Grant 8,345,433 - White , et al. January 1, 2	2013-01-01
Chip-last Embedded Interconnect Structures And Methods Of Making The Same App 20120228754 - LIU; FUHAN ; et al.	2012-09-13
Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications Grant 8,013,688 - White , et al. September 6, 2	2011-09-06
Liquid Crystalline Polymer and Multilayer Polymer-Based Passive Signal Processing Components for RF/Wireless Multi-Band Applications App 20110006861 - White; George E. ; et al.	2011-01-13
Thin-film Capacitor Structures Embedded In Semiconductor Packages And Methods Of Making App 20100270646 - CHAN; CHEONG-WO HUNTER ; et al.	2010-10-28
Thin-film Capacitor Structures Embedded In Semiconductor Packages And Methods Of Making App 20100270645 - MCGREGOR; DAVID ROSS ; et al.	2010-10-28
Method for fabricating three-dimensional all organic interconnect structures Grant 7,805,834 - White , et al. October 5, 2	2010-10-05
Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications Grant 7,795,995 - White , et al. September 14, 2	2010-09-14
Methods for Fabricating Three-Dimensional All Organic Interconnect Structures App 20070267138 - White; George E. ; et al.	2007-11-22
Methods for fabricating three-dimensional all organic interconnect structures Grant 7,260,890 - White , et al. August 28, 2	2007-08-28
Liquid crystalline polymer and multilayer polymer-based passive signal processing components for rf/wireless multi-band applications App 20070085108 - White; George E. ; et al.	2007-04-19
Integrated passive devices fabricated utilizing multi-layer, organic laminates Grant 7,068,124 - White , et al. June 27, 2	2006-06-27
Heterogeneous organic laminate stack ups for high frequency applications App 20060017152 - White; George E. ; et al.	2006-01-26
Stand-alone organic-based passive devices Grant 6,987,307 - White , et al. January 17, 2	2006-01-17
Integrated passive devices fabricated utilizing multi-layer, organic laminates App 20050231304 - White, George E. ; et al.	2005-10-20
Integrated passive devices fabricated utilizing multi-layer, organic laminates Grant 6,900,708 - White , et al. May 31, 2	2005-05-31
Integrated passive devices fabricated utilizing multi-layer, organic laminates App 20040000968 - White, George E. ; et al.	2004-01-01
Stand-alone organic-based passive devices App 20040000701 - White, George E. ; et al.	2004-01-01
Methods for fabricating three-dimensional all organic interconnect structures App 20040000425 - White, George E. ; et al.	2004-01-01
Organic substrate having integrated passive components App 20020158305 - Dalmia, Sidharth ; et al.	2002-10-31

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