Sunakawa; Makoto
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sunakawa; Makoto.The latest application filed is for "resist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the method".
- Sunakawa; Makoto - Osaka JP
- Sunakawa; Makoto - Ibaraki JP
| Patent | Date |
|---|---|
| Resist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the method Grant 5,466,325 - Mizuno , et al. November 14, 1 | 1995-11-14 |
| Pressure-sensitive adhesive composition Grant 4,500,683 - Hori , et al. February 19, 1 | 1985-02-19 |
| Bonding method Grant 4,453,997 - Hori , et al. June 12, 1 | 1984-06-12 |
| Water-soluble pressure-sensitive adhesive composition Grant 4,442,258 - Sunakawa , et al. April 10, 1 | 1984-04-10 |
| Heat-curable composite sheet and process for forming the same Grant 4,243,462 - Hori , et al. January 6, 1 | 1981-01-06 |
| Heat-curable composite adhesive sheet and method for making Grant 4,091,157 - Hori , et al. May 23, 1 | 1978-05-23 |
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