Sunachi; Naoya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sunachi; Naoya.The latest application filed is for "electronic part mounting substrate and method for producing same".
- Sunachi; Naoya - Akita JP
- Sunachi; Naoya - Nagano JP
- Sunachi; Naoya - Tokyo JP
| Patent | Date |
|---|---|
| Electronic Part Mounting Substrate And Method For Producing Same App 20200083062 - Sunachi; Naoya ; et al. | 2020-03-12 |
| Electronic part mounting substrate and method for producing same Grant 10,510,557 - Sunachi , et al. Dec | 2019-12-17 |
| Method of attaching an electronic part to a copper plate having a surface roughness Grant 9,831,157 - Sunachi , et al. November 28, 2 | 2017-11-28 |
| Electronic Part Mounting Substrate And Method For Producing Same App 20160211195 - Sunachi; Naoya ; et al. | 2016-07-21 |
| Electronic Part Mounting Substrate And Method For Producing Same App 20140147695 - Sunachi; Naoya ; et al. | 2014-05-29 |
| Notched compound semiconductor wafer Grant 7,256,478 - Toba , et al. August 14, 2 | 2007-08-14 |
| Notched compound semiconductor wafer Grant 7,256,477 - Toba , et al. August 14, 2 | 2007-08-14 |
| Notched compound semiconductor wafer Grant 7,256,476 - Toba , et al. August 14, 2 | 2007-08-14 |
| Semiconductor light-emitting element and manufacturing method thereof Grant 7,211,834 - Sunachi , et al. May 1, 2 | 2007-05-01 |
| Notched compound semiconductor wafer App 20060113559 - Toba; Ryuichi ; et al. | 2006-06-01 |
| Notched compound semiconductor wafer App 20060113558 - Toba; Ryuichi ; et al. | 2006-06-01 |
| Notched compound semiconductor wafer App 20060060883 - Toba; Ryuichi ; et al. | 2006-03-23 |
| Notched compound semiconductor wafer Grant 6,998,700 - Toba , et al. February 14, 2 | 2006-02-14 |
| Semiconductor light-emitting element and manufacturing method thereof App 20060011934 - Sunachi; Naoya ; et al. | 2006-01-19 |
| Notched compound semiconductor wafer App 20040242001 - Toba, Ryuichi ; et al. | 2004-12-02 |
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