Sun; Young-Kyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sun; Young-Kyun.The latest application filed is for "in-line apparatus and method for manufacturing double-sided stacked multi-chip packages".

Company Profile

0.4.7

Sun; Young-Kyun - Cheonan-si KR
Sun; Young-Kyun - Chungcheongnam-do KR
Sun, Young-Kyun - Cheonan-city KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wire bonding apparatus and method for clamping a wire Grant 7,481,351 - Kim , et al. January 27, 2	2009-01-27
In-line apparatus and method for manufacturing double-sided stacked multi-chip packages App 20070170569 - Kim; Tae-Hyun ; et al.	2007-07-26
In-line apparatus and method for manufacturing double-sided stacked multi-chip packages Grant 7,215,008 - Kim , et al. May 8, 2	2007-05-08
In-line die attaching and curing apparatus for a multi-chip package Grant 7,074,646 - Kim , et al. July 11, 2	2006-07-11
Wire bonding apparatus and method for clamping a wire App 20050133563 - Kim, Tae-Hyun ; et al.	2005-06-23
In-line die attaching and curing apparatus for a multi-chip package App 20050106778 - Kim, Hyun-Ho ; et al.	2005-05-19
In-line die attaching and curing apparatus for a multi-chip package Grant 6,863,109 - Kim , et al. March 8, 2	2005-03-08
System and method for testing semiconductor devices App 20050012498 - Lee, Soo-Chan ; et al.	2005-01-20
In-line apparatus and method for manufacturing double-sided stacked multi-chip packages App 20050006743 - Kim, Tae-Hyun ; et al.	2005-01-13
Article storage and retrieval arrangement and method App 20040260423 - Lee, Sung-Yeol ; et al.	2004-12-23
In-line die attaching and curing apparatus for a multi-chip package App 20040108582 - Kim, Hyun-Ho ; et al.	2004-06-10

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