loadpatents
Patent applications and USPTO patent grants for Sun; Yong-Kyun.The latest application filed is for "dipping detecting device for fabricating a semiconductor device".
Patent | Date |
---|---|
Equipment and method for cutting package Grant 8,132,305 - Choi , et al. March 13, 2 | 2012-03-13 |
Die attaching apparatus Grant 7,650,687 - Woo , et al. January 26, 2 | 2010-01-26 |
System for testing memory modules using a rotating-type module mounting portion Grant 7,602,171 - Choi , et al. October 13, 2 | 2009-10-13 |
Dipping Detecting Device For Fabricating A Semiconductor Device App 20080090311 - ROH; Dong-joo ;   et al. | 2008-04-17 |
Equipment And Method For Cutting Package App 20080056832 - CHOI; Tai-Kew ;   et al. | 2008-03-06 |
Apparatus for testing a semiconductor module App 20070138466 - Lee; Dong-Soo ;   et al. | 2007-06-21 |
System for testing memory modules using a rotating-type module mounting portion App 20070079187 - Choi; Sun ;   et al. | 2007-04-05 |
Multi-chip die bonder and method App 20060266792 - Ko; Youn-Sung ;   et al. | 2006-11-30 |
Sawing and sorting system App 20060056955 - Kim; Yong-Kuk ;   et al. | 2006-03-16 |
Die attaching apparatus, and system and method for cleaning the same App 20060048381 - Woo; Jung-Hwan ;   et al. | 2006-03-09 |
Wafer sawing apparatus having washing solution spray and suction devices for debris removal and heat dissipation Grant 6,105,567 - Sun , et al. August 22, 2 | 2000-08-22 |
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