Sun; Yi-Sheng A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sun; Yi-Sheng A..The latest application filed is for "wafer-level package device with solder bump reinforcement".
- Sun; Yi-Sheng A. - San Jose CA
| Patent | Date |
|---|---|
| Wafer-level package device with solder bump reinforcement Grant 9,425,160 - Alvarado , et al. August 23, 2 | 2016-08-23 |
| Sacrificial pad on semiconductor package device and method Grant 9,397,027 - Chen , et al. July 19, 2 | 2016-07-19 |
| Integrated circuit device having extended under ball metallization Grant 9,093,333 - Xu , et al. July 28, 2 | 2015-07-28 |
| Wafer-level package device having solder bump assemblies that include an inner pillar structure Grant 9,087,732 - Xu , et al. July 21, 2 | 2015-07-21 |
| Wafer-level package device having solder bump assemblies that include an inner pillar structure Grant 8,643,150 - Xu , et al. February 4, 2 | 2014-02-04 |
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