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name:-0.00990891456604
name:-0.0045938491821289
name:-0.0019099712371826
Sun; Shaopeng Patent Filings

Sun; Shaopeng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sun; Shaopeng.The latest application filed is for "method and wet chemical compositions for diffusion barrier formation".

Company Profile
3.5.8
  • Sun; Shaopeng - Orange CT
  • Sun; Shaopeng - Lake Oswego OR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Cobalt filling of interconnects in microelectronics
Grant 11,434,578 - Commander , et al. September 6, 2
2022-09-06
Method and Wet Chemical Compositions for Diffusion Barrier Formation
App 20220259724 - Hurtubise; Richard W. ;   et al.
2022-08-18
Cobalt filling of interconnects
Grant 11,401,618 - Commander , et al. August 2, 2
2022-08-02
Cobalt Chemistry For Smooth Topology
App 20220136123 - Sun; Shaopeng ;   et al.
2022-05-05
Composition and Method for Fabrication of Nickel Interconnects
App 20220064811 - Yakobson; Eric ;   et al.
2022-03-03
Cobalt chemistry for smooth topology
Grant 11,230,778 - Sun , et al. January 25, 2
2022-01-25
Cobalt Filling of Interconnects
App 20210332491 - Commander; John ;   et al.
2021-10-28
Cobalt Filling of Interconnects in Microelectronics
App 20210222314 - Commander; John ;   et al.
2021-07-22
Cobalt Chemistry For Smooth Topology
App 20210180200 - Sun; Shaopeng ;   et al.
2021-06-17
Cobalt filling of interconnects
Grant 11,035,048 - Commander , et al. June 15, 2
2021-06-15
Cobalt filling of interconnects in microelectronics
Grant 10,995,417 - Commander , et al. May 4, 2
2021-05-04
Cobalt Filling of Interconnects in Microelectronics
App 20200040478 - Commander; John ;   et al.
2020-02-06
Cobalt Filling of Interconnects
App 20190010624 - Commander; John ;   et al.
2019-01-10

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