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Patent applications and USPTO patent grants for Sun; Chia-Pin.The latest application filed is for "testing method for testing wafer level chip scale packages".
Patent | Date |
---|---|
Testing method for testing wafer level chip scale packages Grant 10,566,256 - Chen , et al. Feb | 2020-02-18 |
Electronic test apparatus Grant 10,466,299 - Chen , et al. No | 2019-11-05 |
Testing Method For Testing Wafer Level Chip Scale Packages App 20190206750 - CHEN; Kuan-Chung ;   et al. | 2019-07-04 |
Electronic Test Apparatus App 20190204379 - CHEN; Kuan-Chung ;   et al. | 2019-07-04 |
Two-piece spring probe Grant 10,228,391 - Lai , et al. | 2019-03-12 |
Evaporator for a cascade refrigeration system Grant 9,845,979 - Tsai , et al. December 19, 2 | 2017-12-19 |
Cascade refrigeration system Grant 9,845,973 - Tsai , et al. December 19, 2 | 2017-12-19 |
Two-piece Spring Probe App 20170199224 - LAI; Chyi-Lang ;   et al. | 2017-07-13 |
Cascade Refrigeration System App 20170167758 - TSAI; Ying-Chi ;   et al. | 2017-06-15 |
Evaporator For A Cascade Refrigeration System App 20170167765 - TSAI; Ying-Chi ;   et al. | 2017-06-15 |
Electronic Test Equipment App 20170146568 - LIU; Jun-Xian ;   et al. | 2017-05-25 |
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