Sun; Byung-Kook

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sun; Byung-Kook.The latest application filed is for "method of fabricating printed circuit board".

Company Profile

0.5.10

Sun; Byung-Kook - Seoul KR
Sun, Byung-Kook - Daejeon-si KR
Sun; Byung Kook - Taejeon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of producing printed circuit board with embedded resistor Grant 7,284,317 - Cho , et al. October 23, 2	2007-10-23
Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same Grant 7,279,412 - Mok , et al. October 9, 2	2007-10-09
Method of manufacturing package substrate with fine circuit pattern using anodic oxidation Grant 7,169,707 - Maeng , et al. January 30, 2	2007-01-30
Method of fabricating printed circuit board App 20060172533 - Sun; Byung Kook ; et al.	2006-08-03
Method of fabricating high density printed circuit board App 20060102383 - Cha; Hye Yeon ; et al.	2006-05-18
Method of fabricating package substrate using electroless nickel plating App 20060060558 - Maeng; Duck Young ; et al.	2006-03-23
Method of manufacturing package substrate with fine circuit pattern using anodic oxidation App 20060046485 - Maeng; Duck Young ; et al.	2006-03-02
Method of fabricating PCB in parallel manner App 20060029726 - Mok; Jee-Soo ; et al.	2006-02-09
Double-sided printed circuit board without via holes and method of fabricating the same App 20050284657 - Ryu, Chang-Sup ; et al.	2005-12-29
Method of producing printed circuit board with embedded resistor App 20050175385 - Cho, Suk-Hyun ; et al.	2005-08-11
Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same App 20050085065 - Mok, Jee-Soo ; et al.	2005-04-21
Method of fabricating multi-layered printed circuit board App 20040194303 - Kim, Eung-Soo ; et al.	2004-10-07
Double-sided printed circuit board without via holes and method of fabricating the same App 20040124003 - Ryu, Chang-Sup ; et al.	2004-07-01
Method for manufacturing build-up multi-layer printed circuit board by using yag laser Grant 6,405,431 - Shin , et al. June 18, 2	2002-06-18
Method for manufacturing multi-layer printed circuit board Grant 6,119,335 - Park , et al. September 19, 2	2000-09-19

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.