Sun; Bingxi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sun; Bingxi.The latest application filed is for "method of cleaning a surface of a material layer".

Company Profile

0.8.3

Sun; Bingxi - Sunnyvale CA
Sun, Bingxi - Stanford CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated deposition process for copper metallization Grant 6,881,673 - Ding , et al. April 19, 2	2005-04-19
Method of cleaning a surface of a material layer App 20040168705 - Sun, Bingxi ; et al.	2004-09-02
Method of cleaning a surface of a material layer App 20040018715 - Sun, Bingxi ; et al.	2004-01-29
Integrated deposition process for copper metallization App 20030194863 - Ding, Peijun ; et al.	2003-10-16
Integrated deposition process for copper metallization Grant 6,566,259 - Ding , et al. May 20, 2	2003-05-20
Copper alloy seed layer for copper metallization Grant 6,387,805 - Ding , et al. May 14, 2	2002-05-14
Ionized metal plasma Ta, TaNx, W, and WNx liners for gate electrode applications Grant 6,313,033 - Chiang , et al. November 6, 2	2001-11-06
Integrated deposition process for copper metallization Grant 6,174,811 - Ding , et al. January 16, 2	2001-01-16
Copper alloy via structure Grant 6,160,315 - Chiang , et al. December 12, 2	2000-12-12
Copper alloy seed layer for copper metallization in an integrated circuit Grant 6,066,892 - Ding , et al. May 23, 2	2000-05-23
Sputter deposition and annealing of copper alloy metallization Grant 6,037,257 - Chiang , et al. March 14, 2	2000-03-14

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