| Patent | Date |
|---|
Ink jettable silver/silver chloride compositions
Grant 9,255,208 - Dorfman , et al. February 9, 2 | 2016-02-09 |
Photonic Sintering Of Polymer Thick Film Copper Conductor Compositions
App 20160035455 - Summers; John D. | 2016-02-04 |
Conductive metal composition
Grant 9,245,665 - Hui , et al. January 26, 2 | 2016-01-26 |
Photonic sintering of polymer thick film copper conductor compositions
Grant 9,190,188 - Summers November 17, 2 | 2015-11-17 |
Thermally Conductive Electronic Substrates And Methods Relating Thereto
App 20150228374 - ADAMS; KERRY JOHN ; et al. | 2015-08-13 |
Photonic Sintering Of Polymer Thick Film Copper Conductor Compositions
App 20140367619 - SUMMERS; JOHN D. | 2014-12-18 |
Conductive Metal Composition
App 20140170334 - HUI; DAVE ; et al. | 2014-06-19 |
Conductive Paste For Fine-line High-aspect-ratio Screen Printing In The Manufacture Of Semiconductor Devices
App 20130180583 - BORLAND; WILLIAM J. ; et al. | 2013-07-18 |
Screen-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazoles
Grant 8,357,753 - Summers , et al. January 22, 2 | 2013-01-22 |
Screen-printable encapsulants based on soluble polybenzoxazoles
Grant 8,270,145 - Dueber , et al. September 18, 2 | 2012-09-18 |
Composite organic encapsulants
Grant 8,233,261 - Summers , et al. July 31, 2 | 2012-07-31 |
Composition of polyimide and sterically-hindered hydrophobic epoxy
Grant 7,745,516 - Dueber , et al. June 29, 2 | 2010-06-29 |
Crystalline Encapsulants
App 20100085680 - Summers; John D. | 2010-04-08 |
Composite Organic Encapsulants
App 20100067168 - Summers; John D. ; et al. | 2010-03-18 |
Resistor compositions for electronic circuitry applications
Grant 7,604,754 - Summers October 20, 2 | 2009-10-20 |
Screen-printable Encapsulants Based On Soluble Polybenzoxazoles
App 20090141425 - Dueber; Thomas Eugene ; et al. | 2009-06-04 |
Scree-printable Encapsulants Based On Polyhydroxyamides That Thermally Convert To Polybenzoxazoles
App 20090023858 - SUMMERS; JOHN D. ; et al. | 2009-01-22 |
Resistor compositions for electronic circuitry applications
App 20080185561 - Summers; John D. | 2008-08-07 |
Compositions for electronic circuitry applications and methods relating thereto
App 20080185361 - Summers; John D. | 2008-08-07 |
Methods for creating electronic circuitry comprising phenolic epoxy binder compositions
App 20080118633 - Chen; Cheng-Chung ; et al. | 2008-05-22 |
Polyimide compositions having resistance to water sorption, and methods relating thereto
Grant 7,348,373 - Dueber , et al. March 25, 2 | 2008-03-25 |
Hydrophobic compositions for electronic applications
App 20070290379 - Dueber; Thomas E. ; et al. | 2007-12-20 |
Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components
App 20070291440 - Dueber; Thomas E. ; et al. | 2007-12-20 |
Hydrophobic crosslinkable compositions for electronic applications
App 20070244267 - Dueber; Thomas E. ; et al. | 2007-10-18 |
Organic encapsulant compositions for protection of electronic components
App 20070236859 - Borland; William J. ; et al. | 2007-10-11 |
Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto
App 20070083017 - Dueber; Thomas E. ; et al. | 2007-04-12 |
Photosensitive polyimide compositions
App 20070083016 - Dueber; Thomas E. ; et al. | 2007-04-12 |
Compositions with polymers for advanced materials
App 20050154105 - Summers, John D. ; et al. | 2005-07-14 |
Polyimide compositions having resistance to water sorption, and methods relating thereto
App 20050154181 - Dueber, Thomas E. ; et al. | 2005-07-14 |
Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
Grant 6,908,685 - Uhara , et al. June 21, 2 | 2005-06-21 |
Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
App 20040010113 - Uhara, Kenji ; et al. | 2004-01-15 |
Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
Grant 6,476,177 - Auman , et al. November 5, 2 | 2002-11-05 |
Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
App 20020128424 - Auman, Brian C. ; et al. | 2002-09-12 |
NLO dye compositions and use thereof in producing NLO elements
Grant 5,622,654 - Summers , et al. April 22, 1 | 1997-04-22 |
NLO dye compositions and use thereof in producing NLO elements
Grant 5,534,201 - Summers , et al. July 9, 1 | 1996-07-09 |
Polyimide copolymer film for lift-off metallization
Grant 5,426,071 - Summers June 20, 1 | 1995-06-20 |
Wet-etchable random polyimide copolymer for multichip module applications
Grant 5,393,864 - Summers February 28, 1 | 1995-02-28 |
Polyimide copolymer precursors
Grant 5,202,412 - Auman , et al. April 13, 1 | 1993-04-13 |
Novel alicyclic polyimide gas separation membranes
Grant 4,988,371 - Jeanes , et al. January 29, 1 | 1991-01-29 |
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