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Patent applications and USPTO patent grants for Sumitomo Metal (SMI) Electronics Devices, Inc..The latest application filed is for "package for high frequency usages and its manufacturing method".
Patent | Date |
---|---|
Package for high frequency usages and its manufacturing method Grant 7,632,716 - Muraki , et al. December 15, 2 | 2009-12-15 |
Package For High Frequency Usages And Its Manufacturing Method App 20060193116 - Osakada; Akiyoshi ;   et al. | 2006-08-31 |
Plastic packaging with high heat dissipation and method for the same Grant 7,023,084 - Tomabechi , et al. April 4, 2 | 2006-04-04 |
Plastic packaging with high heat dissipation and method for the same App 20050221537 - Tomabechi, Shigehisa ;   et al. | 2005-10-06 |
Radiation type BGA package and production method therefor Grant 6,861,747 - Miyazaki , et al. March 1, 2 | 2005-03-01 |
Connected construction of a high-frequency package and a wiring board Grant 6,781,488 - Tsukiyama , et al. August 24, 2 | 2004-08-24 |
Chip package and method for manufacturing the same Grant 6,620,650 - Nakata , et al. September 16, 2 | 2003-09-16 |
Method of fabricating multilayer ceramic substrate App 20030100146 - Nakano, Satoshi ;   et al. | 2003-05-29 |
Chip package and method for manufacturing the same Grant 6,495,394 - Nakata , et al. December 17, 2 | 2002-12-17 |
High-frequency ceramic package App 20020051353 - Osakada, Akiyoshi | 2002-05-02 |
Semiconductor packaging metal lid Grant 6,306,526 - Yamamoto , et al. October 23, 2 | 2001-10-23 |
Method of forming connector structure for a ball-grid array Grant 6,199,273 - Kubo , et al. March 13, 2 | 2001-03-13 |
Semiconductor package with improved moisture vapor relief function and method of fabricating the same Grant 6,054,755 - Takamichi , et al. | 2000-04-25 |
Semiconductor package and semiconductor device Grant 5,912,505 - Itoh , et al. June 15, 1 | 1999-06-15 |
Method of producing a ceramic circuit substrate Grant 5,855,711 - Araki , et al. January 5, 1 | 1999-01-05 |
Process for producing a multilayer ceramic circuit substrate Grant 5,729,893 - Tanifuji , et al. March 24, 1 | 1998-03-24 |
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