Sumitomo Metal (SMI) Electronics Devices, Inc.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sumitomo Metal (SMI) Electronics Devices, Inc..The latest application filed is for "package for high frequency usages and its manufacturing method".

Company Profile

0.12.4

Sumitomo Metal (SMI) Electronics Devices, Inc. - SMI
Sumitomo Metal (SMI) Electronics Devices Inc. - Mine-Shi JP
SUMITOMO METAL (SMI) ELECTRONICS DEVICES INC. -

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package for high frequency usages and its manufacturing method Grant 7,632,716 - Muraki , et al. December 15, 2	2009-12-15
Package For High Frequency Usages And Its Manufacturing Method App 20060193116 - Osakada; Akiyoshi ; et al.	2006-08-31
Plastic packaging with high heat dissipation and method for the same Grant 7,023,084 - Tomabechi , et al. April 4, 2	2006-04-04
Plastic packaging with high heat dissipation and method for the same App 20050221537 - Tomabechi, Shigehisa ; et al.	2005-10-06
Radiation type BGA package and production method therefor Grant 6,861,747 - Miyazaki , et al. March 1, 2	2005-03-01
Connected construction of a high-frequency package and a wiring board Grant 6,781,488 - Tsukiyama , et al. August 24, 2	2004-08-24
Chip package and method for manufacturing the same Grant 6,620,650 - Nakata , et al. September 16, 2	2003-09-16
Method of fabricating multilayer ceramic substrate App 20030100146 - Nakano, Satoshi ; et al.	2003-05-29
Chip package and method for manufacturing the same Grant 6,495,394 - Nakata , et al. December 17, 2	2002-12-17
High-frequency ceramic package App 20020051353 - Osakada, Akiyoshi	2002-05-02
Semiconductor packaging metal lid Grant 6,306,526 - Yamamoto , et al. October 23, 2	2001-10-23
Method of forming connector structure for a ball-grid array Grant 6,199,273 - Kubo , et al. March 13, 2	2001-03-13
Semiconductor package with improved moisture vapor relief function and method of fabricating the same Grant 6,054,755 - Takamichi , et al.	2000-04-25
Semiconductor package and semiconductor device Grant 5,912,505 - Itoh , et al. June 15, 1	1999-06-15
Method of producing a ceramic circuit substrate Grant 5,855,711 - Araki , et al. January 5, 1	1999-01-05
Process for producing a multilayer ceramic circuit substrate Grant 5,729,893 - Tanifuji , et al. March 24, 1	1998-03-24

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