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Patent applications and USPTO patent grants for Sumita; Masayuki.The latest application filed is for "apparatus for manufacturing laminated electrode body".
Patent | Date |
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Cutting device Grant 11,090,827 - Yamamoto , et al. August 17, 2 | 2021-08-17 |
Conveying device Grant 10,991,968 - Kamigawa , et al. April 27, 2 | 2021-04-27 |
Apparatus For Manufacturing Laminated Electrode Body App 20200373606 - Kamigawa; Hideyasu ;   et al. | 2020-11-26 |
Cutting Device App 20200156276 - Yamamoto; Takeshi ;   et al. | 2020-05-21 |
Conveying Device App 20200161693 - Kamigawa; HIDEYASU ;   et al. | 2020-05-21 |
Manufacturing Device For Electrode Assembly App 20200152944 - Sumita; MASAYUKI ;   et al. | 2020-05-14 |
Electrode Pressure-bonding Device App 20200153027 - SUMITA; MASAYUKI ;   et al. | 2020-05-14 |
Positioning stage, bump forming apparatus equipped with the positioning stage, and bump forming method performed using the positioning stage Grant 7,508,495 - Adachi , et al. March 24, 2 | 2009-03-24 |
Positioning Stage, Bump Forming Apparatus Equipped With The Positioning Stage, And Bump Forming Method Performed Using The Positioning Stage App 20080068581 - Adachi; Naoya ;   et al. | 2008-03-20 |
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