SUMITA; Kazuaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for SUMITA; Kazuaki.The latest application filed is for "method for producing power module, and power module".

Company Profile

7.24.54

SUMITA; Kazuaki - Annaka-shi JP
Sumita; Kazuaki - Annaka JP
Sumita; Kazuaki - Gunma-ken JP
Sumita; Kazuaki - Usui-gun JP
Sumita, Kazuaki - Gurma-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Producing Power Module, And Power Module App 20220068667 - KUSHIHARA; Naoyuki ; et al.	2022-03-03
Thermally conductive resin sheet having light transmission and method for producing the same Grant 11,104,099 - Takamatsu , et al. August 31, 2	2021-08-31
Anisotropic Heat-conductive Composite Silicone Rubber Sheet And Method For Producing The Same App 20210170733 - TAKAMATSU; Yoshinori ; et al.	2021-06-10
Heat-curable resin composition, heat-curable resin film and semiconductor device Grant 10,865,304 - Kushihara , et al. December 15, 2	2020-12-15
Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device Grant 10,850,482 - Ichioka , et al. December 1, 2	2020-12-01
Heat-curable resin composition Grant 10,829,589 - Kushihara , et al. November 10, 2	2020-11-10
Anisotropic Heat-conductive Sheet Having Self-adhesiveness App 20200332064 - TAKAMATSU; Yoshinori ; et al.	2020-10-22
Thermosetting epoxy resin sheet for encapsulating semiconductor, semiconductor equipment, and method for manufacturing the same Grant 10,808,102 - Tsutsumi , et al. October 20, 2	2020-10-20
Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device Grant 10,730,273 - Ichioka , et al.	2020-08-04
Heat-curable Resin Composition, Heat-curable Resin Film And Semiconductor Device App 20200079954 - KUSHIHARA; Naoyuki ; et al.	2020-03-12
Heat-curable Resin Composition App 20190330414 - Kushihara; Naoyuki ; et al.	2019-10-31
Heat-curable resin composition for semiconductor encapsulation Grant 10,407,536 - Sumita , et al. Sept	2019-09-10
Heat-curable resin composition for semiconductor encapsulation Grant 10,385,203 - Sumita , et al. A	2019-08-20
Thermosetting Epoxy Resin Sheet For Encapsulating Semiconductor, Semiconductor Apparatus, And Method For Manufacturing Same App 20190241696 - TSUTSUMI; Yoshihiro ; et al.	2019-08-08
Anisotropic Heat- Conductive Composite Silicone Rubber Sheet And Method For Producing The Same App 20190217585 - TAKAMATSU; Yoshinori ; et al.	2019-07-18
Thermally Conductive Resin Sheet Having Light Transmission And Method For Producing The Same App 20190099980 - TAKAMATSU; Yoshinori ; et al.	2019-04-04
Resin Composition, Resin Film, Semiconductor Laminate, Method For Manufacturing Semiconductor Laminate, And Method For Manufacturing Semiconductor Device App 20190070837 - ICHIOKA; Yoichiro ; et al.	2019-03-07
Resin Composition, Resin Film, Semiconductor Laminate, Method For Manufacturing Semiconductor Laminate, And Method For Manufacturing Semiconductor Device App 20190070836 - ICHIOKA; Yoichiro ; et al.	2019-03-07
Thermosetting Epoxy Resin Sheet For Encapsulating Semiconductor, Semiconductor Equipment, And Method For Manufacturing The Same App 20190055377 - TSUTSUMI; Yoshihiro ; et al.	2019-02-21
Epoxy Resin Composition And Semiconductor Device App 20180327542 - KUSHIHARA; Naoyuki ; et al.	2018-11-15
Method For Manufacturing Semiconductor Apparatus App 20180247834 - TSUDA; Koichi ; et al.	2018-08-30
Heat-curable Resin Composition For Semiconductor Encapsulation App 20180186925 - SUMITA; Kazuaki ; et al.	2018-07-05
Method for encapsulating large-area semiconductor element-mounted base material Grant 9,972,507 - Kushihara , et al. May 15, 2	2018-05-15
Liquid Epoxy Resin Composition App 20180112072 - KUSHIHARA; Naoyuki ; et al.	2018-04-26
Heat-curable Epoxy Resin Composition App 20180066101 - KUSHIHARA; Naoyuki ; et al.	2018-03-08
Heat-curable Resin Composition For Semiconductor Encapsulation App 20180057663 - SUMITA; Kazuaki ; et al.	2018-03-01
Epoxy Resin Composition App 20170362428 - KUSHIHARA; Naoyuki ; et al.	2017-12-21
Method For Encapsulating Large-area Semiconductor Element-mounted Base Material App 20170316956 - KUSHIHARA; Naoyuki ; et al.	2017-11-02
Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device Grant 9,711,378 - Sumita , et al. July 18, 2	2017-07-18
Liquid Epoxy Resin Composition App 20170174879 - KUSHIHARA; Naoyuki ; et al.	2017-06-22
Heat-curable Resin Composition App 20170058102 - KUSHIHARA; Naoyuki ; et al.	2017-03-02
Heat-curable Epoxy Resin Composition App 20170037238 - KUSHIHARA; Naoyuki ; et al.	2017-02-09
Heat-curable Resin Composition For Semiconductor Encapsulation App 20170009007 - SUMITA; Kazuaki ; et al.	2017-01-12
Liquid Resin Composition App 20160340470 - KUSHIHARA; Naoyuki ; et al.	2016-11-24
Liquid Epoxy Resin Composition For Semiconductor Sealing And Resin-sealed Semiconductor Device App 20160314992 - SUMITA; Kazuaki ; et al.	2016-10-27
Heat-curable resin composition Grant 9,382,421 - Kushihara , et al. July 5, 2	2016-07-05
Liquid Underfill Material Composition For Sealing Semiconductor And Flip-chip Semiconductor Device App 20160186024 - SUMITA; Kazuaki ; et al.	2016-06-30
Resin Composition For Semiconductor Encapsulation And Semiconductor Encapsulation Method Using Same App 20160152821 - KUSHIHARA; Naoyuki ; et al.	2016-06-02
Liquid Epoxy Resin Composition And Adhesive Agent For Heatsink And Stiffener App 20160040048 - SUMITA; Kazuaki	2016-02-11
Heat-curable Resin Composition App 20150353731 - KUSHIHARA; Naoyuki ; et al.	2015-12-10
Set of resin compositions for preparing system-in-package type semiconductor device Grant 9,018,281 - Sumita , et al. April 28, 2	2015-04-28
Dam composition for use with multilayer semiconductor package underfill material, and fabrication of multilayer semiconductor package using the same Grant 8,828,806 - Sumita September 9, 2	2014-09-09
Liquid Epoxy Resin Composition And Semiconductor Device App 20130197129 - AKIBA; Hideki ; et al.	2013-08-01
Thermosetting Resin Composition For Semiconductor Encapsulation And Encapsulated Semiconductor Device App 20130181361 - UEHARA; Tatsuya ; et al.	2013-07-18
Semiconductor-encapsulating Liquid Epoxy Resin Composition And Semiconductor Device App 20120184646 - SUMITA; Kazuaki ; et al.	2012-07-19
Set Of Resin Compositions For Preparing System-in-package Type Semiconductor Device App 20120074596 - Sumita; Kazuaki ; et al.	2012-03-29
Dam Composition For Use With Multilayer Semiconductor Package Underfill Material, And Fabrication Of Multilayer Semiconductor Package Using The Same App 20100304536 - SUMITA; Kazuaki	2010-12-02
Liquid Epoxy Resin Composition App 20100016474 - ASANO; Masatoshi ; et al.	2010-01-21
Liquid Epoxy Resin Composition App 20100001415 - Asano; Masatoshi ; et al.	2010-01-07
Liquid epoxy resin composition Grant 7,642,661 - Asano , et al. January 5, 2	2010-01-05
Liquid epoxy resin composition and flip chip semiconductor device App 20090184431 - Sumita; Kazuaki ; et al.	2009-07-23
Set of resin compositions for preparing system-in-package type semiconductor device App 20080070054 - Sumita; Kazuaki ; et al.	2008-03-20
Process for producing flip-chip type semiconductor device and semiconductor device produced by the process App 20070134844 - Katoh; Kaoru ; et al.	2007-06-14
Liquid epoxy resin composition App 20070116962 - Asano; Masatoshi ; et al.	2007-05-24
Liquid epoxy resin composition App 20070104959 - Asano; Masatoshi ; et al.	2007-05-10
Liquid epoxy resin composition App 20070104960 - Asano; Masatoshi ; et al.	2007-05-10
Liquid epoxy resin composition and semiconductor device Grant 7,169,833 - Sumita , et al. January 30, 2	2007-01-30
Liquid epoxy resin composition and semiconductor device App 20060204762 - Sumita; Kazuaki ; et al.	2006-09-14
Liquid epoxy resin composition and semiconductor device Grant 7,094,844 - Sumita , et al. August 22, 2	2006-08-22
Liquid epoxy resin composition and semiconductor device Grant 7,067,930 - Sumita , et al. June 27, 2	2006-06-27
Liquid epoxy resin composition and semiconductor device App 20050152773 - Sumita, Kazuaki ; et al.	2005-07-14
Liquid epoxy resin composition and flip chip semiconductor device App 20040227255 - Sumita, Kazuaki ; et al.	2004-11-18
Liquid epoxy resin composition and semiconductor device App 20040192810 - Sumita, Kazuaki ; et al.	2004-09-30
Liquid epoxy resin composition and semiconductor device Grant 6,780,674 - Sumita , et al. August 24, 2	2004-08-24
Liquid epoxy resin composition and semiconductor device Grant 6,733,902 - Sumita , et al. May 11, 2	2004-05-11
Liquid epoxy resin composition and semiconductor device App 20040054061 - Sumita, Kazuaki ; et al.	2004-03-18
Liquid epoxy resin composition and semiconductor device App 20040014843 - Sumita, Kazuaki ; et al.	2004-01-22
Liquid epoxy resin composition and semiconductor device App 20030155664 - Sumita, Kazuaki ; et al.	2003-08-21
Liquid epoxy resin composition and semiconductor device App 20030069349 - Sumita, Kazuaki ; et al.	2003-04-10
Liquid epoxy resin composition and semiconductor device App 20020089071 - Sumita, Kazuaki ; et al.	2002-07-11
Liquid epoxy resin composition and semiconductor device App 20020077421 - Sumita, Kazuaki ; et al.	2002-06-20
Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device Grant 6,376,923 - Sumita , et al. April 23, 2	2002-04-23
Liquid epoxy resin composition and semiconductor device App 20020045709 - Sumita, Kazuaki ; et al.	2002-04-18
Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith App 20010034382 - Sumita, Kazuaki ; et al.	2001-10-25
Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device Grant 6,294,271 - Sumita , et al. September 25, 2	2001-09-25
Flip-chip type semiconductor device Grant 6,225,704 - Sumita , et al. May 1, 2	2001-05-01

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.