Sullivan; Timothy Dooling

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sullivan; Timothy Dooling.The latest application filed is for "structures and methds for monitoring dielectric reliability with through-silicon vias".

Company Profile

0.21.18

Sullivan; Timothy Dooling - Underhill VT
Sullivan; Timothy Dooling - Williston VT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structures and methods for monitoring dielectric reliability with through-silicon vias Grant 9,404,953 - Chen , et al. August 2, 2	2016-08-02
Wafer edge conditioning for thinned wafers Grant 9,105,465 - Daubenspeck , et al. August 11, 2	2015-08-11
Structures and Methds for Monitoring Dielectric Reliability With Through-Silicon Vias App 20150115982 - Chen; Fen ; et al.	2015-04-30
Method of changing reflectance or resistance of a region in an optoelectronic memory device Grant 8,945,955 - Chen , et al. February 3, 2	2015-02-03
Ball-limiting-metallurgy layers in solder ball structures Grant 8,592,976 - Arvin , et al. November 26, 2	2013-11-26
Method Of Changing Reflectance Or Resistance Of A Region In An Optoelectronic Memory Device App 20130258765 - Chen; Fen ; et al.	2013-10-03
Ball-limiting-metallurgy Layers In Solder Ball Structures App 20130008699 - Arvin; Charles L. ; et al.	2013-01-10
Optoelectronic Memory Devices App 20120287707 - Chen; Fen ; et al.	2012-11-15
Ball-limiting-metallurgy layers in solder ball structures Grant 8,299,611 - Arvin , et al. October 30, 2	2012-10-30
Optoelectronic memory devices Grant 8,288,747 - Chen , et al. October 16, 2	2012-10-16
Enhanced electromigration resistance in TSV structure and design Grant 8,288,270 - Farooq , et al. October 16, 2	2012-10-16
Wafer Edge Conditioning For Thinned Wafers App 20120241916 - Daubenspeck; Timothy Harrison ; et al.	2012-09-27
Enhanced Electromigration Resistance In Tsv Structure And Design App 20120199975 - Farooq; Mukta G. ; et al.	2012-08-09
Enhanced Electromigration Resistance In Tsv Structure And Design App 20120199983 - Farooq; Mukta G. ; et al.	2012-08-09
Enhanced electromigration resistance in TSV structure and design Grant 8,237,288 - Farooq , et al. August 7, 2	2012-08-07
Optically transparent wires for secure circuits and methods of making same Grant 8,207,609 - Ayotte , et al. June 26, 2	2012-06-26
Structure for charge dissipation during fabrication of integrated circuits and isolation thereof Grant 8,110,875 - Ellis-Monaghan , et al. February 7, 2	2012-02-07
Optically Transparent Wires For Secure Circuits And Methods Of Making Same App 20110284280 - Ayotte; Stephen Peter ; et al.	2011-11-24
Optically transparent wires for secure circuits and methods of making same Grant 8,017,514 - Ayotte , et al. September 13, 2	2011-09-13
Structures including integrated circuits for reducing electromigration effect Grant 7,861,204 - Stamper , et al. December 28, 2	2010-12-28
Thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature Grant 7,843,062 - Chen , et al. November 30, 2	2010-11-30
Optoelectronic Memory Devices App 20100290264 - Chen; Fen ; et al.	2010-11-18
Ball-limiting-metallurgy Layers In Solder Ball Structures App 20100258940 - Arvin; Charles L. ; et al.	2010-10-14
Through-wafer vias Grant 7,741,722 - Andry , et al. June 22, 2	2010-06-22
Thermally Programmable Anti-reverse Engineering Interconnects And Methods Of Fabricating Same App 20100133691 - Chen; Fen ; et al.	2010-06-03
Method of making thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature Grant 7,709,401 - Chen , et al. May 4, 2	2010-05-04
Integration circuits for reducing electromigration effect Grant 7,667,328 - Stamper , et al. February 23, 2	2010-02-23
Optically Transparent Wires For Secure Circuits And Methods Of Making Same App 20090273084 - Ayotte; Stephen Peter ; et al.	2009-11-05
Thermally Programmable Anti-reverse Engineering Interconnects And Methods Of Fabricating Same App 20090212431 - Chen; Fen ; et al.	2009-08-27
Design Structures Including Integrated Circuits For Reducing Electromigration Effect App 20090164964 - Stamper; Anthony Kendall ; et al.	2009-06-25
Through-wafer Vias App 20080274583 - Andry; Paul Stephen ; et al.	2008-11-06
Structure For Charge Dissipation During Fabrication Of Integrated Circuits And Isolation Thereof App 20080265422 - Ellis-Monaghan; John Joseph ; et al.	2008-10-30
Integration Circuits For Reducing Electromigration Effect App 20080203495 - Stamper; Anthony Kendall ; et al.	2008-08-28
Method And Structure For Charge Dissipation During Fabrication Of Integrated Circuits And Isolation Thereof App 20070013072 - Ellis-Monaghan; John Joseph ; et al.	2007-01-18
Impedance control using fuses Grant 6,243,283 - Bertin , et al. June 5, 2	2001-06-05
Impedance control using fuses Grant 6,141,245 - Bertin , et al. October 31, 2	2000-10-31
Process for depositing a conductive thin film upon an integrated circuit substrate Grant 5,711,858 - Kontra , et al. January 27, 1	1998-01-27

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