Sullivan; Timothy D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sullivan; Timothy D..The latest application filed is for "centering substrates on a chuck".

Company Profile

3.155.126

Sullivan; Timothy D. - Underhill VT
Sullivan; Timothy D. - Essex Junctin VT
Sullivan; Timothy D. - Franklin Lakes NJ
Sullivan; Timothy D. - Essex Junction VT
Sullivan; Timothy D. - Northampton MA
Sullivan; Timothy D. - South Burlington VT
Sullivan; Timothy D. - Batavia NY
Sullivan; Timothy D. - East Haddam CT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electromigration monitor Grant 10,794,948 - Chen , et al. October 6, 2	2020-10-06
Electromigration monitor Grant 10,677,833 - Chen , et al.	2020-06-09
Solder bump array probe tip structure for laser cleaning Grant 10,571,490 - Audette , et al. Feb	2020-02-25
Chip joining by induction heating Grant 10,245,667 - Ayotte , et al.	2019-04-02
Centering substrates on a chuck Grant 10,224,225 - Adderly , et al.	2019-03-05
Centering Substrates On A Chuck App 20180240694 - Adderly; Shawn A. ; et al.	2018-08-23
Extrusion-resistant solder interconnect structures and methods of forming Grant 10,049,897 - Daubenspeck , et al. August 14, 2	2018-08-14
Centering substrates on a chuck Grant 9,997,385 - Adderly , et al. June 12, 2	2018-06-12
Electromigration Monitor App 20180074110 - Chen; Fen ; et al.	2018-03-15
Electromigration Monitor App 20180074111 - Chen; Fen ; et al.	2018-03-15
Solder Bump Array Probe Tip Structure For Laser Cleaning App 20180059141 - Audette; David M. ; et al.	2018-03-01
Electromigration monitor Grant 9,891,261 - Chen , et al. February 13, 2	2018-02-13
Solder bump array probe tip structure for laser cleaning Grant 9,835,653 - Audette , et al. December 5, 2	2017-12-05
Chip Joining By Induction Heating App 20170312841 - Ayotte; Stephen P. ; et al.	2017-11-02
Chip joining by induction heating Grant 9,776,270 - Ayotte , et al. October 3, 2	2017-10-03
Three-dimensional integrated circuit integration Grant 9,773,726 - Sullivan , et al. September 26, 2	2017-09-26
Centering Substrates On A Chuck App 20170221742 - Adderly; Shawn A. ; et al.	2017-08-03
Handle wafer Grant 9,716,010 - Gambino , et al. July 25, 2	2017-07-25
Apparatus and method for centering substrates on a chuck Grant 9,685,362 - Adderly , et al. June 20, 2	2017-06-20
Extrusion-resistant Solder Interconnect Structures And Methods Of Forming App 20170148754 - Daubenspeck; Timothy H. ; et al.	2017-05-25
Structure to prevent solder extrusion Grant 9,613,921 - Daubenspeck , et al. April 4, 2	2017-04-04
Extrusion-resistant solder interconnect structures and methods of forming Grant 9,607,862 - Daubenspeck , et al. March 28, 2	2017-03-28
Three-dimensional Integrated Circuit Integration Background App 20170077021 - Sullivan; Timothy D. ; et al.	2017-03-16
Programmable electrical fuse in keep out zone Grant 9,536,829 - Farooq , et al. January 3, 2	2017-01-03
Three-dimensional integrated circuit integration Grant 9,515,035 - Sullivan , et al. December 6, 2	2016-12-06
Method and apparatus for detecting foreign material on a chuck Grant 9,508,578 - Adderly , et al. November 29, 2	2016-11-29
Controlled metal extrusion opening in semiconductor structure and method of forming Grant 9,484,301 - Levy , et al. November 1, 2	2016-11-01
IC structure with recessed solder bump area and methods of forming same Grant 9,472,490 - Sullivan , et al. October 18, 2	2016-10-18
Three-Dimensional Integrated Circuit Integration App 20160181215 - Sullivan; Timothy D. ; et al.	2016-06-23
Semiconductor devices with enhanced electromigration performance Grant 9,362,229 - Gambino , et al. June 7, 2	2016-06-07
Preventing misshaped solder balls Grant 9,331,037 - Daubenspeck , et al. May 3, 2	2016-05-03
Integrated circuit structure with metal cap and methods of fabrication Grant 9,318,413 - Chen , et al. April 19, 2	2016-04-19
Integrated circuit structure with through-semiconductor via Grant 9,318,414 - Chen , et al. April 19, 2	2016-04-19
Programmable Electrical Fuse In Keep Out Zone App 20160079166 - Farooq; Mukta G. ; et al.	2016-03-17
Uniform roughness on backside of a wafer Grant 9,275,868 - Adderly , et al. March 1, 2	2016-03-01
Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip Grant 9,269,683 - Daubenspeck , et al. February 23, 2	2016-02-23
Preventing Misshaped Solder Balls App 20160043048 - Daubenspeck; Timothy H. ; et al.	2016-02-11
Semiconductor structures and methods of manufacture Grant 9,230,929 - Daubenspeck , et al. January 5, 2	2016-01-05
Electromigration Monitor App 20150380326 - Chen; Fen ; et al.	2015-12-31
Structure and method to ensure correct operation of an integrated circuit in the presence of ionizing radiation Grant 9,223,037 - Cannon , et al. December 29, 2	2015-12-29
Solder Bump Array Probe Tip Structure For Laser Cleaning App 20150331014 - Audette; David M. ; et al.	2015-11-19
Solder bump reflow by induction heating Grant 9,190,375 - Ayotte , et al. November 17, 2	2015-11-17
Reducing thermal energy transfer during chip-join processing Grant 9,177,931 - Ayotte , et al. November 3, 2	2015-11-03
Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip Grant 9,165,850 - Daubenspeck , et al. October 20, 2	2015-10-20
Dice before grind with backside metal Grant 9,165,831 - Daubenspeck , et al. October 20, 2	2015-10-20
Solder Bump Reflow By Induction Heating App 20150294948 - Ayotte; Stephen P. ; et al.	2015-10-15
Controlled Metal Extrusion Opening In Semiconductor Structure And Method Of Forming App 20150255395 - Levy; Max G. ; et al.	2015-09-10
Reducing Thermal Energy Transfer During Chip-join Processing App 20150243618 - Ayotte; Stephen P. ; et al.	2015-08-27
Apparatus and Method for Centering Substrates on a Chuck App 20150235881 - Adderly; Shawn A. ; et al.	2015-08-20
Method And Apparatus For Detecting Foreign Material On A Chuck App 20150219479 - Adderly; Shawn A. ; et al.	2015-08-06
Semiconductor structures with metal lines Grant 9,087,839 - Adderly , et al. July 21, 2	2015-07-21
Structures and methods for improving solder bump connections in semiconductor devices Grant 9,087,754 - Daubenspeck , et al. July 21, 2	2015-07-21
Controlled metal extrusion opening in semiconductor structure and method of forming Grant 9,059,258 - Levy , et al. June 16, 2	2015-06-16
Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip Grant 9,059,106 - Daubenspeck , et al. June 16, 2	2015-06-16
Structures for improving current carrying capability of interconnects and methods of fabricating the same Grant 9,035,459 - Arvin , et al. May 19, 2	2015-05-19
Handle Wafer App 20150132527 - GAMBINO; Jeffrey P. ; et al.	2015-05-14
On-chip poly-to-contact process monitoring and reliability evaluation system and method of use Grant 9,029,172 - Chen , et al. May 12, 2	2015-05-12
Integrated Circuit Structure With Through-semiconductor Via App 20150115460 - Chen; Fen ; et al.	2015-04-30
Integrated Circuit Structure With Metal Cap And Methods Of Fabrication App 20150115459 - Chen; Fen ; et al.	2015-04-30
Solder interconnect with non-wettable sidewall pillars and methods of manufacture Grant 9,018,760 - Arvin , et al. April 28, 2	2015-04-28
Structure To Prevent Solder Extrusion App 20150108642 - Daubenspeck; Timothy H. ; et al.	2015-04-23
Chip Joining By Induction Heating App 20150089805 - Ayotte; Stephen P. ; et al.	2015-04-02
Preventing Misshaped Solder Balls App 20150048502 - Daubenspeck; Timothy H. ; et al.	2015-02-19
Structures And Methods For Improving Solder Bump Connections In Semiconductor Devices App 20150041977 - DAUBENSPECK; Timothy H. ; et al.	2015-02-12
Compensating For Warpage Of A Flip Chip Package By Varying Heights Of A Redistribution Layer On An Integrated Circuit Chip App 20150044864 - Daubenspeck; Timothy H. ; et al.	2015-02-12
Chip Connection Structure And Method Of Forming App 20150037971 - Arvin; Charles L. ; et al.	2015-02-05
Semiconductor Devices With Enhanced Electromigration Performance App 20150035158 - GAMBINO; Jeffrey P. ; et al.	2015-02-05
Semiconductor Structures And Methods Of Manufacture App 20150021793 - DAUBENSPECK; Timothy H. ; et al.	2015-01-22
Uniform Roughness On Backside Of A Wafer App 20150021743 - ADDERLY; Shawn A. ; et al.	2015-01-22
Thermal via for 3D integrated circuits structures Grant 8,933,540 - Daubenspeck , et al. January 13, 2	2015-01-13
Semiconductor structures and methods of manufacture Grant 8,927,869 - Daubenspeck , et al. January 6, 2	2015-01-06
Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package Grant 8,927,334 - Daubenspeck , et al. January 6, 2	2015-01-06
Dice Before Grind With Backside Metal App 20150001683 - Daubenspeck; Timothy H. ; et al.	2015-01-01
Electromigration resistant via-to-line interconnect Grant 8,922,022 - Li , et al. December 30, 2	2014-12-30
Structures and methods for improving solder bump connections in semiconductor devices Grant 8,916,464 - Daubenspeck , et al. December 23, 2	2014-12-23
Inductors and wiring structures fabricated with limited wiring material Grant 8,900,964 - Ding , et al. December 2, 2	2014-12-02
Method of manufacturing an enhanced electromigration performance hetero-junction bipolar transistor Grant 8,901,738 - Gambino , et al. December 2, 2	2014-12-02
Semiconductor Structures With Metal Lines App 20140291802 - Adderly; Shawn A. ; et al.	2014-10-02
Controlled Metal Extrusion Opening In Semiconductor Structure And Method Of Forming App 20140246777 - Levy; Max G. ; et al.	2014-09-04
Thermal Via For 3d Integrated Circuits Structures App 20140239457 - Daubenspeck; Timothy H. ; et al.	2014-08-28
Structures for improving current carrying capability of interconnects and methods of fabricating the same Grant 8,803,317 - Arvin , et al. August 12, 2	2014-08-12
Integrated Circuit Chip With Pyramid Or Cone-shaped Conductive Pads For Flexible C4 Connections And A Method Of Forming The Integrated Circuit Chip App 20140187034 - Daubenspeck; Timothy H. ; et al.	2014-07-03
Method of fabricating thermally controlled refractory metal resistor Grant 8,765,568 - Lukaitis , et al. July 1, 2	2014-07-01
Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip Grant 8,766,439 - Daubenspeck , et al. July 1, 2	2014-07-01
Semiconductor Devices With Enhanced Electromigration Performance App 20140131878 - Gambino; Jeffrey P. ; et al.	2014-05-15
Compensating For Warpage Of A Flip Chip Package By Varying Heights Of A Redistribution Layer On An Integrated Circuit Chip App 20140117535 - Daubenspeck; Timothy H. ; et al.	2014-05-01
Overcoming Chip Warping To Enhance Wetting Of Solder Bumps And Flip Chip Attaches In A Flip Chip Package App 20140084453 - Daubenspeck; Timothy H. ; et al.	2014-03-27
Structures and methods for improving solder bump connections in semiconductor devices Grant 8,680,675 - Daubenspeck , et al. March 25, 2	2014-03-25
Solder Interconnect With Non-wettable Sidewall Pillars And Methods Of Manufacture App 20140077367 - Arvin; Charles L. ; et al.	2014-03-20
Structures and methods to reduce maximum current density in a solder ball Grant 8,674,506 - Bezama , et al. March 18, 2	2014-03-18
Extrusion-resistant Solder Interconnect Structures And Methods Of Forming App 20140070401 - Daubenspeck; Timothy H. ; et al.	2014-03-13
Solder interconnect pads with current spreading layers Grant 8,669,660 - Daubenspeck , et al. March 11, 2	2014-03-11
Compact thermally controlled thin film resistors utilizing substrate contacts and methods of manufacture Grant 8,652,922 - Lukaitis , et al. February 18, 2	2014-02-18
Array of alpha particle sensors Grant 8,647,909 - Cannon , et al. February 11, 2	2014-02-11
Thermally Controlled Refractory Metal Resistor App 20140038381 - Lukaitis; Joseph M. ; et al.	2014-02-06
Structure And Method To Ensure Correct Operation Of An Integrated Circuit In The Presence Of Ionizing Radiation App 20140032135 - CANNON; ETHAN H. ; et al.	2014-01-30
Solder interconnect with non-wettable sidewall pillars and methods of manufacture Grant 8,637,392 - Arvin , et al. January 28, 2	2014-01-28
Structures and methods for detecting solder wetting of pedestal sidewalls Grant 8,629,557 - Daubenspeck , et al. January 14, 2	2014-01-14
Thermally controlled refractory metal resistor Grant 8,592,947 - Lukaitis , et al. November 26, 2	2013-11-26
Passive Millimeter Wave Imaging System with Environmental Control for Concealed Object Detection App 20130307714 - Williams; Thomas D. ; et al.	2013-11-21
Chip Connection Structure And Method Of Forming App 20130299989 - Arvin; Charles L. ; et al.	2013-11-14
Underfill flow guide structures and method of using same Grant 8,580,673 - Daubenspeck , et al. November 12, 2	2013-11-12
Wiring structure and method of forming the structure Grant 8,569,888 - Chen , et al. October 29, 2	2013-10-29
Semiconductor Structures And Methods Of Manufacture App 20130269974 - DAUBENSPECK; Timothy H. ; et al.	2013-10-17
Self-aligned polymer passivation/aluminum pad Grant 8,546,253 - Daubenspeck , et al. October 1, 2	2013-10-01
Compact thermally controlled thin film resistors utilizing substrate contacts and methods of manufacture Grant 8,541,864 - Lukaitis , et al. September 24, 2	2013-09-24
Self-aligned Polymer Passivation/aluminum Pad App 20130234316 - Daubenspeck; Timothy H. ; et al.	2013-09-12
Structures And Methods To Reduce Maximum Current Density In A Solder Ball App 20130234329 - BEZAMA; Raschid J. ; et al.	2013-09-12
Structures And Methods For Detecting Solder Wetting Of Pedestal Sidewalls App 20130234315 - Daubenspeck; Timothy H. ; et al.	2013-09-12
Buffer pad in solder bump connections and methods of manufacture Grant 8,513,814 - Daubenspeck , et al. August 20, 2	2013-08-20
Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump Grant 8,508,043 - Daubenspeck , et al. August 13, 2	2013-08-13
Inductors And Wiring Structures Fabricated With Limited Wiring Material App 20130200521 - Ding; Hanyi ; et al.	2013-08-08
On-chip Poly-to-contact Process Monitoring And Reliability Evaluation System And Method Of Use App 20130191047 - CHEN; Fen ; et al.	2013-07-25
Thin film resistors and methods of manufacture Grant 8,486,796 - Harmon , et al. July 16, 2	2013-07-16
Micro-electro-mechanical-system temperature sensor Grant 8,480,302 - Gill , et al. July 9, 2	2013-07-09
Structures and methods to reduce maximum current density in a solder ball Grant 8,446,006 - Bezama , et al. May 21, 2	2013-05-21
Metal Pad Structure For Thickness Enhancement Of Polymer Used In Electrical Interconnection Of Semiconductor Die To Semiconductor Chip Package Substrate With Solder Bump App 20130119534 - Daubenspeck; Timothy H. ; et al.	2013-05-16
Underfill Flow Guide Structures And Method Of Using Same App 20130122661 - Daubenspeck; Timothy H. ; et al.	2013-05-16
Solder Interconnect Pads with Current Spreading Layers App 20130105971 - Daubenspeck; Timothy H. ; et al.	2013-05-02
Polymer and solder pillars for connecting chip and carrier Grant 8,426,247 - Daubenspeck , et al. April 23, 2	2013-04-23
Underfill flow guide structures and method of using same Grant 8,409,980 - Daubenspeck , et al. April 2, 2	2013-04-02
IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methods Grant 8,350,383 - Daubenspeck , et al. January 8, 2	2013-01-08
Solder interconnect pads with current spreading layers Grant 8,338,947 - Daubenspeck , et al. December 25, 2	2012-12-25
Compact Thermally Controlled Thin Film Resistors Utilizing Substrate Contacts And Methods Of Manufacture App 20120313215 - LUKAITIS; Joseph M. ; et al.	2012-12-13
Wiring Structure And Method Of Forming The Structure App 20120299188 - Chen; Fen ; et al.	2012-11-29
Buffer Pad In Solder Bump Connections And Methods Of Manufacture App 20120280399 - DAUBENSPECK; Timothy H. ; et al.	2012-11-08
Offset solder vias, methods of manufacturing and design structures Grant 8,298,929 - Daubenspeck , et al. October 30, 2	2012-10-30
Compact thermally controlled thin film resistors utilizing substrate contacts and methods of manufacture Grant 8,298,904 - Lukaitis , et al. October 30, 2	2012-10-30
Metal wiring structures for uniform current density in C4 balls Grant 8,264,078 - Daubenspeck , et al. September 11, 2	2012-09-11
Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure Grant 8,242,012 - Daubenspeck , et al. August 14, 2	2012-08-14
Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate Grant 8,237,279 - Daubenspeck , et al. August 7, 2	2012-08-07
Structures For Improving Current Carrying Capability Of Interconnects And Methods Of Fabricating The Same App 20120187558 - ARVIN; Charles L. ; et al.	2012-07-26
Compact Thermally Controlled Thin Film Resistors Utilizing Substrate Contacts And Methods Of Manufacture App 20120184080 - LUKAITIS; Joseph M. ; et al.	2012-07-19
Compact Thermally Controlled Thin Film Resistors Utilizing Substrate Contacts And Methods Of Manufacture App 20120181663 - LUKAITIS; Joseph M. ; et al.	2012-07-19
Thermally Controlled Refractory Metal Resistor App 20120146186 - Lukaitis; Joseph M. ; et al.	2012-06-14
Structures and methods to improve lead-free C4 interconnect reliability Grant 8,198,133 - Daubenspeck , et al. June 12, 2	2012-06-12
Offset Solder Vias, Methods Of Manufacturing And Design Structures App 20120139123 - Daubenspeck; Timothy H. ; et al.	2012-06-07
Solder Interconnect Pads With Current Spreading Layers App 20120126405 - Daubenspeck; Timothy Harrison ; et al.	2012-05-24
Thin Film Resistors And Methods Of Manufacture App 20120126370 - HARMON; David L. ; et al.	2012-05-24
Array Of Alpha Particle Sensors App 20120122260 - Cannon; Ethan H. ; et al.	2012-05-17
Electromigration Resistant Via-to-line Interconnect App 20120119366 - Li; Baozhen ; et al.	2012-05-17
Underfill Flow Guide Structures And Method Of Using Same App 20120108015 - Daubenspeck; Timothy H. ; et al.	2012-05-03
Underfill flow guide structures Grant 8,159,067 - Daubenspeck , et al. April 17, 2	2012-04-17
Metal Wiring Structures For Uniform Current Density In C4 Balls App 20120080797 - Daubenspeck; Timothy H. ; et al.	2012-04-05
Micro-electro-mechanical-system Temperature Sensor App 20120076172 - Gill; Jason P. ; et al.	2012-03-29
Solder interconnect pads with current spreading layers Grant 8,138,602 - Daubenspeck , et al. March 20, 2	2012-03-20
Chip package solder interconnect formed by surface tension Grant 8,138,099 - Daubenspeck , et al. March 20, 2	2012-03-20
Collar Structure Around Solder Balls That Connect Semiconductor Die To Semiconductor Chip Package Substrate App 20120061832 - Daubenspeck; Timothy H. ; et al.	2012-03-15
Array of alpha particle sensors Grant 8,120,131 - Cannon , et al. February 21, 2	2012-02-21
Electromigration resistant via-to-line interconnect Grant 8,114,768 - Li , et al. February 14, 2	2012-02-14
Integrated Circuit Structure Incorporating A Conductor Layer With Both Top Surface And Sidewall Passivation And A Method Of Forming The Integrated Circuit Structure App 20120025383 - Daubenspeck; Timothy H. ; et al.	2012-02-02
Electromigration resistant aluminum-based metal interconnect structure Grant 8,084,864 - Chapple-Sokol , et al. December 27, 2	2011-12-27
Metal wiring structures for uniform current density in C4 balls Grant 8,084,858 - Daubenspeck , et al. December 27, 2	2011-12-27
Electromigration Resistant Aluminum-based Metal Interconnect Structure App 20110221064 - Chapple-Sokol; Jonathan D. ; et al.	2011-09-15
Thermo-mechanical cleavable structure Grant 8,018,017 - Chen , et al. September 13, 2	2011-09-13
Electromigration resistant aluminum-based metal interconnect structure Grant 8,003,536 - Chapple-Sokol , et al. August 23, 2	2011-08-23
Solder Interconnect with Non-Wettable Sidewall Pillars and Methods of Manufacture App 20110193218 - Arvin; Charles L. ; et al.	2011-08-11
Structures and methods for improving solder bump connections in semiconductor devices Grant 7,985,671 - Daubenspeck , et al. July 26, 2	2011-07-26
Structures And Methods To Reduce Maximum Current Density In A Solder Ball App 20110147922 - BEZAMA; Raschid J. ; et al.	2011-06-23
Integrated Circuit Chip With Pyramid Or Cone-shaped Conductive Pads For Flexible C4 Connections And A Method Of Forming The Integrated Circuit Chip App 20110140271 - Daubenspeck; Timothy H. ; et al.	2011-06-16
Design structure for semiconductor on-chip repair scheme for negative bias temperature instability Grant 7,890,893 - Bolam , et al. February 15, 2	2011-02-15
Structures And Methods For Improving Solder Bump Connections In Semiconductor Devices App 20110031616 - DAUBENSPECK; Timothy H. ; et al.	2011-02-10
Design structure for alpha particle sensor in SOI technology and structure thereof Grant 7,875,854 - Cannon , et al. January 25, 2	2011-01-25
Ic Chip Package Having Ic Chip With Overhang And/or Bga Blocking Underfill Material Flow And Related Methods App 20110012249 - Daubenspeck; Timothy H. ; et al.	2011-01-20
Structures and methods for improving solder bump connections in semiconductor devices Grant 7,871,919 - Daubenspeck , et al. January 18, 2	2011-01-18
Structures and methods to improve lead-free C4 interconnect reliability App 20110006422 - Daubenspeck; Timothy H. ; et al.	2011-01-13
Solder Interconnect Pads With Current Spreading Layers App 20110006421 - Daubenspeck; Timothy Harrison ; et al.	2011-01-13
Solder interconnect pads with current spreading layers Grant 7,868,453 - Daubenspeck , et al. January 11, 2	2011-01-11
Semiconductor on-chip repair scheme for negative bias temperature instability Grant 7,838,958 - Bolam , et al. November 23, 2	2010-11-23
Metal Wiring Structures For Uniform Current Density In C4 Balls App 20100263913 - Daubenspeck; Timothy H. ; et al.	2010-10-21
Structures For Improving Current Carrying Capability Of Interconnects And Methods Of Fabricating The Same App 20100258335 - Arvin; Charles L. ; et al.	2010-10-14
Electromigration Resistant Aluminum-based Metal Interconnect Structure App 20100237503 - Chapple-Sokol; Jonathan D. ; et al.	2010-09-23
Array Of Alpha Particle Sensors App 20100230772 - Cannon; Ethan H. ; et al.	2010-09-16
Optoelectronic memory devices Grant 7,768,815 - Chen , et al. August 3, 2	2010-08-03
Structures and Methods for Improving Solder Bump Connections in Semiconductor Devices App 20100164096 - Daubenspeck; Timothy H. ; et al.	2010-07-01
Structures and Methods for Improving Solder Bump Connections in Semiconductor Devices App 20100164104 - DAUBENSPECK; Timothy H. ; et al.	2010-07-01
Electromigration Resistant Via-to-line Interconnect App 20100164116 - Li; Baozhen ; et al.	2010-07-01
Structure for modeling stress-induced degradation of conductive interconnects Grant 7,692,439 - Chanda , et al. April 6, 2	2010-04-06
Underfill Flow Guide Structures And Method Of Using Same App 20100038780 - Daubenspeck; Timothy H. ; et al.	2010-02-18
Combination Via And Pad Structure For Improved Solder Bump Electromigration Characteristics App 20100032835 - Daubenspeck; Timothy H. ; et al.	2010-02-11
Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing Grant 7,649,262 - Chapple-Sokol , et al. January 19, 2	2010-01-19
Structure for monitoring stress-induced degradation of conductive interconnects Grant 7,639,032 - Chanda , et al. December 29, 2	2009-12-29
Suppression Of Localized Metal Precipitate Formation And Corresponding Metallization Depletion In Semiconductor Processing App 20090294968 - Chapple-Sokol; Jonathan D. ; et al.	2009-12-03
Trench type buried on-chip precision programmable resistor Grant 7,601,602 - Aitken , et al. October 13, 2	2009-10-13
Design Structure For Alpha Particle Sensor In Soi Technology And Structure Thereof App 20090250622 - CANNON; Ethan H. ; et al.	2009-10-08
Tungsten Liner For Aluminum-based Electromigration Resistant Interconnect Structure App 20090230555 - Chapple-Sokol; Jonathan D. ; et al.	2009-09-17
Solder Interconnect Pads With Current Spreading Layers App 20090206479 - Daubenspeck; Timothy Harrison ; et al.	2009-08-20
Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing Grant 7,572,650 - Chapple-Sokol , et al. August 11, 2	2009-08-11
Structure For Semiconductor On-chip Repair Scheme For Negative Bias Temperature Instability App 20090183131 - Bolam; Ronald J. ; et al.	2009-07-16
Semiconductor On-Chip Repair Scheme for Negative Bias Temperature Instability App 20090179689 - Bolam; Ronald J. ; et al.	2009-07-16
Method for detecting alpha particles in SOI technology Grant 7,550,730 - Cannon , et al. June 23, 2	2009-06-23
IC chip stress testing Grant 7,512,506 - Aubel , et al. March 31, 2	2009-03-31
Enhancement of performance of a conductive wire in a multilayered substrate Grant 7,511,378 - Gill , et al. March 31, 2	2009-03-31
Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime Grant 7,500,208 - Chen , et al. March 3, 2	2009-03-03
Dual damascene multi-level metallization Grant 7,470,613 - Agarwala , et al. December 30, 2	2008-12-30
Ic Chip Stress Testing App 20080297188 - Aubel; Oliver ; et al.	2008-12-04
Method and structure for charge dissipation during fabrication of integrated circuits and isolation thereof Grant 7,445,966 - Ellis-Monaghan , et al. November 4, 2	2008-11-04
Structure for modeling stress-induced degradation of conductive interconnects App 20080231312 - Chanda; Kaushik ; et al.	2008-09-25
Structure and method for monitoring stress-induced degradation of conductive interconnects Grant 7,397,260 - Chanda , et al. July 8, 2	2008-07-08
Method for monitoring stress-induced degradation of conductive interconnects App 20080107149 - Chanda; Kaushik ; et al.	2008-05-08
Determination of grain sizes of electrically conductive lines in semiconductor integrated circuits Grant 7,231,617 - Chen , et al. June 12, 2	2007-06-12
Non-destructive Evaluation Of Microstructure And Interface Roughness Of Electrically Conducting Lines In Semiconductor Integrated Circuits In Deep Sub-micron Regime App 20070130551 - Chen; Fen ; et al.	2007-06-07
Dual-damascene metallization interconnection Grant 7,224,063 - Agarwala , et al. May 29, 2	2007-05-29
Structure And Method For Monitoring Stress-induced Degradation Of Conductive Interconnects App 20070115018 - Chanda; Kaushik ; et al.	2007-05-24
Dual Damascene Multi-level Metallization App 20070111510 - Agarwala; Birendra N. ; et al.	2007-05-17
Micro-electro-mechanical RF switch Grant 7,212,091 - Andricacos , et al. May 1, 2	2007-05-01
Optoelectronic Memory Devices App 20070051875 - Chen; Fen ; et al.	2007-03-08
Suppression Of Localized Metal Precipitate Formation And Corresponding Metallization Depletion In Semiconductor Processing App 20070040277 - Chapple-Sokol; Jonathan D. ; et al.	2007-02-22
Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing Grant 7,173,338 - Chapple-Sokol , et al. February 6, 2	2007-02-06
Trench type buried on-chip precision programmable resistor App 20060267144 - Aitken; John M. ; et al.	2006-11-30
Enhancement of performance of a conductive wire in a multilayered substrate App 20060226142 - Gill; Jason P. ; et al.	2006-10-12
Enhancement of performance of a conductive wire in a multilayered substrate Grant 7,096,450 - Gill , et al. August 22, 2	2006-08-22
Trench type buried on-chip precision programmable resistor Grant 7,084,483 - Aitken , et al. August 1, 2	2006-08-01
Thermo-mechanical Cleavable Structure App 20060163685 - Chen; Fen ; et al.	2006-07-27
Non-destructive Evaluation Of Microstructure And Interface Roughness Of Electrically Conducting Lines In Semiconductor Integrated Circuits In Deep Sub-micron Regime App 20060071676 - Chen; Fen ; et al.	2006-04-06
Test structure for locating electromigration voids in dual damascene interconnects Grant 6,995,392 - McLaughlin , et al. February 7, 2	2006-02-07
Liner with improved electromigration redundancy for damascene interconnects Grant 6,992,390 - Edelstein , et al. January 31, 2	2006-01-31
Trench Type Buried On-chip Precision Programmable Resistor App 20050263850 - Aitken, John M. ; et al.	2005-12-01
Suppression Of Localized Metal Precipitate Formation And Corresponding Metallization Depletion In Semiconductor Processing App 20050194689 - Chapple-Sokol, Jonathan D. ; et al.	2005-09-08
Micro-electro-mechanical RF switch App 20050156695 - Andricacos, Panayotis Constantinou ; et al.	2005-07-21
Liner with improved electromigration redundancy for damascene interconnects App 20050098897 - Edelstein, Daniel C. ; et al.	2005-05-12
Micro-electro-mechanical RF switch Grant 6,876,282 - Andricacos , et al. April 5, 2	2005-04-05
Enhancement Of Performance Of A Conductive Wire In A Multilayered Substrate App 20040262031 - Gill, Jason P. ; et al.	2004-12-30
Heat dissipation from IC interconnects Grant 6,798,066 - Motsiff , et al. September 28, 2	2004-09-28
Monolithically integrated solid-state sige thermoelectric energy converter for high speed and low power circuits Grant 6,790,744 - Chen , et al. September 14, 2	2004-09-14
Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces Grant 6,773,952 - Armbrust , et al. August 10, 2	2004-08-10
Basketball shooting trainer device Grant 6,729,979 - Sullivan May 4, 2	2004-05-04
Test structure for locating electromigration voids in dual damascene interconnects App 20040026693 - McLaughlin, Paul S. ; et al.	2004-02-12
Monolithically integrated solid-state sige thermoelectric energy converter for high speed and low power circuits App 20040000333 - Chen, Fen ; et al.	2004-01-01
Micro-electro-mechanical RF switch App 20030214373 - Andricacos, Panayotis Constantinou ; et al.	2003-11-20
Monolithically integrated solid-state SiGe thermoelectric energy converter for high speed and low power circuits Grant 6,639,242 - Chen , et al. October 28, 2	2003-10-28
Electronic fuse structure and method of manufacturing Grant 6,633,055 - Bertin , et al. October 14, 2	2003-10-14
Method and apparatus for accelerated determination of electromigration characteristics of semiconductor wiring Grant 6,603,321 - Filippi, Jr. , et al. August 5, 2	2003-08-05
Method And Apparatus For Accelerated Determination Of Electromigration Characteristics Of Semiconductor Wiring App 20030080761 - Filippi, Ronald G. JR. ; et al.	2003-05-01
Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces Grant 6,512,292 - Armbrust , et al. January 28, 2	2003-01-28
Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces App 20030017650 - Armbrust, Douglas S. ; et al.	2003-01-23
Dual damascene multi-level metallization App 20020182855 - Agarwala, Birendra N. ; et al.	2002-12-05
Process for producing metal interconnections and product produced thereby Grant 6,417,572 - Chidambarrao , et al. July 9, 2	2002-07-09
Electronic Fuse Structure And Method Of Manufacturing App 20020011645 - BERTIN, CLAUDE L. ; et al.	2002-01-31
Semiconductor chip structures with embedded thermal conductors Grant 6,333,557 - Sullivan December 25, 2	2001-12-25
Upper redundant layer for damascene metallization Grant 6,180,506 - Sullivan January 30, 2	2001-01-30
Cooling microfan arrangements and process Grant 5,326,430 - Cronin , et al. July 5, 1	1994-07-05
Laternal field emmission devices and methods of fabrication Grant 5,308,439 - Cronin , et al. May 3, 1	1994-05-03
Cooling microfan arrangements and process Grant 5,296,775 - Cronin , et al. March 22, 1	1994-03-22
Lateral field emission devices Grant 5,233,263 - Cronin , et al. August 3, 1	1993-08-03
Piezoelectric polymer rectangular flexural plate hydrophone Grant 4,184,093 - Sullivan January 15, 1	1980-01-15

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0001581027

Sullivan Timothy D.