Sulehria; Yasir

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sulehria; Yasir.The latest application filed is for "large grain copper interconnect lines for mram".

Company Profile

8.5.8

Sulehria; Yasir - Latham NY
Sulehria; Yasir - New York NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Large grain copper interconnect lines for MRAM Grant 11,309,216 - Reznicek , et al. April 19, 2	2022-04-19
MRAM devices containing a harden gap fill dielectric material Grant 11,114,606 - Reznicek , et al. September 7, 2	2021-09-07
Large Grain Copper Interconnect Lines For Mram App 20210233812 - Reznicek; Alexander ; et al.	2021-07-29
Stackable Symmetrical Operation Memory Bit Cell Structure With Bidirectional Selectors App 20210118951 - Reznicek; Alexander ; et al.	2021-04-22
Mram Devices Containing A Harden Gap Fill Dielectric Material App 20210091302 - Reznicek; Alexander ; et al.	2021-03-25
Stackable symmetrical operation memory bit cell structure with bidirectional selectors Grant 10,910,435 - Reznicek , et al. February 2, 2	2021-02-02
Bottom-up Curing Of Dielectric Films In Integrated Circuits App 20200388488 - Sil; Devika ; et al.	2020-12-10
Ion Implantation Assisted Curing For Flowable Porous Dielectrics App 20200388531 - Sil; Devika ; et al.	2020-12-10
Stackable Symmetrical Operation Memory Bit Cell Structure With Bidirectional Selectors App 20200312906 - Reznicek; Alexander ; et al.	2020-10-01
Post-lithography defect inspection using an e-beam inspection tool Grant 10,578,981 - Meli Thompson , et al.	2020-03-03
Post-lithography Defect Inspection Using An E-beam Inspection Tool App 20200033733 - Meli Thompson; Luciana ; et al.	2020-01-30
Patterning material film stack comprising hard mask layer having high metal content interface to resist layer Grant 10,395,925 - De Silva , et al. A	2019-08-27
Patterning Material Film Stack Comprising Hard Mask Layer Having High Metal Content Interface To Resist Layer App 20190206681 - De Silva; Ekmini Anuja ; et al.	2019-07-04

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