| Patent | Date |
|---|
Wafer Level Light-emitting Diode Array
App 20220028921 - Jang; Jong Min ; et al. | 2022-01-27 |
Wafer level light-emitting diode array
Grant 11,139,338 - Jang , et al. October 5, 2 | 2021-10-05 |
Light emitting diode, method of fabricating the same and LED module having the same
Grant 10,950,755 - Chae , et al. March 16, 2 | 2021-03-16 |
Light Emitting Diode, Method Of Fabricating The Same And Led Module Having The Same
App 20210005785 - CHAE; Jong Hyeon ; et al. | 2021-01-07 |
Wafer level light-emitting diode array
Grant 10,804,316 - Jang , et al. October 13, 2 | 2020-10-13 |
Light emitting diode, method of fabricating the same and led module having the same
Grant 10,784,406 - Chae , et al. Sept | 2020-09-22 |
Light emitting diode and light emitting diode package
Grant 10,756,237 - Chae , et al. A | 2020-08-25 |
Light-emitting diode and application therefor
Grant 10,749,080 - Chae , et al. A | 2020-08-18 |
Wafer Level Light-emitting Diode Array
App 20200258936 - A1 | 2020-08-13 |
Light emitting diode and LED module having the same
Grant 10,693,043 - Chae , et al. | 2020-06-23 |
Water purification system using ultraviolet LEDs
Grant 10,676,375 - Lee , et al. | 2020-06-09 |
Light Emitting Diode, Method Of Fabricating The Same And Led Module Having The Same
App 20200176636 - CHAE; Jong Hyeon ; et al. | 2020-06-04 |
Light-emitting Diode And Application Therefor
App 20200098949 - CHAE; Jong Hyeon ; et al. | 2020-03-26 |
Light emitting diode, method of fabricating the same and LED module having the same
Grant 10,573,785 - Chae , et al. Feb | 2020-02-25 |
Light Emitting Diode And Light Emitting Diode Package
App 20200013928 - CHAE; Jong Hyeon ; et al. | 2020-01-09 |
Light-emitting diode and application therefor
Grant 10,497,836 - Chae , et al. De | 2019-12-03 |
Light emitting diode and light emitting diode package
Grant 10,439,105 - Chae , et al. O | 2019-10-08 |
Wafer level light-emitting diode array
Grant 10,388,690 - Jang , et al. A | 2019-08-20 |
Photocatalytic Filter, Method For Manufacturing The Same, And Method For Reactivating The Same
App 20190201883 - SUH; Daewoong ; et al. | 2019-07-04 |
Light emitting diode
Grant 10,319,884 - Chae , et al. | 2019-06-11 |
Light emitting diode and method of manufacturing the same
Grant 10,297,720 - Chae , et al. | 2019-05-21 |
Photocatalytic filter, method for manufacturing the same, and method for reactivating the same
Grant 10,213,779 - Suh , et al. Feb | 2019-02-26 |
Low Temperature Process for Forming Silicon-Containing Thin Layer
App 20180371612 - Yoo; Seung Ho ; et al. | 2018-12-27 |
Light-emitting device and method of manufacturing the same
Grant 10,158,050 - Park , et al. Dec | 2018-12-18 |
Light-emitting diode module having light-emitting diode joined through solder paste and light-emitting diode
Grant 10,062,810 - Chae , et al. August 28, 2 | 2018-08-28 |
Forming A Stress Compensation Layer And Structures Formed Thereby
App 20180182697 - SUH; Daewoong ; et al. | 2018-06-28 |
Light Emitting Diode And Led Module Having The Same
App 20180175250 - Chae; Jong Hyeon ; et al. | 2018-06-21 |
Light emitting device having wide beam angle and method of fabricating the same
Grant 9,991,425 - Chae , et al. June 5, 2 | 2018-06-05 |
Light-emitting Diode Module Having Light-emitting Diode Joined Through Solder Paste And Light-emitting Diode
App 20180145217 - Chae; Jong Hyeon ; et al. | 2018-05-24 |
Light detection device
Grant 9,972,739 - Park , et al. May 15, 2 | 2018-05-15 |
Light Emitting Diode, Method Of Fabricating The Same And Led Module Having The Same
App 20180114879 - Chae; Jong Hyeon ; et al. | 2018-04-26 |
Wafer Level Light-emitting Diode Array
App 20180108704 - Jang; Jong Min ; et al. | 2018-04-19 |
Forming a stress compensation layer and structures formed thereby
Grant 9,929,080 - Suh , et al. March 27, 2 | 2018-03-27 |
Sterilizing apparatus for portable terminal
Grant 9,912,790 - Kim , et al. March 6, 2 | 2018-03-06 |
Light emitting diode and LED module having the same
Grant 9,893,240 - Chae , et al. February 13, 2 | 2018-02-13 |
Photocatalytic Filter For Degrading Mixed Gas And Manufacturing Method Thereof
App 20180029017 - Yi; Jaeseon ; et al. | 2018-02-01 |
Substrate regeneration method and regenerated substrate
Grant 9,859,108 - Han , et al. January 2, 2 | 2018-01-02 |
Light-emitting diode module having light-emitting diode joined through solder paste and light-emitting diode
Grant 9,859,466 - Chae , et al. January 2, 2 | 2018-01-02 |
Light emitting diode, method of fabricating the same and LED module having the same
Grant 9,847,457 - Chae , et al. December 19, 2 | 2017-12-19 |
Light-emitting Device And Method Of Manufacturing The Same
App 20170338382 - PARK; Jun Yong ; et al. | 2017-11-23 |
Light detection device
Grant 9,812,602 - Park , et al. November 7, 2 | 2017-11-07 |
Light-emitting device and method of manufacturing the same
Grant 9,768,362 - Park , et al. September 19, 2 | 2017-09-19 |
Light Detection Device
App 20170244000 - Park; Ki Yon ; et al. | 2017-08-24 |
Method of fabricating light emitting device through forming a template for growing semiconductor and separating growth substrate
Grant 9,711,354 - Jang , et al. July 18, 2 | 2017-07-18 |
Light-emitting Diode And Application Therefor
App 20170200864 - Chae; Jong Hyeon ; et al. | 2017-07-13 |
Light-emitting Diode Module Having Light-emitting Diode Joined Through Solder Paste And Light-emitting Diode
App 20170200858 - Chae; Jong Hyeon ; et al. | 2017-07-13 |
Light Emitting Device Having Wide Beam Angle And Method Of Fabricating The Same
App 20170148954 - CHAE; Jong Hyeon ; et al. | 2017-05-25 |
Light emitting diode, method of fabricating the same and LED module having the same
Grant 9,640,719 - Chae , et al. May 2, 2 | 2017-05-02 |
Light emitting diode and method of manufacturing the same
Grant 9,634,193 - Chae , et al. April 25, 2 | 2017-04-25 |
Light-emitting diode and application therefor
Grant 9,608,171 - Chae , et al. March 28, 2 | 2017-03-28 |
Light-emitting diode module having light-emitting diode joined through solder paste and light-emitting diode
Grant 9,608,186 - Chae , et al. March 28, 2 | 2017-03-28 |
Light emitting device having wide beam angle and method of fabricating the same
Grant 9,590,144 - Chae , et al. March 7, 2 | 2017-03-07 |
Light-emitting diode and application therefor
Grant 9,548,425 - Chae , et al. January 17, 2 | 2017-01-17 |
Light-emitting diode and application therefor
Grant 9,536,924 - Chae , et al. January 3, 2 | 2017-01-03 |
Light-emitting diode module having light-emitting diode joined through solder paste and light-emitting diode
Grant 9,520,543 - Chae , et al. December 13, 2 | 2016-12-13 |
Light-emitting diode module having light-emitting diode joined through solder paste and light-emitting diode
Grant 9,520,546 - Chae , et al. December 13, 2 | 2016-12-13 |
Light emitting diode, method of fabricating the same and LED module having the same
Grant 9,520,534 - Chae , et al. December 13, 2 | 2016-12-13 |
Light Emitting Diode And Light Emitting Diode Package
App 20160343911 - CHAE; Jong Hyeon ; et al. | 2016-11-24 |
Light-emitting Diode Module Having Light-emitting Diode Joined Through Solder Paste And Light-emitting Diode
App 20160293818 - Chae; Jong Hyeon ; et al. | 2016-10-06 |
Light Emitting Device Having Wide Beam Angle And Method Of Fabricating The Same
App 20160240743 - CHAE; Jong Hyeon ; et al. | 2016-08-18 |
Light Emitting Diode
App 20160233386 - Chae; Jong Hyeon ; et al. | 2016-08-11 |
Wafer Level Light-emitting Diode Array
App 20160211410 - Jang; Jong Min ; et al. | 2016-07-21 |
Multi-purpose conservation apparatus
Grant 9,392,804 - Lee , et al. July 19, 2 | 2016-07-19 |
Light Emitting Diode And Led Module Having The Same
App 20160163930 - Chae; Jong Hyeon ; et al. | 2016-06-09 |
Substrate Regeneration Method And Regenerated Substrate
App 20160155628 - Han; Chang Suk ; et al. | 2016-06-02 |
Light emitting device having wide beam angle and method of fabricating the same
Grant 9,356,198 - Chae , et al. May 31, 2 | 2016-05-31 |
Epitaxial layer wafer having void for separating growth substrate therefrom and semiconductor device fabricated using the same
Grant 9,356,191 - Jang , et al. May 31, 2 | 2016-05-31 |
Electronic device comprising semiconductor memory having ohmic-contact structure separated from current distributing layer
Grant 9,343,627 - Chae , et al. May 17, 2 | 2016-05-17 |
Light-emitting diode package
Grant 9,324,921 - Park , et al. April 26, 2 | 2016-04-26 |
Light Emitting Diode, Method Of Fabricating The Same And Led Module Having The Same
App 20160111600 - Chae; Jong Hyeon ; et al. | 2016-04-21 |
Light-emitting Device And Method Of Manufacturing The Same
App 20160111606 - Park; Jun Yong ; et al. | 2016-04-21 |
Wafer level light-emitting diode array and method for manufacturing same
Grant 9,318,530 - Jang , et al. April 19, 2 | 2016-04-19 |
Wafer level light-emitting diode array
Grant 9,318,529 - Jang , et al. April 19, 2 | 2016-04-19 |
Photocatalytic Filter For Degrading Mixed Gas And Manufacturing Method Thereof
App 20160089660 - Yi; Jaeseon ; et al. | 2016-03-31 |
Photocatalytic Filter For Degrading Mixed Gas And Manufacturing Method Thereof
App 20160089659 - Yi; Jaeseon ; et al. | 2016-03-31 |
Photocatalytic Filter, Method For Manufacturing The Same, And Method For Reactivating The Same
App 20160067698 - Suh; Daewoong ; et al. | 2016-03-10 |
Light Emitting Diode, Method Of Fabricating The Same And Led Module Having The Same
App 20160072011 - Chae; Jong Hyeon ; et al. | 2016-03-10 |
Light-emitting device and method of manufacturing the same
Grant 9,263,658 - Park , et al. February 16, 2 | 2016-02-16 |
Light Emitting Diode And Method Of Manufacturing The Same
App 20160043282 - Chae; Jong Hyeon ; et al. | 2016-02-11 |
Sterilizing Apparatus For Portable Terminal
App 20160036952 - Kim; Jong Rack ; et al. | 2016-02-04 |
Light-emitting device and method of manufacturing the same
Grant 9,240,524 - Park , et al. January 19, 2 | 2016-01-19 |
Light Detection Device
App 20160013351 - Park; Ki Yon ; et al. | 2016-01-14 |
Light-emitting Diode Module Having Light-emitting Diode Joined Through Solder Paste And Light-emitting Diode
App 20160013385 - Chae; Jong Hyeon ; et al. | 2016-01-14 |
Light-emitting Diode Module Having Light-emitting Diode Joined Through Solder Paste And Light-emitting Diode
App 20150380621 - Chae; Jong Hyeon ; et al. | 2015-12-31 |
Light Emitting Diode, Method Of Fabricating The Same And Led Module Having The Same
App 20150380620 - Chae; Jong Hyeon ; et al. | 2015-12-31 |
Method for separating epitaxial layer from growth substrate
Grant 9,218,967 - Suh , et al. December 22, 2 | 2015-12-22 |
Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
Grant 9,214,420 - Raravikar , et al. December 15, 2 | 2015-12-15 |
Light Detection Device
App 20150349192 - PARK; Ki Yon ; et al. | 2015-12-03 |
Light Emitting Device Having Wide Beam Angle And Method Of Fabricating The Same
App 20150325752 - CHAE; Jong Hyeon ; et al. | 2015-11-12 |
Light detection device
Grant 9,171,976 - Park , et al. October 27, 2 | 2015-10-27 |
Light detection device
Grant 9,166,092 - Park , et al. October 20, 2 | 2015-10-20 |
Photo detection device, photo detection package including the photo detection device, and portable device including the photo detection package
Grant 9,166,093 - Park , et al. October 20, 2 | 2015-10-20 |
Light-emitting Diode Package
App 20150295139 - Park; Jun Yong ; et al. | 2015-10-15 |
Epitaxial Layer Wafer Having Void For Separating Growth Substrate Therefrom And Semiconductor Device Fabricated Using The Same
App 20150295132 - JANG; Jong Min ; et al. | 2015-10-15 |
Light-emitting Diode And Application Therefor
App 20150287888 - Chae; Jong Hyeon ; et al. | 2015-10-08 |
Light-emitting Diode And Application Therefor
App 20150287762 - Chae; Jong Hyeon ; et al. | 2015-10-08 |
Wafer Level Light-emitting Diode Array
App 20150280086 - Jang; Jong Min ; et al. | 2015-10-01 |
Light-emitting Diode And Application Therefor
App 20150270442 - Chae; Jong Hyeon ; et al. | 2015-09-24 |
Microelectronic package with high temperature thermal interface material
Grant 9,142,480 - Houle , et al. September 22, 2 | 2015-09-22 |
Wafer Level Light-emitting Diode Array
App 20150255504 - Jang; Jong Min ; et al. | 2015-09-10 |
Light emitting device having wide beam angle and method of fabricating the same
Grant 9,123,866 - Chae , et al. September 1, 2 | 2015-09-01 |
Photo Detection Device, Photo Detection Package Including The Photo Detection Device, And Portable Device Including The Photo Detection Package
App 20150228839 - PARK; Ki Yon ; et al. | 2015-08-13 |
Skin Condition Evaluation Apparatus And Skin Condition Evaluation Method Using The Same
App 20150223749 - Park; Stella ; et al. | 2015-08-13 |
Photo detection device
Grant 9,093,595 - Park , et al. July 28, 2 | 2015-07-28 |
Light Emitting Diode And Method Of Manufacturing The Same
App 20150200334 - Chae; Jong Hyeon ; et al. | 2015-07-16 |
Wafer Level Light-emitting Diode Array And Method For Manufacturing Same
App 20150200230 - Jang; Jong Min ; et al. | 2015-07-16 |
Hormesis Inducing Device For Fruits And Vegetables
App 20150173379 - Lee; Seong Min ; et al. | 2015-06-25 |
Apparatus For Cleaning Fluid
App 20150174528 - Son; Young Hwan ; et al. | 2015-06-25 |
Template For Growing Semiconductor, Method Of Separating Growth Substrate And Method Of Fabricating Light Emitting Device Using The Same
App 20150179875 - Jang; Jong Min ; et al. | 2015-06-25 |
Photo detection device, photo detection package including the photo detection device, and portable device including the photo detection package
Grant 9,059,359 - Park , et al. June 16, 2 | 2015-06-16 |
Epitaxial layer wafer having void for separating growth substrate therefrom and semiconductor device fabricated using the same
Grant 9,059,012 - Jang , et al. June 16, 2 | 2015-06-16 |
Water Purification System Using Ultraviolet Leds
App 20150158741 - Lee; Seong Min ; et al. | 2015-06-11 |
Method of separating substrate and method of fabricating semiconductor device using the same
Grant 9,048,348 - Jang , et al. June 2, 2 | 2015-06-02 |
Multi-purpose Conservation Apparatus
App 20150125355 - Lee; SeongMin ; et al. | 2015-05-07 |
Light Emitting Diode And Led Module Having The Same
App 20150084084 - Chae; Jong Hyeon ; et al. | 2015-03-26 |
Light Emitting Device Having Wide Beam Angle And Method Of Fabricating The Same
App 20150084085 - CHAE; Jong Hyeon ; et al. | 2015-03-26 |
Light Emitting Diode
App 20150069444 - CHAE; Jong Hyeon ; et al. | 2015-03-12 |
Wafer level LED package and method of fabricating the same
Grant 8,916,898 - Suh , et al. December 23, 2 | 2014-12-23 |
Light-emitting Device And Method Of Manufacturing The Same
App 20140367718 - Park; Jun Yong ; et al. | 2014-12-18 |
Light Emitting Diode And Method Of Manufacturing The Same
App 20140361327 - Chae; Jong Hyeon ; et al. | 2014-12-11 |
Microelectronic package with self-heating interconnect
Grant 8,901,753 - Suh December 2, 2 | 2014-12-02 |
Method For Separating Epitaxial Layer From Growth Substrate
App 20140335677 - Suh; Daewoong ; et al. | 2014-11-13 |
Photo Detection Device
App 20140197454 - PARK; Ki Yon ; et al. | 2014-07-17 |
Light Detection Device
App 20140183526 - PARK; Ki Yon ; et al. | 2014-07-03 |
Photo Detection Device, Photo Detection Package Including The Photo Detection Device, And Portable Device Including The Photo Detection Package
App 20140183549 - PARK; Ki Yon ; et al. | 2014-07-03 |
Light Detection Device
App 20140183548 - PARK; Ki Yon ; et al. | 2014-07-03 |
Method Of Separating Substrate And Method Of Fabricating Semiconductor Device Using The Same
App 20140179043 - Jang; Jong Min ; et al. | 2014-06-26 |
Epitaxial Layer Wafer Having Void For Separating Growth Substrate Therefrom And Semiconductor Device Fabricated Using The Same
App 20140167086 - JANG; Jong Min ; et al. | 2014-06-19 |
Gallium Nitride Substrate And Method For Fabricating The Same
App 20140151714 - PARK; Ki Yon ; et al. | 2014-06-05 |
Light-emitting Device And Method Of Manufacturing The Same
App 20140084322 - PARK; Jun Yong ; et al. | 2014-03-27 |
Wafer Level Led Package And Method Of Fabricating The Same
App 20140061709 - SUH; Daewoong ; et al. | 2014-03-06 |
Light Emitting Diode Chip
App 20130334560 - Lee; Kyu Ho ; et al. | 2013-12-19 |
Methods of forming carbon nanotubes architectures and composites with high electrical and thermal conductivites and structures formed thereby
Grant 8,558,218 - Raravikar , et al. October 15, 2 | 2013-10-15 |
Microelectronic Package With Self-heating Interconnect
App 20130134587 - Suh; Daewoong | 2013-05-30 |
Solder joint reliability in microelectronic packaging
Grant 8,436,470 - Suh , et al. May 7, 2 | 2013-05-07 |
Forming a semiconductor package including a thermal interface material
Grant 8,409,929 - Renavikar , et al. April 2, 2 | 2013-04-02 |
Microelectronic package with self-heating interconnect
Grant 8,378,504 - Suh February 19, 2 | 2013-02-19 |
Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
Grant 8,344,483 - Raravikar , et al. January 1, 2 | 2013-01-01 |
Methods Of Forming Carbon Nanotubes Architectures And Composites With High Electrical And Thermal Conductivites And Structures Formed Thereby
App 20120148842 - Raravikar; Nachiket ; et al. | 2012-06-14 |
Methods of fabricating robust integrated heat spreader designs and structures formed thereby
Grant 8,174,113 - Gupta , et al. May 8, 2 | 2012-05-08 |
Methods of forming carbon nanotubes architectures and composites with high electrical and thermal conductivities and structures formed thereby
Grant 8,158,968 - Raravikar , et al. April 17, 2 | 2012-04-17 |
Method of forming an interconnect joint
Grant 8,124,517 - Supriya , et al. February 28, 2 | 2012-02-28 |
Carbon nanotubes solder composite for high performance interconnect
Grant 8,100,314 - Suh January 24, 2 | 2012-01-24 |
Forming A Semiconductor Package Including A Thermal Interface Material
App 20110312131 - Renavikar; Mukul ; et al. | 2011-12-22 |
Forming a semiconductor package including a thermal interface material
Grant 8,030,757 - Renavikar , et al. October 4, 2 | 2011-10-04 |
Solder joint reliability in microelectronic packaging
Grant 8,018,063 - Suh , et al. September 13, 2 | 2011-09-13 |
Inductor using bulk metallic glass material
Grant 7,986,209 - Park , et al. July 26, 2 | 2011-07-26 |
Process for joining materials using bulk metallic glasses
Grant 7,947,134 - Lohwongwatana , et al. May 24, 2 | 2011-05-24 |
Solder Joint Reliability In Microelectronic Packaging
App 20110051376 - Suh; Daewoong ; et al. | 2011-03-03 |
Methods and apparatuses for providing stacked-die devices
Grant 7,867,818 - Suh , et al. January 11, 2 | 2011-01-11 |
Method Of Forming An Interconnect Joint
App 20100276474 - Supriya; Lakshmi ; et al. | 2010-11-04 |
Carbon Nanotube-solder Composite Structures For Interconnects, Process Of Making Same, Packages Containing Same, And Systems Containing Same
App 20100219511 - Raravikar; Nachiket ; et al. | 2010-09-02 |
Carbon nanotube coated capacitor electrodes
App 20100177475 - Min; Yongki ; et al. | 2010-07-15 |
Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same
Grant 7,745,013 - Choe , et al. June 29, 2 | 2010-06-29 |
Microelectronic package interconnect and method of fabrication thereof
Grant 7,727,814 - Suh , et al. June 1, 2 | 2010-06-01 |
Reactive gettering in phase change solders to inhibit oxidation at contact surfaces
Grant 7,727,815 - Kumaus , et al. June 1, 2 | 2010-06-01 |
Carbon Nanotubes Solder Composite For High Performance Interconnect
App 20100126631 - Suh; Daewoong | 2010-05-27 |
Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
Grant 7,713,858 - Raravikar , et al. May 11, 2 | 2010-05-11 |
Carbon nanotube coated capacitor electrodes
Grant 7,710,709 - Min , et al. May 4, 2 | 2010-05-04 |
Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same
Grant 7,705,458 - Suh , et al. April 27, 2 | 2010-04-27 |
Solder joint reliability in microelectronic packaging
Grant 7,700,476 - Suh , et al. April 20, 2 | 2010-04-20 |
Soldering an electronics package to a motherboard
Grant 7,699,210 - Suh April 20, 2 | 2010-04-20 |
Methods of fabricating robust integrated heat spreader designs and structures formed thereby
App 20100065246 - Gupta; Abhishek ; et al. | 2010-03-18 |
Solder Joint Reliability In Microelectronic Packaging
App 20100044848 - Suh; Daewoong ; et al. | 2010-02-25 |
Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance
Grant 7,666,768 - Raravikar , et al. February 23, 2 | 2010-02-23 |
Bulk Metallic Glass Solder Material
App 20100037990 - Suh; Daewoong | 2010-02-18 |
Microelectronic Package With High Temperature Thermal Interface Material
App 20100039777 - Houle; Sabina ; et al. | 2010-02-18 |
Microelectronic Package With Self-heating Interconnect
App 20090321962 - Suh; Daewoong | 2009-12-31 |
Thermal interface material for combined reflow
Grant 7,629,203 - Suh , et al. December 8, 2 | 2009-12-08 |
Bulk metallic glass solder material
Grant 7,628,871 - Suh December 8, 2 | 2009-12-08 |
Thermal Interface Material For Combined Reflow
App 20090244850 - Suh; Daewoong ; et al. | 2009-10-01 |
Low Stress, Low-temperature Metal-metal Composite Flip Chip Interconnect
App 20090242121 - Suh; Daewoong | 2009-10-01 |
Solders with intermetallic phases, solder bumps made thereof, packages containing same, and methods of assembling packages therewith
Grant 7,578,966 - Suh August 25, 2 | 2009-08-25 |
Inductor Using Bulk Metallic Glass Material
App 20090128274 - Park; Chang-min ; et al. | 2009-05-21 |
Sintered metallic thermal interface materials for microelectronic cooling assemblies
Grant 7,535,099 - Suh , et al. May 19, 2 | 2009-05-19 |
Microelectronic package interconnect and method of fabrication thereof
App 20090068830 - Suh; Daewoong ; et al. | 2009-03-12 |
In-situ Chip Attachment Using Self-organizing Solder
App 20090057378 - Hwang; Chi-Won ; et al. | 2009-03-05 |
Stacking Of Integrated Circuits Using Glassy Metal Bonding
App 20090032970 - Park; Chang-Min ; et al. | 2009-02-05 |
Multilayer Preform For Fast Transient Liquid Phase Bonding
App 20090004500 - Suh; Daewoong ; et al. | 2009-01-01 |
Forming a semiconductor package including a thermal interface material
App 20090001557 - Renavikar; Mukul ; et al. | 2009-01-01 |
Method Of Forming An Interconnect Joint
App 20080311738 - Supriya; Lakshmi ; et al. | 2008-12-18 |
Process For Joining Materials Using Bulk Metallic Glasses
App 20080251164 - Lohwongwatana; Boonrat ; et al. | 2008-10-16 |
Carbon Nanotube Coated Capacitor Electrodes
App 20080239620 - Min; Yongki ; et al. | 2008-10-02 |
Methods Of Forming A Cored Metallic Thermal Interface Material And Structures Formed Thereby
App 20080233682 - Suh; Daewoong ; et al. | 2008-09-25 |
Methods Of Forming Carbon Nanotubes Architectures And Composites With High Electrical And Thermal Conductivities And Structures Formed Thereby
App 20080233396 - Raravikar; Nachiket ; et al. | 2008-09-25 |
Thermal interface materials
App 20080225490 - Suh; Daewoong | 2008-09-18 |
Method of making an interconnect structure
App 20080227294 - Suh; Daewoong | 2008-09-18 |
Microelectronic substrate including bumping sites with nanostructures
App 20080224327 - Suh; Daewoong ; et al. | 2008-09-18 |
Nanostructure-Based Package Interconnect
App 20080185718 - Suh; Daewoong ; et al. | 2008-08-07 |
Microelectronic package interconnect and method of fabrication thereof
Grant 7,402,909 - Suh , et al. July 22, 2 | 2008-07-22 |
Thermal interfaces in electronic systems
App 20080156475 - Suh; Daewoong | 2008-07-03 |
Microelectronic package, method of manufacturing same, and system containing same
App 20080150127 - Raravikar; Nachiket ; et al. | 2008-06-26 |
Soldering An Electronics Package To A Motherboard
App 20080128160 - Suh; Daewoong | 2008-06-05 |
Solder joint reliability in microelectronic packaging
App 20080115968 - Suh; Daewoong ; et al. | 2008-05-22 |
Nanostructure-based package interconnect
Grant 7,371,674 - Suh , et al. May 13, 2 | 2008-05-13 |
Soldering an electronics package to a motherboard
Grant 7,357,293 - Suh April 15, 2 | 2008-04-15 |
Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance
App 20080081386 - Raravikar; Nachiket R. ; et al. | 2008-04-03 |
Sintered metallic thermal interface materials for microelectronic cooling assemblies
App 20080073776 - Suh; Daewoong ; et al. | 2008-03-27 |
Oxidation resistant solder preform
App 20080035703 - Suh; Daewoong ; et al. | 2008-02-14 |
Bulk Metallic Glass Solders, Foamed Bulk Metallic Glass Solders, Foamed-solder Bond Pads In Chip Packages, Methods Of Assembling Same, And Systems Containing Same
App 20070290339 - Suh; Daewoong ; et al. | 2007-12-20 |
Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same
Grant 7,291,548 - Suh , et al. November 6, 2 | 2007-11-06 |
Room Temperature Joining Process With Piezoelectric Ceramic-activated Reactive Multilayer Foil
App 20070235500 - Suh; Daewoong ; et al. | 2007-10-11 |
Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
App 20070228361 - Raravikar; Nachiket ; et al. | 2007-10-04 |
Solder composition having dispersoid particles for increased creep resistance
App 20070227627 - Suh; Daewoong ; et al. | 2007-10-04 |
Stress-relief Layers And Stress-compensation Collars With Low-temperature Solders For Board-level Joints, And Processes Of Making Same
App 20070190772 - Suh; Daewoong ; et al. | 2007-08-16 |
Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same
Grant 7,253,088 - Suh , et al. August 7, 2 | 2007-08-07 |
Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same
Grant 7,244,634 - Suh , et al. July 17, 2 | 2007-07-17 |
Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same
App 20070152016 - Choe; Heeman ; et al. | 2007-07-05 |
Transient liquid phase bonding method
App 20070152026 - Suh; Daewoong ; et al. | 2007-07-05 |
Carbon nanotubes solder composite for high performance interconnect
App 20070145097 - Suh; Daewoong | 2007-06-28 |
Nanostructure-based package interconnect
App 20070148949 - Suh; Daewoong ; et al. | 2007-06-28 |
Intermetallic solder with low melting point
Grant 7,224,067 - Suh May 29, 2 | 2007-05-29 |
Intermetallic Solder With Low Melting Point
App 20070080451 - Suh; Daewoong | 2007-04-12 |
Solder joint intermetallic compounds with improved ductility and toughness
App 20070075430 - Suh; Daewoong ; et al. | 2007-04-05 |
Methods and apparatuses for providing stacked-die devices
Grant 7,187,068 - Suh , et al. March 6, 2 | 2007-03-06 |
Bulk metallic glass solder material
App 20070034305 - Suh; Daewoong | 2007-02-15 |
Solders with intermetallic phases, solder bumps made thereof, packages containing same, and methods of assembling packages therewith
App 20070000967 - Suh; Daewoong | 2007-01-04 |
Microelectronic package interconnect and method of fabrication thereof
App 20060243958 - Suh; Daewoong ; et al. | 2006-11-02 |
Forming a stress compensation layer and structures formed thereby
App 20060105497 - Suh; Daewoong ; et al. | 2006-05-18 |
Reactive gettering in phase change solders to inhibit oxidation at contact surfaces
App 20060065974 - Kumaus; Chad A. ; et al. | 2006-03-30 |
Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same
App 20060068579 - Suh; Daewoong ; et al. | 2006-03-30 |
Low melting-point solders, articles made thereby, and processes of making same
App 20060067852 - Suh; Daewoong ; et al. | 2006-03-30 |
Doped contact formations
App 20060060639 - Byrne; Tiffany A. ; et al. | 2006-03-23 |
Methods and apparatuses for providing stacked-die devices
App 20060035409 - Suh; Daewoong ; et al. | 2006-02-16 |
Methods and apparatuses for providing stacked-die devices
App 20060033193 - Suh; Daewoong ; et al. | 2006-02-16 |
Metallic glass microtool
App 20050277286 - Suh, Daewoong | 2005-12-15 |
Microtools for package substrate patterning
App 20050255636 - Suh, Daewoong | 2005-11-17 |
Jet-dispensed stress relief layer in contact arrays, and processes of making same
App 20050224951 - Suh, Daewoong ; et al. | 2005-10-13 |
Microtools for package substrate patterning
App 20050221112 - Suh, Daewoong | 2005-10-06 |
Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same
App 20050221534 - Suh, Daewoong ; et al. | 2005-10-06 |
Soldering an electronics package to a motherboard
App 20050210673 - Suh, Daewoong | 2005-09-29 |
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