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name:-0.0023009777069092
name:-0.0013539791107178
name:-0.00043487548828125
Sugrue; John C. Patent Filings

Sugrue; John C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sugrue; John C..The latest application filed is for "method for depositing solder material on an electronic component part".

Company Profile
0.1.2
  • Sugrue; John C. - Stratford CT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for depositing solder material on an electronic component part
App 20100163608 - Huth; Kenneth J. ;   et al.
2010-07-01
Solder deposit method on electronic packages for post-connection process
App 20070152023 - Huth; Kenneth J. ;   et al.
2007-07-05
Beo-type machining system
Grant 4,534,093 - Jahnke , et al. August 13, 1
1985-08-13

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