| Patent | Date |
|---|
Battery System And Method Of Estimating Polarization Voltage Of Secondary Battery
App 20220308117 - SUGO; Yuki | 2022-09-29 |
Tractor
App 20220282452 - SUGO; Yuki ; et al. | 2022-09-08 |
Sheet for heat bonding and sheet for heat bonding having dicing tape
Grant 11,390,777 - Honda , et al. July 19, 2 | 2022-07-19 |
Sinter-bonding composition, sinter-bonding sheet and dicing tape with sinter-bonding sheet
Grant 11,352,527 - Ichikawa , et al. June 7, 2 | 2022-06-07 |
Semiconductor Device
App 20210280480 - SUGO; Yuki ; et al. | 2021-09-09 |
Battery System And Method For Evaluating Lithium-ion Battery Degradation
App 20210231745 - Nagai; Hiroki ; et al. | 2021-07-29 |
Semiconductor Device And Method Of Manufacturing The Same
App 20210233781 - TSUKIYAMA; Satoshi ; et al. | 2021-07-29 |
Sheet For Heat Bonding And Sheet For Heat Bonding Having Dicing Tape
App 20210198526 - Honda; Satoshi ; et al. | 2021-07-01 |
Sinter-bonding Composition, Sinter-bonding Sheet And Dicing Tape With Sinter-bonding Sheet
App 20210174984 - ICHIKAWA; Tomoaki ; et al. | 2021-06-10 |
Sheet and composite sheet
Grant 10,888,929 - Kamakura , et al. January 12, 2 | 2021-01-12 |
Joint manufacturing method
Grant 10,821,543 - Kamakura , et al. November 3, 2 | 2020-11-03 |
Sinter-bonding Composition, Sinter-bonding Sheet And Dicing Tape With Sinter-bonding Sheet
App 20200308456 - ICHIKAWA; Tomoaki ; et al. | 2020-10-01 |
Semiconductor device
Grant 10,756,060 - Uchida , et al. A | 2020-08-25 |
Thermal bonding sheet, thermal bonding sheet with dicing tape, bonded body production method, and power semiconductor device
Grant 10,748,866 - Sugo , et al. A | 2020-08-18 |
Thermal bonding sheet and thermal bonding sheet with dicing tape
Grant 10,707,184 - Sugo , et al. | 2020-07-07 |
Thermal bonding sheet and thermal bonding sheet with dicing tape
Grant 10,685,933 - Sugo , et al. | 2020-06-16 |
Thermal bonding sheet and thermal bonding sheet with dicing tape
Grant 10,669,452 - Sugo , et al. | 2020-06-02 |
Thermal-bonding Sheet And Thermal-bonding Sheet-attached Dicing Tape
App 20200048504 - Sugo; Yuki ; et al. | 2020-02-13 |
Semiconductor Device
App 20200020669 - UCHIDA; Yuki ; et al. | 2020-01-16 |
Thermal Bonding Sheet And Thermal Bonding Sheet With Dicing Tape
App 20190311936 - HONDA; Satoshi ; et al. | 2019-10-10 |
Thermal Bonding Sheet And Thermal Bonding Sheet With Dicing Tape
App 20190206825 - Sugo; Yuki ; et al. | 2019-07-04 |
Sheet For Heat Bonding, And Sheet For Heat Bonding Having Dicing Tape
App 20190184460 - Honda; Satoshi ; et al. | 2019-06-20 |
Sheet for thermal bonding and sheet for thermal bonding with affixed dicing tape
Grant 10,301,509 - Sugo , et al. | 2019-05-28 |
Thermal Bonding Sheet And Thermal Bonding Sheet With Dicing Tape
App 20190148331 - Honda; Satoshi ; et al. | 2019-05-16 |
Joint Manufacturing Method
App 20190047081 - Kamakura; Nao ; et al. | 2019-02-14 |
Thermal Bonding Sheet, Thermal Bonding Sheet with Dicing Tape, Bonded Body Production Method, and Power Semiconductor Device
App 20190043824 - Sugo; Yuki ; et al. | 2019-02-07 |
Thermal Bonding Sheet and Thermal Bonding Sheet with Dicing Tape
App 20180315729 - Sugo; Yuki ; et al. | 2018-11-01 |
Thermal Bonding Sheet and Thermal Bonding Sheet with Dicing Tape
App 20180277507 - Sugo; Yuki ; et al. | 2018-09-27 |
Sheet and Composite Sheet
App 20180273808 - Kamakura; Nao ; et al. | 2018-09-27 |
Thermal Bonding Sheet and Thermal Bonding Sheet with Dicing Tape
App 20180265744 - Sugo; Yuki ; et al. | 2018-09-20 |
Thermal Bonding Sheet and Thermal Bonding Sheet with Dicing Tape
App 20180269175 - Sugo; Yuki ; et al. | 2018-09-20 |
Sheet and Composite Sheet
App 20180257142 - Kamakura; Nao ; et al. | 2018-09-13 |
Sheet For Thermal Bonding And Sheet For Thermal Bonding With Affixed Dicing Tape
App 20170369744 - Sugo; Yuki ; et al. | 2017-12-28 |
Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device
Grant 9,484,240 - Sugo , et al. November 1, 2 | 2016-11-01 |
Film Adhesive, Dicing Tape With Film Adhesive, Method Of Manufacturing Semiconductor Device, And Semiconductor Device
App 20140231983 - SUGO; Yuki ; et al. | 2014-08-21 |
Thermosetting die-bonding film
Grant 8,580,617 - Sugo , et al. November 12, 2 | 2013-11-12 |
Thermosetting Die-bonding Film
App 20120135242 - SUGO; Yuki ; et al. | 2012-05-31 |
Thermosetting die-bonding film
Grant 8,143,106 - Sugo , et al. March 27, 2 | 2012-03-27 |
Thermosetting Die Bond Film, Dicing Die Bond Film And Semiconductor Device
App 20110256666 - SUGO; Yuki ; et al. | 2011-10-20 |
Film For Manufacturing Semiconductor Device And Method Of Manufacturing Semiconductor Device
App 20110189835 - Sugo; Yuki ; et al. | 2011-08-04 |
Thermosetting Adhesive Film, Adhesive Film With Dicing Film, And Method Of Manufacturing Semiconductor Device Using The Thermosetting Adhesive Film Or The Adhesive Film With Dicing Film
App 20110120614 - Sugo; Yuki ; et al. | 2011-05-26 |
Adhesive Film With Dicing Sheet And Method Of Manufacturing The Same
App 20110052853 - SUGO; Yuki ; et al. | 2011-03-03 |
Pressure-Sensitive Adhesive Tape
App 20100323151 - Terada; Yoshio ; et al. | 2010-12-23 |
Pressure-Sensitive Adhesive Tape
App 20100323191 - Sugo; Yuki ; et al. | 2010-12-23 |
Cleaning Member, Delivery Member with Cleaning Function, and Method of Cleaning Substrate Processing Apparatus
App 20100175716 - Sugo; Yuki ; et al. | 2010-07-15 |
Cleaning Member, Carrying Member with Cleaning Function, and Method of Cleaning Substrate Processing Equipment
App 20100170533 - Terada; Yoshio ; et al. | 2010-07-08 |
Pressure-Sensitive Adhesive Tape
App 20100092714 - Sugo; Yuki ; et al. | 2010-04-15 |
Thermosetting Die-bonding Film
App 20100055842 - Sugo; Yuki ; et al. | 2010-03-04 |
Dicing Die-bonding Film
App 20100029059 - Matsumura; Takeshi ; et al. | 2010-02-04 |
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