| Patent | Date |
|---|
Cleaning Solution For Temporary Adhesive For Substrates, Substrate Cleaning Method, And Cleaning Method For Support Or Substrate
App 20220195352 - SUGO; Michihiro ; et al. | 2022-06-23 |
Detergent Composition, Substrate Cleaning Method, And Cleaning Method For Support Or Substrate
App 20220186152 - TANABE; Masahito ; et al. | 2022-06-16 |
Photosensitive resin composition, photosensitive dry film, and pattern forming process
Grant 11,262,655 - Maruyama , et al. March 1, 2 | 2022-03-01 |
Method for manufacturing laminate and method for manufacturing substrate
Grant 11,183,417 - Tanabe , et al. November 23, 2 | 2021-11-23 |
Method for producing thin wafer
Grant 11,069,557 - Yasuda , et al. July 20, 2 | 2021-07-20 |
Wafer processing laminate and method for processing wafer
Grant 10,991,611 - Tagami , et al. April 27, 2 | 2021-04-27 |
Polymer containing silphenylene and polyether structures
Grant 10,982,053 - Maruyama , et al. April 20, 2 | 2021-04-20 |
Method for manufacturing thin substrate
Grant 10,950,481 - Tanabe , et al. March 16, 2 | 2021-03-16 |
Circuit substrate processing laminate and method for processing circuit substrate
Grant 10,854,496 - Tagami , et al. December 1, 2 | 2020-12-01 |
Temporary adhesive film roll for substrate processing, method for manufacturing thin wafer
Grant 10,796,939 - Tanabe , et al. October 6, 2 | 2020-10-06 |
Semiconductor device, method for producing the same, and laminate
Grant 10,727,103 - Yasuda , et al. | 2020-07-28 |
Photosensitive Resin Composition, Laminate, And Pattern Forming Process
App 20200209751 - Hayashi; Kumiko ; et al. | 2020-07-02 |
Photosensitive Resin Composition, Photosensitive Dry Film, And Pattern Forming Process
App 20200201182 - Hirano; Yoshinori ; et al. | 2020-06-25 |
Wafer laminate, method for production thereof, and adhesive composition for wafer laminate
Grant 10,658,314 - Yasuda , et al. | 2020-05-19 |
Method For Manufacturing Laminate And Method For Manufacturing Substrate
App 20200144093 - TANABE; Masahito ; et al. | 2020-05-07 |
Method For Producing Thin Wafer
App 20200075388 - Yasuda; Hiroyuki ; et al. | 2020-03-05 |
Wafer laminate and method of producing the same
Grant 10,553,552 - Yasuda , et al. Fe | 2020-02-04 |
Method For Manufacturing Thin Substrate
App 20190371644 - TANABE; Masahito ; et al. | 2019-12-05 |
Photosensitive Resin Composition, Photosensitive Dry Film, And Pattern Forming Process
App 20190354014 - Maruyama; Hitoshi ; et al. | 2019-11-21 |
Polymer Containing Silphenylene And Polyether Structures
App 20190352465 - Maruyama; Hitoshi ; et al. | 2019-11-21 |
Silicone skeleton-containing polymer, photo-curable resin composition, photo-curable dry film, laminate, and patterning process
Grant 10,451,970 - Maruyama , et al. Oc | 2019-10-22 |
Wafer laminate and making method
Grant 10,453,732 - Yasuda , et al. Oc | 2019-10-22 |
Circuit Substrate Processing Laminate And Method For Processing Circuit Substrate
App 20190318952 - TAGAMI; Shohei ; et al. | 2019-10-17 |
Laminate and making method
Grant 10,373,903 - Yasuda , et al. | 2019-08-06 |
Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same
Grant 10,319,653 - Takemura , et al. | 2019-06-11 |
Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device
Grant 10,308,787 - Kondo , et al. | 2019-06-04 |
Semiconductor device, making method, and laminate
Grant 10,297,485 - Yasuda , et al. | 2019-05-21 |
Semiconductor Device, Method For Producing The Same, And Laminate
App 20190103299 - Yasuda; Hiroyuki ; et al. | 2019-04-04 |
Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer
Grant 10,242,902 - Sugo , et al. | 2019-03-26 |
Wafer Processing Laminate And Method For Processing Wafer
App 20190027391 - TAGAMI; Shohei ; et al. | 2019-01-24 |
Temporary Adhesive Film Roll For Substrate Processing, Method For Manufacturing Thin Wafer
App 20180350650 - TANABE; Masahito ; et al. | 2018-12-06 |
Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer
Grant 10,147,632 - Tagami , et al. De | 2018-12-04 |
Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each having photo-curable resin layer
Grant 10,141,272 - Takemura , et al. Nov | 2018-11-27 |
Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer
Grant 10,128,143 - Tanabe , et al. November 13, 2 | 2018-11-13 |
Wafer processing laminate and method for processing wafer
Grant 10,115,622 - Tagami , et al. October 30, 2 | 2018-10-30 |
Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer
Grant 10,106,713 - Tagami , et al. October 23, 2 | 2018-10-23 |
Semiconductor Device, Making Method, And Laminate
App 20180277415 - Yasuda; Hiroyuki ; et al. | 2018-09-27 |
Laminate And Making Method
App 20180277472 - Yasuda; Hiroyuki ; et al. | 2018-09-27 |
Wafer laminate and making method
Grant 10,074,626 - Yasuda , et al. September 11, 2 | 2018-09-11 |
Wafer Laminate, Method For Production Thereof, And Adhesive Composition For Wafer Laminate
App 20180102333 - Yasuda; Hiroyuki ; et al. | 2018-04-12 |
Wafer Laminate And Method Of Producing The Same
App 20180102334 - Yasuda; Hiroyuki ; et al. | 2018-04-12 |
Wafer processing temporary bonding arrangement, wafer processing laminate, and thin wafer manufacturing method
Grant 9,941,145 - Tanabe , et al. April 10, 2 | 2018-04-10 |
Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method
Grant 9,934,996 - Sugo , et al. April 3, 2 | 2018-04-03 |
Film-like wafer mold material, molded wafer, and semiconductor device
Grant 9,929,068 - Sugo , et al. March 27, 2 | 2018-03-27 |
Temporary adhesion method and method for producing thin wafer
Grant 9,884,979 - Yasuda , et al. February 6, 2 | 2018-02-06 |
Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer
Grant 9,887,118 - Tagami , et al. February 6, 2 | 2018-02-06 |
Silicone Skeleton-containing Polymer, Photo-curable Resin Composition, Photo-curable Dry Film, Laminate, And Patterning Process
App 20180004088 - MARUYAMA; Hitoshi ; et al. | 2018-01-04 |
Wafer Laminate And Making Method
App 20170352637 - Yasuda; Hiroyuki ; et al. | 2017-12-07 |
Wafer Processing Laminate, Method For Manufacturing Thereof, And Method For Checking Coverage Of Organic Film On Wafer
App 20170330803 - TAGAMI; Shohei ; et al. | 2017-11-16 |
Silicone adhesive composition and solid-state imaging device
Grant 9,796,892 - Yasuda , et al. October 24, 2 | 2017-10-24 |
Resin Composition, Resin Film, Method For Producing Resin Film, Method For Producing Semiconductor Device, And Semiconductor Device
App 20170283581 - KONDO; Kazunori ; et al. | 2017-10-05 |
Wafer Processing Laminate And Method For Processing Wafer
App 20170154801 - TAGAMI; Shohei ; et al. | 2017-06-01 |
Wafer Laminate And Making Method
App 20170154802 - Yasuda; Hiroyuki ; et al. | 2017-06-01 |
Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method
Grant 9,653,335 - Kato , et al. May 16, 2 | 2017-05-16 |
Wafer temporary bonding method and thin wafer manufacturing method
Grant 9,646,868 - Yasuda , et al. May 9, 2 | 2017-05-09 |
Wafer Processing Laminate, Temporary Adhesive Material For Wafer Processing, And Method For Manufacturing Thin Wafer
App 20170110360 - TAGAMI; Shohei ; et al. | 2017-04-20 |
Temporary Adhesion Method And Method For Producing Thin Wafer
App 20170101555 - YASUDA; Hiroyuki ; et al. | 2017-04-13 |
Semiconductor Apparatus, Stacked Semiconductor Apparatus, Encapsulated Stacked-semiconductor Apparatus, And Method For Manufacturing The Same
App 20170103932 - TAKEMURA; Katsuya ; et al. | 2017-04-13 |
Semiconductor Apparatus, Stacked Semiconductor Apparatus, Encapsulated Stacked-semiconductor Apparatus, And Method For Manufacturing The Same
App 20170077043 - TAKEMURA; Katsuya ; et al. | 2017-03-16 |
Wafer Processing Laminate, Temporary Adhesive Material For Wafer Processing, And Method For Manufacturing Thin Wafer
App 20170069521 - SUGO; Michihiro ; et al. | 2017-03-09 |
Wafer Processing Bonding Arrangement, Wafer Laminate, And Thin Wafer Manufacturing Method
App 20170053821 - Sugo; Michihiro ; et al. | 2017-02-23 |
Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using same
Grant 9,550,931 - Yasuda , et al. January 24, 2 | 2017-01-24 |
Wafer Processing Temporary Bonding Arrangement, Wafer Processing Laminate, And Thin Wafer Manufacturing Method
App 20170004989 - Tanabe; Masahito ; et al. | 2017-01-05 |
Wafer Processing Laminate, Temporary Adhesive Material For Wafer Processing, And Method For Manufacturing Thin Wafer
App 20160326414 - TAGAMI; Shohei ; et al. | 2016-11-10 |
Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer
Grant 9,472,438 - Kondo , et al. October 18, 2 | 2016-10-18 |
Silicone Adhesive Composition And Solid-state Imaging Device
App 20160289519 - YASUDA; Hiroyuki ; et al. | 2016-10-06 |
Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same
Grant 9,458,365 - Kim , et al. October 4, 2 | 2016-10-04 |
Wafer Processing Laminate, Temporary Adhesive Material For Wafer Processing, And Method For Manufacturing Thin Wafer
App 20160189996 - TANABE; Masahito ; et al. | 2016-06-30 |
Wafer Temporary Bonding Method And Thin Wafer Manufacturing Method
App 20160189998 - Yasuda; Hiroyuki ; et al. | 2016-06-30 |
Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method
Grant 9,365,681 - Kato , et al. June 14, 2 | 2016-06-14 |
Temporary adhesive material for wafer processing, wafer processing laminate, and method for manufacturing thin wafer using same
Grant 9,346,990 - Yasuda , et al. May 24, 2 | 2016-05-24 |
Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin wafer
Grant 9,334,424 - Tanabe , et al. May 10, 2 | 2016-05-10 |
Wafer Processing Laminate, Temporary Adhesive Material For Wafer Processing, And Method For Manufacturing Thin Wafer
App 20160093522 - TAGAMI; Shohei ; et al. | 2016-03-31 |
Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer
Grant 9,263,333 - Sugo , et al. February 16, 2 | 2016-02-16 |
Temporary Adhesive Material For Wafer Processing, Wafer Processing Laminate, And Method For Manufacturing Thin Wafer Using Same
App 20150353793 - YASUDA; Hiroyuki ; et al. | 2015-12-10 |
Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method
Grant 9,096,032 - Kato , et al. August 4, 2 | 2015-08-04 |
Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer
Grant 8,999,817 - Tagami , et al. April 7, 2 | 2015-04-07 |
Temporary Bonding Adhesive Compositions And Methods Of Manufacturing A Semiconductor Device Using The Same
App 20150024574 - Kim; Tae-Hoon ; et al. | 2015-01-22 |
Temporary Adhesive Material For Wafer, Film For Temporary Adhesion Using Same, Wafer Processing Laminate, And Method For Producing Thin Wafer Using Same
App 20140342530 - YASUDA; Hiroyuki ; et al. | 2014-11-20 |
Resin composition, resin film, semiconductor device, and production method thereof
Grant 8,883,913 - Kondo , et al. November 11, 2 | 2014-11-11 |
Polymer having silphenylene and siloxane structures, a method of preparing the same, an adhesive composition, an adhesive sheet, a protective material for a semiconductor device, and a semiconductor device
Grant 8,796,410 - Sugo , et al. August 5, 2 | 2014-08-05 |
Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the same
Grant 8,748,293 - Furuya , et al. June 10, 2 | 2014-06-10 |
Wafer Processing Laminate, Wafer Processing Member, Temporary Adhering Material For Processing Wafer, And Manufacturing Method Of Thin Wafer
App 20140154868 - SUGO; Michihiro ; et al. | 2014-06-05 |
Temporary adhesive composition and method for manufacturing thin wafer using the same
Grant 8,735,264 - Yasuda , et al. May 27, 2 | 2014-05-27 |
Wafer Processing Laminate, Wafer Processing Member, Temporary Adhering Material For Processing Wafer, And Manufacturing Method Of Thin Wafer
App 20140106137 - KONDO; Kazunori ; et al. | 2014-04-17 |
Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition
Grant 8,673,537 - Furuya , et al. March 18, 2 | 2014-03-18 |
Temporary Adhesive For Wafer Processing, Member For Wafer Processing Using The Same, Wafer Processed Body, And Method For Producing Thin Wafer
App 20130302983 - TANABE; Masahito ; et al. | 2013-11-14 |
Wafer Processing Laminate, Wafer Processing Member, Temporary Bonding Arrangement, And Thin Wafer Manufacturing Method
App 20130280886 - Kato; Hideto ; et al. | 2013-10-24 |
Wafer Process Body, Wafer Processing Member, Wafer Processing Temporary Adhesive Material, And Method For Manufacturing Thin Wafer
App 20130220687 - TAGAMI; Shohei ; et al. | 2013-08-29 |
Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus
Grant 8,501,879 - Kondo , et al. August 6, 2 | 2013-08-06 |
Polyimidesilicone having alcoholic hydroxyl group and process for producing the same
Grant 8,487,062 - Sugo , et al. July 16, 2 | 2013-07-16 |
Resin Composition, Resin Film, Semiconductor Device, And Production Method Thereof
App 20130113083 - KONDO; Kazunori ; et al. | 2013-05-09 |
Wafer Processing Laminate, Wafer Processing Member, Temporary Bonding Arrangement, And Thin Wafer Manufacturing Method
App 20130108866 - Kato; Hideto ; et al. | 2013-05-02 |
Temporary Adhesive Composition And Method For Manufacturing Thin Wafer Using The Same
App 20130089967 - YASUDA; Hiroyuki ; et al. | 2013-04-11 |
Alcoholic hydroxyl-containing compounds and making method
Grant 8,378,148 - Sakurai , et al. February 19, 2 | 2013-02-19 |
Wafer Processing Laminate, Wafer Processing Member, Temporary Bonding Arrangement, And Thin Wafer Manufacturing Method
App 20130029145 - Kato; Hideto ; et al. | 2013-01-31 |
Polymer Having Silphenylene And Siloxane Structures, A Method Of Preparing The Same, An Adhesive Composition, An Adhesive Sheet, A Protective Material For A Semiconductor Device, And A Semiconductor Device
App 20120299203 - SUGO; Michihiro ; et al. | 2012-11-29 |
Organopolysiloxane, Temporary Adhesive Composition Containing Organopolysiloxane, And Method Of Producing Thinned Wafer Using The Same
App 20120276717 - FURUYA; Masahiro ; et al. | 2012-11-01 |
Film-like Wafer Mold Material, Molded Wafer, And Semiconductor Device
App 20120235284 - SUGO; Michihiro ; et al. | 2012-09-20 |
Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation
Grant 8,263,308 - Tagami , et al. September 11, 2 | 2012-09-11 |
Polyimide resin produced by using silphenylene compound
Grant 8,252,882 - Sugo , et al. August 28, 2 | 2012-08-28 |
Wafer Mold Material And Method For Manufacturing Semiconductor Apparatus
App 20120139131 - SUGO; Michihiro ; et al. | 2012-06-07 |
Adhesive Composition, Adhesive Sheet, Semiconductor Apparatus Protection Material, And Semiconductor Apparatus
App 20120108762 - KONDO; Kazunori ; et al. | 2012-05-03 |
Phenolic OH-containing polyimide silicone, epoxy resin and curing agent
Grant 8,053,533 - Yoneda , et al. November 8, 2 | 2011-11-08 |
Silphenylene compound and process for producing the same
Grant 8,048,978 - Sugo , et al. November 1, 2 | 2011-11-01 |
Polyimide Resin Produced By Using Silphenylene Compound
App 20110251371 - SUGO; Michihiro ; et al. | 2011-10-13 |
Heat-curable polyimide silicone resin composition
Grant 7,981,976 - Yoneda , et al. July 19, 2 | 2011-07-19 |
Photo-curable Resin Composition, Pattern Forming Method And Substrate Protecting Film, And Film-shaped Adhesive And Adhesive Sheet Using Said Composition
App 20110143103 - Furuya; Masahiro ; et al. | 2011-06-16 |
Alcoholic Hydroxyl-containing Compounds And Making Method
App 20110082321 - SAKURAI; Takato ; et al. | 2011-04-07 |
Novel Polyimidesilicone Having Alcoholic Hydroxyl Group And Process For Producing The Same
App 20110077374 - SUGO; Michihiro ; et al. | 2011-03-31 |
Phenolic OH and radically polymerizable group containing polyimide silicone and epoxy resin
Grant 7,834,100 - Yoneda , et al. November 16, 2 | 2010-11-16 |
Novel Polyimide Silicone, Photosensitive Resin Composition Containing The Novel Polyimide Silicone, And Method For Pattern Formation
App 20100233619 - TAGAMI; Shohei ; et al. | 2010-09-16 |
Polyimide silicone resin and thermosetting composition comprising the same
Grant 7,781,541 - Sugo , et al. August 24, 2 | 2010-08-24 |
Polyimide having an alcoholic hydroxyl group and a process for the preparation thereof
Grant 7,678,874 - Sugo , et al. March 16, 2 | 2010-03-16 |
Solvent-free Polyimide Silicone Resin Composition And Cured Product Thereof
App 20100056730 - YONEDA; Yoshinori ; et al. | 2010-03-04 |
Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition
Grant 7,638,259 - Goto , et al. December 29, 2 | 2009-12-29 |
Silphenylene Compound And Process For Producing The Same
App 20090156753 - Sugo; Michihiro ; et al. | 2009-06-18 |
Polyimide Having An Alcoholic Hydroxyl Group And A Process For The Preparation Thereof
App 20090131620 - SUGO; Michihiro ; et al. | 2009-05-21 |
Heat-curable polyimide silicone Composition and a cured film therefrom
App 20090062479 - Yoneda; Yoshinori ; et al. | 2009-03-05 |
Heat-curable polyimide silicone resin composition
App 20090062480 - Yoneda; Yoshinori ; et al. | 2009-03-05 |
Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film
Grant 7,485,405 - Kato , et al. February 3, 2 | 2009-02-03 |
Solvent-free polymide silicone resin composition and a cured resin film thereof
Grant 7,432,313 - Yoneda , et al. October 7, 2 | 2008-10-07 |
Solvent-free polyimide silicone resin composition and a resin film composed of the same
Grant 7,405,244 - Yoneda , et al. July 29, 2 | 2008-07-29 |
Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition
App 20080057446 - Goto; Tomoyuki ; et al. | 2008-03-06 |
Polyimide silicone resin and thermosetting composition comprising the same
App 20070197680 - Sugo; Michihiro ; et al. | 2007-08-23 |
Imide silicone resin and production process therefor
Grant 7,256,248 - Sugo August 14, 2 | 2007-08-14 |
Siloxane copolymer, making method, and thermosetting resin composition
Grant 7,163,986 - Sugo January 16, 2 | 2007-01-16 |
Photosensitive resin and a method of preparing the same
App 20060183880 - Aoki; Yoshitaka ; et al. | 2006-08-17 |
Colorless and transparent polyimidesilicone resin having thermosetting functional groups
Grant 7,041,766 - Yoneda , et al. May 9, 2 | 2006-05-09 |
Solvent-free polyimide silicone resin composition and a resin film composed of the same
App 20060084714 - Yoneda; Yoshinori ; et al. | 2006-04-20 |
Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film
App 20060079658 - Kato; Hideto ; et al. | 2006-04-13 |
Polyimide having an alcoholic hydroxyl group and a process for the preparation thereof
App 20060069227 - Sugo; Michihiro ; et al. | 2006-03-30 |
Solvent-free polymide silicone resin composition and a cured resin film thereof
App 20060052476 - Yoneda; Yoshinori ; et al. | 2006-03-09 |
Siloxane copolymer, making method, and thermosetting resin composition
App 20040242829 - Sugo, Michihiro | 2004-12-02 |
Method of dry cleaning and dry cleaning solvent therefor
Grant 6,749,643 - Sugo , et al. June 15, 2 | 2004-06-15 |
Electrode-forming compositions and electrode members
Grant 6,723,432 - Sugo , et al. April 20, 2 | 2004-04-20 |
Colorless and transparent polyimidesilicone resin having thermosetting functional groups
App 20040072982 - Yoneda, Yoshinori ; et al. | 2004-04-15 |
Solventless polyimide silicone resin compositions
Grant 6,706,841 - Sugo , et al. March 16, 2 | 2004-03-16 |
Imide silicone resin and production process therefor
App 20040048997 - Sugo, Michihiro | 2004-03-11 |
Polyimide silicone resin, its solution composition, and polyimide silicone resin film
Grant 6,703,133 - Sugo , et al. March 9, 2 | 2004-03-09 |
Polyimide silicone resin, process for its production, and polyimide silicone resin composition
Grant 6,538,093 - Sugo , et al. March 25, 2 | 2003-03-25 |
Electrode-forming compositions and electrode members
App 20030040578 - Sugo, Michihiro ; et al. | 2003-02-27 |
Solventless polyimide silicone resin compositions
App 20020188069 - Sugo, Michihiro ; et al. | 2002-12-12 |
Method of dry cleaning and dry cleaning solvent therefor
App 20020116769 - Sugo, Michihiro ; et al. | 2002-08-29 |
Polyimide silicone resin, its solution composition, and polyimide silicone resin film
App 20020016408 - Sugo, Michihiro ; et al. | 2002-02-07 |
Polyimide silicone resin, process for its production, and polyimide silicone resin composition
App 20020016438 - Sugo, Michihiro ; et al. | 2002-02-07 |
Radiation-curable resin compositions
Grant 6,248,803 - Nakanishi , et al. June 19, 2 | 2001-06-19 |
Trimethylsiloxy group-containing polysiloxane and a process for producing the same
Grant 5,852,153 - Sugo , et al. December 22, 1 | 1998-12-22 |
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