SUGIURA; Motohiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for SUGIURA; Motohiko.The latest application filed is for "method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring board".

Company Profile

9.4.13

SUGIURA; Motohiko - Osaka JP
SUGIURA; Motohiko - Osaka-shi Osaka

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Manufacturing Dielectric Sheet, Method For Manufacturing Substrate For High-frequency Printed Wiring Board, Dielectric Sheet, And Substrate For High-frequency Printed Wiring Board App 20220272838 - KAIMORI; Shingo ; et al.	2022-08-25
Method Of Manufacturing Copper Nano-ink And Copper Nano-ink App 20210291271 - OKADA; Issei ; et al.	2021-09-23
Base material for printed circuit board and printed circuit board Grant 11,013,113 - Sugiura , et al. May 18, 2	2021-05-18
Base Material For Printed Circuit Board And Printed Circuit Board App 20210127487 - AIKAWA; Kenichiro ; et al.	2021-04-29
Base Material For Printed Circuit Board And Printed Circuit Board App 20210022245 - SUGIURA; Motohiko ; et al.	2021-01-21
Method Of Manufacturing Substrate For Printed Circuit Board App 20200344890 - SUGIURA; Motohiko ; et al.	2020-10-29
Base Material For Printed Circuit Board And Printed Circuit Board App 20200324517 - SUGIURA; Motohiko ; et al.	2020-10-15
Coating liquid for forming conductive layer, method for producing conductive layer, and conductive layer Grant 10,796,812 - Sugiura , et al. October 6, 2	2020-10-06
Base Material For Printed Circuit Board And Printed Circuit Board App 20200245458 - Kind Code	2020-07-30
Powder for conductive material, ink for conductive material, conductive paste, and method for producing powder for conductive material Grant 10,610,928 - Okada , et al.	2020-04-07
Coating Liquid For Forming Conductive Layer, Method For Producing Conductive Layer, And Conductive Layer App 20190077974 - SUGIURA; Motohiko ; et al.	2019-03-14
Powder For Conductive Material, Ink For Conductive Material, Conductive Paste, And Method For Producing Powder For Conductive Material App 20190054524 - OKADA; Issei ; et al.	2019-02-21
Substrate for printed circuit board and method for producing substrate for printed circuit board Grant 10,143,083 - Sugiura , et al. Nov	2018-11-27
Coating Liquid For Forming Conductive Layer And Method For Manufacturing Conductive Layer App 20180315519 - SUGIURA; Motohiko ; et al.	2018-11-01
Method For Manufacturing Titanium Trichloride Solution And Device For Manufacturing Titanium Trichloride Solution App 20180305829 - OKADA; Issei ; et al.	2018-10-25
Substrate For Printed Circuit Board And Method For Producing Substrate For Printed Circuit Board App 20170347449 - SUGIURA; Motohiko ; et al.	2017-11-30
Metal Nanoparticle Dispersion And Metal Coating Film App 20170213615 - OKADA; Issei ; et al.	2017-07-27

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