Sugioka; Akiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sugioka; Akiko.The latest application filed is for "thermoplastic resin composition and molded article thereof".

Company Profile

0.5.11

Sugioka; Akiko - Ageo N/A JP
Sugioka; Akiko - Tokyo JP
Sugioka; Akiko - Ageo-shi JP
Sugioka; Akiko - Saitama JP
Sugioka; Akiko - Ageo-City JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Catalyst Grant 9,180,440 - Yamaguchi , et al. November 10, 2	2015-11-10
Thermoplastic Resin Composition And Molded Article Thereof App 20150247037 - Sugioka; Akiko ; et al.	2015-09-03
Resin Composition And Molded Body Thereof App 20150065637 - Sugioka; Akiko ; et al.	2015-03-05
Catalyst App 20140213439 - Yamaguchi; Michitaka ; et al.	2014-07-31
Capacitor-forming Material And Printed Wiring Board Provided With Capacitor App 20110005817 - Ito; Ayumi ; et al.	2011-01-13
Material for forming capacitor layer and method for manufacturing the material for forming capacitor layer Grant 7,719,818 - Abe , et al. May 18, 2	2010-05-18
Method for Forming Oxide Dielectric Layer, and Capacitor Layer Forming Material Provided with Oxide Dielectric Layer Obtained by the Forming Method App 20080310073 - Kanno; Akihiro ; et al.	2008-12-18
Material for Forming Capacitor Layer and Method for Manufacturing the Material for Forming Capacitor Layer App 20080283283 - Abe; Naohiko ; et al.	2008-11-20
Capacitor Layer Forming Material, Manufacturing Method Thereof, and Printed Wiring Board with Embedded Capacitor Layer Obtained Using Capacitor Layer Forming Material App 20080257588 - Abe; Naohiko ; et al.	2008-10-23
Materials for forming capacitor layer and printed wiring board having embedded capacitor circuit obtained by using the same Grant 7,430,106 - Sugioka , et al. September 30, 2	2008-09-30
Capacitor Layer Forming Material and Printed Wiring Board Having Embedded Capacitor Layer Obtained by using the Capacitor Layer Forming Material App 20080130196 - Kanno; Akihiro ; et al.	2008-06-05
Materials for Forming Capacitor Layer and Printed Wiring Board Having Embedded Capacitor Circuit Obtained by Using the Same App 20070263339 - Sugioka; Akiko ; et al.	2007-11-15
Pure copper-coated copper foil and method of producing the same, and TAB tape and method of producing the same App 20050269673 - Sugioka, Akiko	2005-12-08
Thin film electro-luminescence device Grant 6,074,575 - Sugioka , et al. June 13, 2	2000-06-13

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