Sugimoto; Atsuhiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sugimoto; Atsuhiko.The latest application filed is for "wiring substrate and method for producing the same".

Company Profile

0.18.22

Sugimoto; Atsuhiko - Aichi JP
Sugimoto; Atsuhiko - Kagamigahara JP
SUGIMOTO; Atsuhiko - Kakamigahara-shi JP
SUGIMOTO; Atsuhiko - Kagamigahara-shi JP
Sugimoto; Atsuhiko - Gifu JP
Sugimoto; Atsuhiko - Nagoya JP
Sugimoto, Atsuhiko - Nagoya-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Glass panel for wiring board and method of manufacturing wiring board Grant 10,470,300 - Seki , et al. No	2019-11-05
Method of manufacturing multi-layer wiring board Grant 9,237,656 - Maeda , et al. January 12, 2	2016-01-12
Wiring Substrate And Method For Producing The Same App 20150366058 - HANDO; Takuya ; et al.	2015-12-17
Circuit Board, Manufacturing Method Therefor, And Pillar-shaped Terminal For Circuit Board App 20150364410 - HANDO; Takuya ; et al.	2015-12-17
Wiring board and method for manufacturing the same Grant 9,132,494 - Inoue , et al. September 15, 2	2015-09-15
Multilayer wiring board Grant 9,119,333 - Hando , et al. August 25, 2	2015-08-25
Wiring substrate and manufacturing method of the same Grant 9,059,152 - Inoue , et al. June 16, 2	2015-06-16
Method for manufacturing wiring board for mounting electronic component, wiring board for mounting electronic component, and method for manufacturing wiring board having an electronic component Grant 8,937,256 - Inoue , et al. January 20, 2	2015-01-20
Multilayer wiring board Grant 8,866,025 - Inoue , et al. October 21, 2	2014-10-21
Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring Substrate App 20140202740 - MAEDA; Shinnosuke ; et al.	2014-07-24
Method of manufacturing multilayer wiring substrate Grant 8,707,554 - Maeda , et al. April 29, 2	2014-04-29
Multilayered wiring substrate Grant 8,581,388 - Maeda , et al. November 12, 2	2013-11-12
Wiring Board And Method Of Manufacturing The Same App 20130180772 - INOUE; Masahiro ; et al.	2013-07-18
Method Of Manufacturing Multi-layer Wiring Board App 20130160290 - MAEDA; Shinnosuke ; et al.	2013-06-27
Multi-layer Wiring Substrate And Manufacturing Method Thereof App 20130161079 - MAEDA; Shinnosuke ; et al.	2013-06-27
Method Of Manufacturing Multilayer Wiring Substrate App 20130111746 - MAEDA; Shinnosuke ; et al.	2013-05-09
Wiring Substrate And Manufacturing Method Of The Same App 20130098670 - INOUE; Masahiro ; et al.	2013-04-25
Wiring Substrate And Manufacturing Method Of The Same App 20130100626 - INOUE; Masahiro ; et al.	2013-04-25
Wiring board having wiring laminate portion with via conductors embedded in resin insulating layers Grant 8,319,111 - Saiki , et al. November 27, 2	2012-11-27
Multilayer Wiring Board App 20120211271 - HANDO; Takuya ; et al.	2012-08-23
Method For Manufacturing Wiring Board For Mounting Electronic Component, Wiring Board For Mounting Electronic Component, And Method For Manufacturing Wiring Board Having An Electronic Component App 20120186857 - INOUE; Masahiro ; et al.	2012-07-26
Wiring Board And Method For Manufacturing The Same App 20120186864 - INOUE; Masahiro ; et al.	2012-07-26
Multilayer Wiring Board App 20120186863 - INOUE; Masahiro ; et al.	2012-07-26
Electronic-component-mounted Wiring Substrate And Method Of Manufacturing The Same App 20120111616 - INOUE; Masahiro ; et al.	2012-05-10
Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring Substrate App 20110155443 - MAEDA; Shinnosuke ; et al.	2011-06-30
Multilayered Wiring Substrate App 20110156272 - MAEDA; Shinnosuke ; et al.	2011-06-30
Multilayer Wiring Substrate App 20110155438 - ITO; Tatsuya ; et al.	2011-06-30
Wiring Board App 20080083560 - Saiki; Hajime ; et al.	2008-04-10
Process for manufacturing a wiring substrate Grant 7,202,156 - Saiki , et al. April 10, 2	2007-04-10
Wiring substrate and process for manufacturing the same Grant 7,122,894 - Sugimoto , et al. October 17, 2	2006-10-17
Wiring substrate and process for manufacturing the same App 20050253263 - Sugimoto, Atsuhiko ; et al.	2005-11-17
Process for manufacturing a wiring substrate App 20050102830 - Saiki, Hajime ; et al.	2005-05-19
Process for manufacturing a wiring substrate App 20050102831 - Saiki, Hajime ; et al.	2005-05-19
Process for manufacturing a wiring substrate App 20050106854 - Saiki, Hajime ; et al.	2005-05-19

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