loadpatents
name:-0.0073039531707764
name:-0.0042719841003418
name:-0.0005340576171875
Sugihara; Shintaro Patent Filings

Sugihara; Shintaro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sugihara; Shintaro.The latest application filed is for "bonding device and bonding system".

Company Profile
0.3.7
  • Sugihara; Shintaro - Koshi JP
  • Sugihara; Shintaro - Kumamoto JP
  • SUGIHARA; Shintaro - Koshi City JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Joining device and joining system
Grant 9,960,069 - Sugihara , et al. May 1, 2
2018-05-01
Bonding device and bonding system
Grant 9,694,572 - Sugihara , et al. July 4, 2
2017-07-04
Joining device, joining system and joining method
Grant 9,263,268 - Yamamoto , et al. February 16, 2
2016-02-16
Bonding Device And Bonding System
App 20150129137 - SUGIHARA; Shintaro ;   et al.
2015-05-14
Joining Device, Joining System And Joining Method
App 20140349465 - YAMAMOTO; Masahiro ;   et al.
2014-11-27
Joining Device And Joining System
App 20140208557 - SUGIHARA; Shintaro ;   et al.
2014-07-31
Joining Device And Joining System
App 20140208556 - SUGIHARA; Shintaro ;   et al.
2014-07-31
Bonding Apparatus, Bonding System And Bonding Method
App 20130133828 - YOSHITAKA; Naoto ;   et al.
2013-05-30
Joint Apparatus, Joint System, And Joint Method
App 20130062013 - OKADA; Shinji ;   et al.
2013-03-14

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