| Patent | Date |
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Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
Grant 7,745,328 - Yim , et al. June 29, 2 | 2010-06-29 |
Low Dielectric (low K) Barrier Films With Oxygen Doping By Plasma-enhanced Chemical Vapor Deposition (pecvd)
App 20090053902 - Yim; Kang Sub ; et al. | 2009-02-26 |
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
Grant 7,465,659 - Yim , et al. December 16, 2 | 2008-12-16 |
Adhesion improvement for low k dielectrics
Grant 7,459,404 - Li , et al. December 2, 2 | 2008-12-02 |
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
Grant 7,157,384 - Yim , et al. January 2, 2 | 2007-01-02 |
CVD plasma assisted lower dielectric constant SICOH film
Grant 7,153,787 - Cho , et al. December 26, 2 | 2006-12-26 |
New Low Dielectric (low K) Barrier Films With Oxygen Doping By Plasma-enhanced Chemical Vapor Deposition (pecvd)
App 20060246737 - Yim; Kang Sub ; et al. | 2006-11-02 |
Method of depositing dielectric films
Grant 7,117,064 - Nemani , et al. October 3, 2 | 2006-10-03 |
Adhesion improvement for low k dielectrics
App 20060189162 - Huang; Lihua Li ; et al. | 2006-08-24 |
Method and apparatus for deposition of low dielectric constant materials
App 20060144334 - Yim; Kang Sub ; et al. | 2006-07-06 |
Method of depositing dielectric films
App 20060141805 - Nemani; Srinivas D. ; et al. | 2006-06-29 |
Method and apparatus for deposition of low dielectric constant materials
Grant 7,008,484 - Yim , et al. March 7, 2 | 2006-03-07 |
Method of depositing dielectric films
Grant 7,001,850 - Nemani , et al. February 21, 2 | 2006-02-21 |
Adhesion improvement for low k dielectrics
App 20050202685 - Huang, Lihua Li ; et al. | 2005-09-15 |
CVD plasma assisted lower dielectric constant SICOH film
Grant 6,943,127 - Cho , et al. September 13, 2 | 2005-09-13 |
CVD plasma assisted lower dielectric constant sicoh film
App 20050153572 - Cho, Seon-Mee ; et al. | 2005-07-14 |
Methods of reducing plasma-induced damage for advanced plasma CVD dielectrics
Grant 6,911,403 - Li , et al. June 28, 2 | 2005-06-28 |
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
App 20050130440 - Yim, Kang Sub ; et al. | 2005-06-16 |
Methods of reducing plasma-induced damage for advanced plasma CVD dielectrics
App 20050042885 - Li, Lihua ; et al. | 2005-02-24 |
Method of depositing dielectric films
App 20050020048 - Nemani, Srinivas D. ; et al. | 2005-01-27 |
Method for producing semiconductor including forming a layer containing at least silicon carbide and forming a second layer containing at least silicon oxygen carbide
Grant 6,838,393 - Yim , et al. January 4, 2 | 2005-01-04 |
Damascene structure fabricated using a layer of silicon-based photoresist material
Grant 6,825,562 - Naik , et al. November 30, 2 | 2004-11-30 |
Method of depositing dielectric films
Grant 6,764,958 - Nemani , et al. July 20, 2 | 2004-07-20 |
Reacting an organosilicon compound with an oxidizing gas to form an ultra low k dielectric
App 20030211244 - Li, Lihua ; et al. | 2003-11-13 |
Method and apparatus for deposition of low dielectric constant materials
App 20030207033 - Yim, Kang Sub ; et al. | 2003-11-06 |
Method of depositing low dielectric constant carbon doped silicon oxide
Grant 6,632,735 - Yau , et al. October 14, 2 | 2003-10-14 |
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (pecvd)
App 20030139035 - Yim, Kang Sub ; et al. | 2003-07-24 |
Process for depositing and developing a plasma polymerized organosilicon photoresist film
Grant 6,589,715 - Joubert , et al. July 8, 2 | 2003-07-08 |
CVD plasma assisted lower dielectric constant sicoh film
App 20030104708 - Cho, Seon-Mee ; et al. | 2003-06-05 |
Damascene structure fabricated using a layer of silicon-based photoresist material
App 20030062627 - Naik, Mehul B. ; et al. | 2003-04-03 |
Method of depositing low dielectric constant carbon doped silicon oxide
App 20030032305 - Yau, Wai-Fan ; et al. | 2003-02-13 |
Damascene structure fabricated using a layer of silicon-based photoresist material
Grant 6,514,857 - Naik , et al. February 4, 2 | 2003-02-04 |
Cvd Plasma Assisted Lower Dielectric Constant Sicoh Film
App 20030003768 - Cho, Seon-Mee ; et al. | 2003-01-02 |
CVD plasma assisted lower dielectric constant sicoh film
Grant 6,486,082 - Cho , et al. November 26, 2 | 2002-11-26 |
Process for depositing and developing a plasma polymerized organosilicon photoresist film
App 20010012592 - Joubert, Olivier ; et al. | 2001-08-09 |
Method for using bypass lines to stabilize gas flow and maintain plasma inside a deposition chamber
Grant 6,258,735 - Xia , et al. July 10, 2 | 2001-07-10 |
Process for depositing a plasma polymerized organosilicon photoresist film
Grant 6,238,844 - Joubert , et al. May 29, 2 | 2001-05-29 |
Damascene structure fabricated using a layer of silicon-based photoresist material
Grant 6,204,168 - Naik , et al. March 20, 2 | 2001-03-20 |
Method and apparatus for depositing deep UV photoresist films
Grant 6,090,530 - Weidman , et al. July 18, 2 | 2000-07-18 |
Process for depositing high deposition rate halogen-doped silicon oxide layer
Grant 6,077,764 - Sugiarto , et al. June 20, 2 | 2000-06-20 |
Method and apparatus for depositing deep UV photoresist films
Grant 5,885,751 - Weidman , et al. March 23, 1 | 1999-03-23 |
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