| Patent | Date |
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Winding-type Electrode Body Of Non-aqueous Electrolyte Secondary Battery, And Non-aqueous Electrolyte Secondary Battery
App 20210050586 - Nishino; Hajime ; et al. | 2021-02-18 |
Lithium Ion Secondary Battery And Method For Producing The Same
App 20190181495 - Tani; Yuji ; et al. | 2019-06-13 |
Semiconductor device, package, and vehicle
Grant 10,186,479 - Katsumura , et al. Ja | 2019-01-22 |
Semiconductor device, embedded capacitor unit, semiconductor package, and method of manufacturing embedded capacitor unit
Grant 9,905,501 - Sugaya , et al. February 27, 2 | 2018-02-27 |
Semiconductor Device, Package, And Vehicle
App 20170162490 - KATSUMURA; HIDENORI ; et al. | 2017-06-08 |
Semiconductor Device, Embedded Capacitor Unit, Semiconductor Package, And Method Of Manufacturing Embedded Capacitor Unit
App 20170077019 - SUGAYA; YASUHIRO ; et al. | 2017-03-16 |
Resistance-formed Substrate And Method For Manufacturing Same
App 20140008104 - Sugaya; Yasuhiro ; et al. | 2014-01-09 |
Passive component incorporating interposer
Grant 7,968,800 - Sasaoka , et al. June 28, 2 | 2011-06-28 |
Transfer material used for producing a wiring substrate
Grant 7,888,789 - Sugaya , et al. February 15, 2 | 2011-02-15 |
Multilayer wiring board
Grant 7,821,795 - Sugaya , et al. October 26, 2 | 2010-10-26 |
Passive Component Incorporating Interposer
App 20100155119 - Sasaoka; Tatsuo ; et al. | 2010-06-24 |
Mounting board, mounted body, and electronic equipment using the same
Grant 7,667,977 - Sugaya , et al. February 23, 2 | 2010-02-23 |
Mounting Board, Mounted Body, and Electronic Equipment Using the Same
App 20080290497 - Sugaya; Yasuhiro ; et al. | 2008-11-27 |
Electronic component built-in module and method of manufacturing the same
Grant 7,394,663 - Yamashita , et al. July 1, 2 | 2008-07-01 |
Semiconductor device and method for manufacturing the same
Grant 7,390,692 - Sugaya , et al. June 24, 2 | 2008-06-24 |
Circuit board with built-in electronic component and method for manufacturing the same
Grant 7,341,890 - Ishimaru , et al. March 11, 2 | 2008-03-11 |
Component built-in module and method for producing the same
Grant 7,294,587 - Asahi , et al. November 13, 2 | 2007-11-13 |
Multilayer Wiring Board, Method for Manufacturing Such Multilayer Wiring Board, and Semiconductor Device and Electronic Device Using Multilayer Wiring Board
App 20070242440 - Sugaya; Yasuhiro ; et al. | 2007-10-18 |
Optical Transmission Channel Board, Board With Built-in Optical Transmission Channel, And Data Processing Apparatus
App 20070224735 - Karashima; Seiji ; et al. | 2007-09-27 |
Module with built-in circuit component and method for producing the same
Grant 7,248,482 - Asahi , et al. July 24, 2 | 2007-07-24 |
Method for manufacturing surface acoustic wave device
Grant 7,246,421 - Namba , et al. July 24, 2 | 2007-07-24 |
Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatus
Grant 7,242,823 - Karashima , et al. July 10, 2 | 2007-07-10 |
Component built-in module and method for producing the same
Grant 7,198,996 - Nakatani , et al. April 3, 2 | 2007-04-03 |
Wiring board embedded with spherical semiconductor element
App 20070069393 - Asahi; Toshiyuki ; et al. | 2007-03-29 |
Composite electronic component
Grant 7,187,071 - Tsuneoka , et al. March 6, 2 | 2007-03-06 |
Circuit component built-in module and method for manufacturing the same
Grant 7,180,169 - Ishimaru , et al. February 20, 2 | 2007-02-20 |
Semiconductor device and method for manufacturing the same
App 20060290009 - Sugaya; Yasuhiro ; et al. | 2006-12-28 |
Module with a built-in semiconductor and method for producing the same
Grant 7,141,884 - Kojima , et al. November 28, 2 | 2006-11-28 |
Mount assembly, optical transmission line and photoelectric circuit board
Grant 7,136,543 - Nishiyama , et al. November 14, 2 | 2006-11-14 |
Method for manufacturing electric element built-in module with sealed electric element
Grant 7,134,198 - Nakatani , et al. November 14, 2 | 2006-11-14 |
Semiconductor device and method for manufacturing the same
Grant 7,132,756 - Sugaya , et al. November 7, 2 | 2006-11-07 |
Composite electronic component
App 20060244123 - Tsuneoka; Michiaki ; et al. | 2006-11-02 |
Circuit board with built-in electronic component and method for manufacturing the same
App 20060244119 - Ishimaru; Yukihiro ; et al. | 2006-11-02 |
Circuit board with built-in electronic component and method for manufacturing the same
Grant 7,091,593 - Ishimaru , et al. August 15, 2 | 2006-08-15 |
Semiconductor built-in millimeter-wave band module
Grant 7,061,100 - Iwaki , et al. June 13, 2 | 2006-06-13 |
Transfer sheet and wiring board using the same, and method of manufacturing the same
App 20060078669 - Sugaya; Yasuhiro ; et al. | 2006-04-13 |
Circuit component built-in module with embedded semiconductor chip and method of manufacturing
Grant 7,018,866 - Sugaya , et al. March 28, 2 | 2006-03-28 |
Method for producing a capacitor-embedded circuit board
Grant 7,013,561 - Nakatani , et al. March 21, 2 | 2006-03-21 |
Transfer sheet and wiring board using the same, and method of manufacturing the same
Grant 7,001,662 - Sugaya , et al. February 21, 2 | 2006-02-21 |
Surface acoustic wave device, its manufacturing method, and electronic circuit device
App 20060006760 - Namba; Akihiko ; et al. | 2006-01-12 |
Component built-in module and method for producing the same
Grant 6,975,516 - Asahi , et al. December 13, 2 | 2005-12-13 |
Component built-in module and method for producing the same
App 20050269681 - Asahi, Toshiyuki ; et al. | 2005-12-08 |
Surface acoustic wave device, method for manufacturing, and electronic circuit device
Grant 6,969,945 - Namba , et al. November 29, 2 | 2005-11-29 |
Dielectric filter, antenna duplexer
Grant 6,965,284 - Maekawa , et al. November 15, 2 | 2005-11-15 |
Dielectric resonator, dielectric filter and method of producing the same, filter device combined to a transmit-receive antenna and communication apparatus using the same
App 20050236103 - Sugaya, Yasuhiro ; et al. | 2005-10-27 |
Component built-in module and method for producing the same
App 20050230848 - Nakatani, Seiichi ; et al. | 2005-10-20 |
Method of manufacturing a component built-in module
Grant 6,955,948 - Asahi , et al. October 18, 2 | 2005-10-18 |
Fabrication method for optical transmission channel board, optical transmission channel board, board with built-in optical transmission channel, fabrication method for board with built-in optical transmission channel, and data processing apparatus
App 20050196095 - Karashima, Seiji ; et al. | 2005-09-08 |
Component built-in module and method for producing the same
Grant 6,939,738 - Nakatani , et al. September 6, 2 | 2005-09-06 |
Wiring substrate produced by transfer material method
Grant 6,936,774 - Sugaya , et al. August 30, 2 | 2005-08-30 |
Wiring substrate produced by transfer material method
App 20050186768 - Sugaya, Yasuhiro ; et al. | 2005-08-25 |
Circuit component built-in module, radio device having the same, and method for producing the same
Grant 6,931,725 - Sugaya , et al. August 23, 2 | 2005-08-23 |
Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling member of the module
Grant 6,885,788 - Iwaki , et al. April 26, 2 | 2005-04-26 |
Transfer material for wiring substrate
Grant 6,871,396 - Sugaya , et al. March 29, 2 | 2005-03-29 |
Circuit component built-in module and method for manufacturing the same
App 20050045369 - Ishimaru, Yukihiro ; et al. | 2005-03-03 |
Insulation sheet, multi-layer wiring substrate and production processes thereof
Grant 6,855,892 - Komatsu , et al. February 15, 2 | 2005-02-15 |
Circuit board with in-built electronic component and method for manufacturing the same
App 20050006142 - Ishimaru, Yukihiro ; et al. | 2005-01-13 |
Module with a built-in semiconductor and method for producing the same
App 20050001331 - Kojima, Toshiyuki ; et al. | 2005-01-06 |
Mount assembly, optical transmission line and photoelectric circuit board
App 20050002608 - Nishiyama, Tousaku ; et al. | 2005-01-06 |
Module with built-in circuit component and method for producing the same
App 20040226744 - Asahi, Toshiyuki ; et al. | 2004-11-18 |
Wiring board, method for manufacturing a wiring board and electronic equipment
App 20040194999 - Tomita, Yoshihiro ; et al. | 2004-10-07 |
Transfer sheet and wiring board using the same, and method of manufacturing the same
App 20040191491 - Sugaya, Yasuhiro ; et al. | 2004-09-30 |
Module with built-in electronic elements and method of manufacture thereof
Grant 6,798,121 - Nakatani , et al. September 28, 2 | 2004-09-28 |
Circuit component built-in module with embedded semiconductor chip and method of manufacturing
Grant 6,784,530 - Sugaya , et al. August 31, 2 | 2004-08-31 |
Component built-in module and method for producing the same
App 20040158980 - Nakatani, Seiichi ; et al. | 2004-08-19 |
Electronic component built-in module and method of manufacturing the same
App 20040160752 - Yamashita, Yoshihisa ; et al. | 2004-08-19 |
Circuit component built-in module with embedded semiconductor chip and method of manufacturing
App 20040145044 - Sugaya, Yasuhiro ; et al. | 2004-07-29 |
Component built-in module and method for producing the same
Grant 6,734,542 - Nakatani , et al. May 11, 2 | 2004-05-11 |
Semiconductor device and method for manufacturing the same
App 20040084769 - Sugaya, Yasuhiro ; et al. | 2004-05-06 |
Electric element built-in module and method for manufacturing the same
App 20040040740 - Nakatani, Seiichi ; et al. | 2004-03-04 |
Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board and manufacturing method of double-sided wiring board
Grant 6,696,139 - Sugaya , et al. February 24, 2 | 2004-02-24 |
Surface acoustic wave device its manufacturing method and electronic circuit device
App 20040026361 - Namba, Akihiko ; et al. | 2004-02-12 |
Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling of member the module
App 20040001661 - Iwaki, Hideki ; et al. | 2004-01-01 |
Semiconductor built -in millimeter-wave band module
App 20030189246 - Iwaki, Hideki ; et al. | 2003-10-09 |
Circuit component built-in module, radio device having the same, and method for producing the same
App 20030141105 - Sugaya, Yasuhiro ; et al. | 2003-07-31 |
Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board
App 20030141006 - Sugaya, Yasuhiro ; et al. | 2003-07-31 |
Dielectric filter, antenna duplexer
App 20030141948 - Maekawa, Tomoya ; et al. | 2003-07-31 |
Circuit component built-in module and method of manufacturing the same
App 20030137045 - Sugaya, Yasuhiro ; et al. | 2003-07-24 |
Metal wiring board, semiconductor device, and method for manufacturing the same
App 20030127725 - Sugaya, Yasuhiro ; et al. | 2003-07-10 |
Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
App 20030116348 - Nakatani, Seiichi ; et al. | 2003-06-26 |
Transfer material method for producing the same and wiring substrate produced by using the same
App 20030102153 - Sugaya, Yasuhiro ; et al. | 2003-06-05 |
Component built-in module and method for producing the same
App 20030090883 - Asahi, Toshiyuki ; et al. | 2003-05-15 |
Insulation sheet and multi-layer wiring substrate and production processes thereof
App 20030085058 - Komatsu, Shingo ; et al. | 2003-05-08 |
Component built-in module and method of manufacturing the same
App 20030062624 - Asahi, Toshiyuki ; et al. | 2003-04-03 |
Circuit component built-in module, radio device having the same, and method for producing the same
Grant 6,538,210 - Sugaya , et al. March 25, 2 | 2003-03-25 |
Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
Grant 6,525,921 - Nakatani , et al. February 25, 2 | 2003-02-25 |
Dielectric resonator, dielectric filter and method of producing the same, filter device combined to a transmit-receive antenna and communication apparatus using the same
App 20030034124 - Sugaya, Yasuhiro ; et al. | 2003-02-20 |
Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board
Grant 6,521,069 - Sugaya , et al. February 18, 2 | 2003-02-18 |
Component built-in module and method of manufacturing the same
Grant 6,489,685 - Asahi , et al. December 3, 2 | 2002-12-03 |
Module with built-in electronic elements and method of manufacture thereof
App 20020159242 - Nakatani, Seiichi ; et al. | 2002-10-31 |
Component built-in module and method of manufacturing the same
App 20020135058 - Asahi, Toshiyuki ; et al. | 2002-09-26 |
Component built-in module and method for producing the same
App 20020117743 - Nakatani, Seiichi ; et al. | 2002-08-29 |
Circuit component built-in module, radio device having the same, and method for producing the same
App 20010030059 - Sugaya, Yasuhiro ; et al. | 2001-10-18 |
Transfer material, method for producing the same and wiring substrate produced by using the same
App 20010023779 - Sugaya, Yasuhiro ; et al. | 2001-09-27 |
Composite material comprising metallic alloy grains coated with a dielectric substance
Grant 5,352,522 - Kugimiya , et al. * October 4, 1 | 1994-10-04 |
Magnetic sintered composite material
Grant 5,350,628 - Kugimiya , et al. * September 27, 1 | 1994-09-27 |
Magnetic material
Grant 5,238,507 - Kugimiya , et al. August 24, 1 | 1993-08-24 |
Composite material and a method for producing the same
Grant 5,183,631 - Kugimiya , et al. February 2, 1 | 1993-02-02 |
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