loadpatents
name:-0.058775901794434
name:-0.059471130371094
name:-0.0025339126586914
Sugano; Toshio Patent Filings

Sugano; Toshio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sugano; Toshio.The latest application filed is for "memory module and memory system".

Company Profile
3.57.47
  • Sugano; Toshio - Luxembourg LU
  • Sugano; Toshio - Kodaira JP
  • Sugano; Toshio - Sagamihara JP
  • Sugano; Toshio - Tokyo JP
  • Sugano; Toshio - Sagamihara-shi JP
  • - Tokyo JP
  • Sugano; Toshio - Kotsubo JP
  • Sugano; Toshio - Kokubunji JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Memory Module and Memory System
App 20190103152 - Matsui; Yoshinori ;   et al.
2019-04-04
Memory module and memory system
Grant 10,147,479 - Matsui , et al. De
2018-12-04
Memory Module and Memory System
App 20180286472 - Matsui; Yoshinori ;   et al.
2018-10-04
Apparatuses and methods for a memory device with dual common data I/O lines
Grant 10,049,722 - Saito , et al. August 14, 2
2018-08-14
Apparatuses And Methods For A Memory Device With Dual Common Data I/o Lines
App 20180197595 - Saito; Shunichi ;   et al.
2018-07-12
Memory module and memory system
Grant 9,990,982 - Matsui , et al. June 5, 2
2018-06-05
Semiconductor device
Grant 9,837,137 - Saito , et al. December 5, 2
2017-12-05
Apparatuses and methods for a memory device with dual common data I/O lines
Grant 9,805,786 - Saito , et al. October 31, 2
2017-10-31
Semiconductor device having silicon interposer on which semiconductor chip is mounted
Grant 9,570,375 - Hiraishi , et al. February 14, 2
2017-02-14
Semiconductor Device
App 20160267962 - Saito; Shunichi ;   et al.
2016-09-15
Semiconductor device
Grant 9,368,185 - Saito , et al. June 14, 2
2016-06-14
Memory module and memory system
Grant RE45,928 - Matsui , et al. March 15, 2
2016-03-15
Memory module including plural memory devices and data register buffer
Grant 9,076,500 - Osanai , et al. July 7, 2
2015-07-07
Semiconductor Device
App 20150098289 - Saito; Shunichi ;   et al.
2015-04-09
Semiconductor device having ODT function
Grant 8,988,952 - Hiraishi , et al. March 24, 2
2015-03-24
Apparatus having a wiring board and memory devices
Grant 8,922,029 - Hiraishi , et al. December 30, 2
2014-12-30
Apparatus having a wiring board and memory devices
Grant 08922029 -
2014-12-30
Memory Module And Memory System
App 20140369148 - MATSUI; Yoshinori ;   et al.
2014-12-18
Memory module and memory system
Grant 8,854,854 - Matsui , et al. October 7, 2
2014-10-07
Semiconductor Device Having Silicon Interposer On Which Semiconductor Chip Is Mounted
App 20140001639 - HIRAISHI; Atsushi ;   et al.
2014-01-02
Load Reduced Memory Module And Memory System Including The Same
App 20130215659 - SAITO; Shunichi ;   et al.
2013-08-22
Semiconductor Device Having Odt Function
App 20130163353 - HIRAISHI; Atsushi ;   et al.
2013-06-27
Memory Module Including Plural Memory Devices And Data Register Buffer
App 20130135916 - OSANAI; Fumiyuki ;   et al.
2013-05-30
Memory Module Including Plural Memory Devices And Command Address Register Buffer
App 20130138898 - OSANAI; Fumiyuki ;   et al.
2013-05-30
Load reduced memory module and memory system including the same
Grant 8,422,263 - Saito , et al. April 16, 2
2013-04-16
Memory Module And Memory System
App 20120262974 - MATSUI; Yoshinori ;   et al.
2012-10-18
Memory Module Having Memory Chip And Register Buffer
App 20120250264 - OSANAI; Fumiyuki ;   et al.
2012-10-04
Memory module and memory system
Grant 8,238,134 - Matsui , et al. August 7, 2
2012-08-07
Multi-layer printed wiring board
Grant 8,198,549 - Saito , et al. June 12, 2
2012-06-12
Apparatus Having A Wiring Board And Memory Devices
App 20120127675 - HIRAISHI; ATSUSHI ;   et al.
2012-05-24
Address line wiring structure and printed wiring board having same
Grant 8,134,239 - Hiraishi , et al. March 13, 2
2012-03-13
Memory module and memory device
Grant 7,965,531 - Matsui , et al. June 21, 2
2011-06-21
Memory Module And Memory System
App 20110141789 - MATSUI; Yoshinori ;   et al.
2011-06-16
Load reduced memory module and memory system including the same
App 20100309706 - Saito; Shunichi ;   et al.
2010-12-09
Load reduced memory module
App 20100312956 - Hiraishi; Atsushi ;   et al.
2010-12-09
Load reduced memory module
App 20100312925 - Osanai; Fumiyuki ;   et al.
2010-12-09
Signal transmission circuit and characteristic adjustment method thereof, memory module, and manufacturing method of circuit board
Grant 7,777,517 - Hiraishi , et al. August 17, 2
2010-08-17
Semiconductor package with bypass capacitor
Grant 7,667,317 - Osanai , et al. February 23, 2
2010-02-23
Stacked semiconductor package
Grant 7,642,635 - Kikuchi , et al. January 5, 2
2010-01-05
Memory Module And Memory Device
App 20090219745 - Matsui; Yoshinori ;   et al.
2009-09-03
Memory module and memory device
Grant 7,548,444 - Matsui , et al. June 16, 2
2009-06-16
Signal transmission circuit and characteristic adjustment method thereof, memory module, and manufacturing method of circuit board
App 20090140766 - Hiraishi; Atsushi ;   et al.
2009-06-04
Address Line Wiring Structure And Printed Wiring Board Having Same
App 20090086522 - HIRAISHI; Atsushi ;   et al.
2009-04-02
Semiconductor package
App 20090001548 - Osanai; Fumiyuki ;   et al.
2009-01-01
Memory module
Grant 7,440,289 - Sugano , et al. October 21, 2
2008-10-21
Multi-layer printed wiring board
App 20080164058 - Saito; Shunichi ;   et al.
2008-07-10
Memory module
App 20080123303 - Sugano; Toshio ;   et al.
2008-05-29
Memory module and memory device
App 20080111582 - Matsui; Yoshinori ;   et al.
2008-05-15
Memory module and memory system
Grant 7,327,590 - Matsui , et al. February 5, 2
2008-02-05
Semiconductor package
App 20070273021 - Osanai; Fumiyuki ;   et al.
2007-11-29
Semiconductor device and a memory system including a plurality of IC chips in a common package
Grant 7,227,251 - Sakuma , et al. June 5, 2
2007-06-05
Memory module and memory system
App 20060262587 - Matsui; Yoshinori ;   et al.
2006-11-23
Memory module and memory system
Grant 7,123,497 - Matsui , et al. October 17, 2
2006-10-17
Stacked semiconductor device including improved lead frame arrangement
Grant 7,122,883 - Masuda , et al. October 17, 2
2006-10-17
Memory-Module with an increased density for mounting semiconductor chips
Grant 7,102,221 - Miyamoto , et al. September 5, 2
2006-09-05
Stacked semiconductor device including improved lead frame arrangement
Grant 7,012,321 - Masuda , et al. March 14, 2
2006-03-14
Register capable of corresponding to wide frequency band and signal generating method using the same
Grant 6,986,072 - Nishio , et al. January 10, 2
2006-01-10
Bus system, memory system, printed circuit board and directional coupler
Grant 6,978,328 - Osaka , et al. December 20, 2
2005-12-20
Semiconductor device and a memory system including a plurality of IC chips in a common package
App 20050184380 - Sakuma, Kazuki ;   et al.
2005-08-25
Stacked semiconductor device including improved lead frame arrangement
App 20050094433 - Masuda, Masachika ;   et al.
2005-05-05
Memory system and memory module
App 20050091440 - Isa, Satoshi ;   et al.
2005-04-28
Semiconductor device and a memory system including a plurality of IC chips in a common package
Grant 6,885,092 - Sakuma , et al. April 26, 2
2005-04-26
Memory module and memory system
App 20040257847 - Matsui, Yoshinori ;   et al.
2004-12-23
Stacked semiconductor package
App 20040227222 - Kikuchi, Wataru ;   et al.
2004-11-18
Semiconductor device and process for manufacturing the same
Grant 6,788,560 - Sugano , et al. September 7, 2
2004-09-07
Semiconductor device, a semiconductor module loaded with said semiconductor device and a method of manufacturing said semiconductor device
Grant 6,756,661 - Tsuneda , et al. June 29, 2
2004-06-29
Semiconductor device and process for manufacturing the same
Grant 6,744,656 - Sugano , et al. June 1, 2
2004-06-01
Register without restriction of number of mounted memory devices and memory module having the same
Grant 6,707,726 - Nishio , et al. March 16, 2
2004-03-16
Directional coupling memory module
Grant 6,654,270 - Osaka , et al. November 25, 2
2003-11-25
Semiconductor device
Grant 6,617,196 - Iwaya , et al. September 9, 2
2003-09-09
Stacked semiconductor device including improved lead frame arrangement
App 20030164542 - Masuda, Masachika ;   et al.
2003-09-04
Memory-module and a method of manufacturing the same
App 20030116835 - Miyamoto, Toshio ;   et al.
2003-06-26
Memory-module and a method of manufacturing the same
App 20030089978 - Miyamoto, Toshio ;   et al.
2003-05-15
Stacked semiconductor device including improved lead frame arrangement
Grant 6,555,918 - Masuda , et al. April 29, 2
2003-04-29
Register without restriction of number of mounted memory devices and memory module having the same
App 20030031060 - Nishio, Yoji ;   et al.
2003-02-13
Register capable of corresponding to wide frequency band and signal generating method using the same
App 20030025540 - Nishio, Yoji ;   et al.
2003-02-06
Directional coupling memory module
App 20030007379 - Osaka, Hideki ;   et al.
2003-01-09
Semiconductor device
Grant 6,452,266 - Iwaya , et al. September 17, 2
2002-09-17
Directional coupling memory module
Grant 6,438,012 - Osaka , et al. August 20, 2
2002-08-20
Stacked semiconductor device including improved lead frame arrangement
App 20020102763 - Masuda, Masachika ;   et al.
2002-08-01
Semiconductor device
App 20020056911 - Iwaya, Akihiko ;   et al.
2002-05-16
Semiconductor device
App 20020053732 - Iwaya, Akihiko ;   et al.
2002-05-09
Semiconductor device
App 20020043719 - Iwaya, Akihiko ;   et al.
2002-04-18
Semiconductor Device And Process For Manufacturing The Same
App 20020001216 - SUGANO, TOSHIO ;   et al.
2002-01-03
Semiconductor device, a semiconductor module loaded with said semiconductor device and a method of manufacturing said semiconductor device
App 20010026008 - Tsuneda, Kensuke ;   et al.
2001-10-04
Semiconductor devicse, a semicinductor module loaded with said semiconductor device and a method of manufacturing said semicoductor device
App 20010026009 - Tsunesa, Kensuke ;   et al.
2001-10-04
Stacked semiconductor device including improved lead frame arrangement
App 20010023088 - Masuda, Masachika ;   et al.
2001-09-20
Semiconductor device and process for manufacturing the same
Grant 6,288,924 - Sugano , et al. September 11, 2
2001-09-11
Semiconductor device and process for manufacturing the same
Grant 6,215,687 - Sugano , et al. April 10, 2
2001-04-10
Semiconductor device
Grant 6,169,325 - Azuma , et al. January 2, 2
2001-01-02
Semiconductor memory module having double-sided stacked memory chip layout
Grant 5,910,685 - Watanabe , et al. June 8, 1
1999-06-08
Semiconductor integrated circuit device, and process and apparatus for manufacturing the same
Grant 5,910,010 - Nishizawa , et al. June 8, 1
1999-06-08
Memory module and an IC card
Grant 5,838,549 - Nagata , et al. November 17, 1
1998-11-17
Stacked semiconductor memory device and semiconductor memory module containing the same
Grant 5,334,875 - Sugano , et al. * August 2, 1
1994-08-02
High packing density module board and electronic device having such module board
Grant 5,220,491 - Sugano , et al. June 15, 1
1993-06-15
Semiconductor stacked device
Grant 5,198,888 - Sugano , et al. * March 30, 1
1993-03-30
Semiconductor device
Grant 5,103,247 - Sugano , et al. April 7, 1
1992-04-07
Double-sided memory board
Grant 5,095,407 - Kanezawa , et al. March 10, 1
1992-03-10
Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices
Grant 5,028,986 - Sugano , et al. July 2, 1
1991-07-02
Semiconductor integrated circuit device and method of manufacturing the same
Grant 4,982,265 - Watanabe , et al. January 1, 1
1991-01-01

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