Sugane; Mitsuhiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sugane; Mitsuhiko.The latest application filed is for "electronic component and substrate".

Company Profile

6.19.21

Sugane; Mitsuhiko - Ichikawa JP
Sugane; Mitsuhiko - Kawasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic component and substrate Grant 11,158,964 - Mukoyama , et al. October 26, 2	2021-10-26
Electronic Component And Substrate App 20200303849 - Mukoyama; Takahide ; et al.	2020-09-24
Electronic component and substrate Grant 10,714,849 - Mukoyama , et al.	2020-07-14
Wiring board manufacturing method Grant 10,492,291 - Hiroshima , et al. Nov	2019-11-26
Electronic Component And Substrate App 20190245284 - Mukoyama; Takahide ; et al.	2019-08-08
Light emitting element bonded board and method of manufacturing light emitting element bonded board Grant 10,353,158 - Hiroshima , et al. July 16, 2	2019-07-16
Printed circuit board and electric device Grant 10,212,805 - Yamada , et al. Feb	2019-02-19
Wiring board, electronic apparatus, and manufacturing method of wiring board Grant 10,164,312 - Yamada , et al. Dec	2018-12-25
Printed Circuit Board And Electric Device App 20180184514 - Yamada; Tetsuro ; et al.	2018-06-28
Light Emitting Element Bonded Board And Method Of Manufacturing Light Emitting Element Bonded Board App 20180156993 - HIROSHIMA; YOSHIYUKI ; et al.	2018-06-07
Circuit board and method of manufacturing the same Grant 9,992,878 - Sugane , et al. June 5, 2	2018-06-05
Wiring Board Manufacturing Method App 20170290144 - HIROSHIMA; YOSHIYUKI ; et al.	2017-10-05
Printed circuit board, electronic device, and manufacturing method Grant 9,763,331 - Hiroshima , et al. September 12, 2	2017-09-12
Wiring Board, Electronic Apparatus, And Manufacturing Method Of Wiring Board App 20170055343 - Yamada; Tetsuro ; et al.	2017-02-23
Printed Circuit Board, Electronic Device, And Manufacturing Method App 20160309593 - Hiroshima; Yoshiyuki ; et al.	2016-10-20
Circuit Board And Method Of Manufacturing The Same App 20160192486 - Sugane; Mitsuhiko ; et al.	2016-06-30
Circuit board and electronic device Grant 9,148,958 - Hiroshima , et al. September 29, 2	2015-09-29
Wiring substrate and method for manufacturing the wiring substrate Grant 9,049,794 - Morita , et al. June 2, 2	2015-06-02
Circuit Board And Electronic Device App 20150116962 - HIROSHIMA; Yoshiyuki ; et al.	2015-04-30
Circuit board and electronic device Grant 8,958,211 - Hiroshima , et al. February 17, 2	2015-02-17
Wiring substrate Grant 8,648,260 - Ooi , et al. February 11, 2	2014-02-11
Printed board and method of manufacturing printed board Grant 8,513,537 - Ooi , et al. August 20, 2	2013-08-20
Printed Wiring Board, Printed Circuit Board Unit, Electronic Apparatus And Method For Manufacturing Printed Wiring Board App 20120234587 - NAKAMURA; Naoki ; et al.	2012-09-20
Circuit Board And Electronic Device App 20120188735 - HIROSHIMA; Yoshiyuki ; et al.	2012-07-26
Wiring Board Having A Plurality Of Vias App 20120106105 - SUGANE; Mitsuhiko ; et al.	2012-05-03
Multilayer Wiring Board And Method For Evaluating Multilayer Wiring Board App 20120032700 - SUGANE; Mitsuhiko	2012-02-09
Multi-layer printed wiring board, electronic device, and fabrication method of electronic device Grant 8,102,660 - Sugane , et al. January 24, 2	2012-01-24
Wiring Substrate App 20110308840 - OOI; Takahiro ; et al.	2011-12-22
Wiring Substrate And Method For Manufacturing The Wiring Substrate App 20110308842 - MORITA; Yoshihiro ; et al.	2011-12-22
Method For Manufacturing Optical Waveguide App 20110241233 - MORITA; Yoshihiro ; et al.	2011-10-06
Multilayer Flexible Printed Wiring Board And Electronic Apparatus App 20110139492 - Sugane; Mitsuhiko	2011-06-16
Printed circuit board manufacturing method, printed circuit board, and electronic apparatus Grant 7,956,292 - Sugane June 7, 2	2011-06-07
Printed Board And Method Of Manufacturing Printed Board App 20110073354 - OOI; Takahiro ; et al.	2011-03-31
Multi-layer Printed Wiring Board, Electronic Device, And Fabrication Method Of Electronic Device App 20090279273 - SUGANE; Mitsuhiko ; et al.	2009-11-12
Wiring Board Having A Non-through Hole With A Vent Hole App 20090173532 - SUGANE; Mitsuhiko	2009-07-09
Printed Circuit Board Manufacturing Method, Printed Circuit Board, And Electronic Apparatus App 20080201945 - Sugane; Mitsuhiko	2008-08-28

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