Sugama; Chie

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sugama; Chie.The latest application filed is for "method for producing bonded object and semiconductor device and copper bonding paste".

Company Profile

11.6.12

Sugama; Chie - Tokyo JP
SUGAMA; Chie - Chiyoda-ku Tokyo

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device Grant 11,370,066 - Kawana , et al. June 28, 2	2022-06-28
Method For Producing Bonded Object And Semiconductor Device And Copper Bonding Paste App 20220028824 - KAWANA; Yuki ; et al.	2022-01-27
Member Connection Method App 20210351157 - NEGISHI; Motohiro ; et al.	2021-11-11
Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device Grant 11,040,416 - Ishikawa , et al. June 22, 2	2021-06-22
Copper Paste For Pressureless Bonding, Bonded Body And Semiconductor Device App 20210143121 - NAKAKO; Hideo ; et al.	2021-05-13
Copper paste for pressureless bonding, bonded body and semiconductor device Grant 10,930,612 - Nakako , et al. February 23, 2	2021-02-23
Method For Producing Joined Body, And Joining Material App 20200344893 - NAKAKO; Hideo ; et al.	2020-10-29
Method For Manufacturing Thermoelectric Conversion Module, Thermoelectric Conversion Module, And Binder For Thermoelectric Conversion Module App 20200295248 - NEGISHI; Motohiro ; et al.	2020-09-17
Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device Grant 10,748,865 - Kawana , et al. A	2020-08-18
Copper Paste For Joining, Method For Manufacturing Joined Body, And Method For Manufacturing Semiconductor Device App 20200176411 - KAWANA; Yuki ; et al.	2020-06-04
Metal Paste For Joints, Assembly, Production Method For Assembly, Semiconductor Device, And Production Method For Semiconductor App 20200130109 - KAWANA; Yuki ; et al.	2020-04-30
Copper Paste For Joining, Method For Manufacturing Joined Body, And Method For Manufacturing Semiconductor Device App 20200108471 - ISHIKAWA; Dai ; et al.	2020-04-09
Metal Paste For Joints, Assembly, Production Method For Assembly, Semiconductor Device, And Production Method For Semiconductor App 20200075528 - KAWANA; Yuki ; et al.	2020-03-05
Assembly and semiconductor device Grant 10,566,304 - Nakako , et al. Feb	2020-02-18
Copper Paste For Pressureless Bonding, Bonded Body And Semiconductor Device App 20190355690 - NAKAKO; Hideo ; et al.	2019-11-21
Copper paste for joining, method for producing joined body, and method for producing semiconductor device Grant 10,363,608 - Kawana , et al.	2019-07-30
Assembly And Semiconductor Device App 20180342478 - NAKAKO; Hideo ; et al.	2018-11-29
Copper Paste For Joining, Method For Producing Joined Body, And Method For Producing Semiconductor Device App 20180250751 - KAWANA; Yuki ; et al.	2018-09-06

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