Sugakawa; Kenji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sugakawa; Kenji.The latest application filed is for "bonding apparatus and bonding method".

Company Profile

5.7.11

Sugakawa; Kenji - Koshi City JP
Sugakawa; Kenji - Koshi JP
Sugakawa; Kenji - Koshi-shi Kumamoto

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bonding Apparatus And Bonding Method App 20210358879 - Sugakawa; Kenji ; et al.	2021-11-18
Bonding apparatus and bonding system Grant 11,164,842 - Omori , et al. November 2, 2	2021-11-02
Bonding Apparatus, Bonding System, Bonding Method And Recording Medium App 20210272836 - Sugakawa; Kenji ; et al.	2021-09-02
Bonding apparatus, bonding system, bonding method and storage medium Grant 10,985,132 - Otsuka , et al. April 20, 2	2021-04-20
Substrate Processing Apparatus And Substrate Processing Method App 20210035827 - Motoda; Kimio ; et al.	2021-02-04
Bonding system and bonding method Grant 10,847,495 - Nagata , et al. November 24, 2	2020-11-24
Substrate Processing Apparatus And Substrate Processing Method App 20200365442 - Sugakawa; Kenji ; et al.	2020-11-19
Bonding Apparatus, Bonding System, Bonding Method and Storage Medium App 20200343216 - OTSUKA; Yoshitaka ; et al.	2020-10-29
Bonding apparatus, bonding system, bonding method and storage medium Grant 10,756,046 - Otsuka , et al. A	2020-08-25
Bonding Apparatus, Bonding System, Bonding Method and Storage Medium App 20190385973 - OTSUKA; Yoshitaka ; et al.	2019-12-19
Bonding Apparatus And Bonding System App 20190385971 - Omori; Yosuke ; et al.	2019-12-19
Bonding System And Bonding Method App 20190312007 - Nagata; Atsushi ; et al.	2019-10-10
Bonding apparatus and bonding system Grant 10,438,918 - Omori , et al. O	2019-10-08
Bonding apparatus, bonding system, bonding method and storage medium Grant 10,438,920 - Otsuka , et al. O	2019-10-08
Bonding Apparatus, Bonding System, Bonding Method And Storage Medium App 20180158796 - OTSUKA; Yoshitaka ; et al.	2018-06-07
Bonding Apparatus And Bonding System App 20180047699 - Omori; Yosuke ; et al.	2018-02-15
Bonding method, storage medium, bonding apparatus and bonding system Grant 9,741,595 - Sugakawa , et al. August 22, 2	2017-08-22
Bonding Method, Storage Medium, Bonding Apparatus and Bonding System App 20160155721 - SUGAKAWA; Kenji ; et al.	2016-06-02

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