loadpatents
name:-0.0082480907440186
name:-0.0098528861999512
name:-0.0003969669342041
Sugai; Kazumi Patent Filings

Sugai; Kazumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sugai; Kazumi.The latest application filed is for "method for polishing workpiece, polishing apparatus and method for manufacturing semiconductor device".

Company Profile
0.8.6
  • Sugai; Kazumi - Kanagawa JP
  • Sugai; Kazumi - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for polishing workpiece, polishing apparatus and method for manufacturing semiconductor device
App 20070145013 - Miyake; Kozue ;   et al.
2007-06-28
Method for polishing workpiece, polishing apparatus and method for manufacturing semiconductor device
App 20050136804 - Miyake, Kozue ;   et al.
2005-06-23
Method for manufacturing a semiconductor device
Grant 6,569,756 - Sugai May 27, 2
2003-05-27
Semiconductor device and fabricating method thereof
App 20030034561 - Sugai, Kazumi
2003-02-20
Semiconductor device and fabricating method thereof
Grant 6,509,649 - Sugai January 21, 2
2003-01-21
Slurry supply apparatus and method
App 20020022441 - Sugai, Kazumi
2002-02-21
Measurement of crystal face orientation
App 20020005952 - Sugai, Kazumi ;   et al.
2002-01-17
Process for manufacturing semiconductor device and exposure mask
App 20010026906 - Matsubara, Yoshihisa ;   et al.
2001-10-04
Semiconductor device manufacturing method
Grant 6,143,671 - Sugai November 7, 2
2000-11-07
Method of forming aluminum interconnection layer
Grant 6,123,992 - Sugai September 26, 2
2000-09-26
Method of manufacturing semiconductor device
Grant 6,083,832 - Sugai July 4, 2
2000-07-04
Apparatus for forming a solid thin film from a layer of liquid material without void
Grant 5,993,546 - Sugai November 30, 1
1999-11-30
Thin-film formation device and method
Grant 5,793,479 - Sugai , et al. August 11, 1
1998-08-11
Method for forming an aluminum film used as an interconnect in a semiconductor device
Grant 5,545,591 - Sugai , et al. August 13, 1
1996-08-13

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