SUGA; TADATOMO

Patent Applications and Registrations

Patent applications and USPTO patent grants for SUGA; TADATOMO.The latest application filed is for "joint structure, electronic device and method for manufacturing the joint structure".

Company Profile

6.63.59

SUGA; TADATOMO - Tokyo JP
SUGA; Tadatomo - Nakano-ku JP
SUGA; Tadatomo - Uji-shi US
Suga; Tadatomo - Ibaraki JP
Suga; Tadatomo - Tokyo 164-0003 JP
Suga; Tadatomo - Meguro-ku Tokyo JP
Suga; Tadatomo - Tokyo 153-0041 JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Joint Structure, Electronic Device And Method For Manufacturing The Joint Structure App 20220142005 - MIYAKE; TOSHIHIRO ; et al.	2022-05-05
Bonding System And Bonding Method App 20210265300 - YAMAUCHI; Akira ; et al.	2021-08-26
Method For Bonding Substrate, Transparent Substrate Laminate, And Device Provided With Substrate Laminate App 20210017075 - SUGA; Tadatomo ; et al.	2021-01-21
Substrate bonding apparatus and substrate bonding method Grant 10,204,785 - Suga , et al. Feb	2019-02-12
Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly Grant 10,166,749 - Suga , et al. J	2019-01-01
Thin substrate, method for manufacturing same, and method for transporting substrate Grant 10,043,975 - Suga , et al. August 7, 2	2018-08-07
Method for bonding polymer film and polymer film, method for bonding polymer film and inorganic material substrate, polymer film laminate, and laminate of polymer film and inorganic material substrate Grant 9,962,908 - Suga , et al. May 8, 2	2018-05-08
Substrate Bonding Apparatus And Substrate Bonding Method App 20180068854 - SUGA; Tadatomo ; et al.	2018-03-08
Substrate bonding apparatus and substrate bonding method Grant 9,870,922 - Suga , et al. January 16, 2	2018-01-16
Thin Substrate, Method For Manufacturing Same, And Method For Transporting Substrate App 20170200891 - SUGA; Tadatomo ; et al.	2017-07-13
Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly Grant 9,601,350 - Suga , et al. March 21, 2	2017-03-21
Substrate Bonding Apparatus And Substrate Bonding Method App 20170047225 - SUGA; Tadatomo ; et al.	2017-02-16
Electronic element sealing method and bonded substrate Grant 9,331,305 - Suga , et al. May 3, 2	2016-05-03
Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer Grant 9,142,532 - Suga , et al. September 22, 2	2015-09-22
Electronic Element Sealing Method And Bonded Substrate App 20150171365 - Suga; Tadatomo ; et al.	2015-06-18
Method For Bonding Polymer Film And Polymer Film, Method For Bonding Polymer Film And Inorganic Material Substrate, Polymer Film Laminate, And Laminate Of Polymer Film And Inorganic Material Substrate App 20150104656 - Suga; Tadatomo ; et al.	2015-04-16
Chip-on-wafer Bonding Method And Bonding Device, And Structure Comprising Chip And Wafer App 20150048523 - Suga; Tadatomo ; et al.	2015-02-19
Electronic component bonding method Grant 8,915,418 - Shiratori , et al. December 23, 2	2014-12-23
Element pressing apparatus and heating system using element pressing apparatus Grant 8,875,977 - Shiratori , et al. November 4, 2	2014-11-04
Electronic Component Bonding Method App 20140263581 - SHIRATORI; Toshiyuki ; et al.	2014-09-18
Element Pressing Apparatus And Heating System Using Element Pressing Apparatus App 20140263575 - SHIRATORI; Toshiyuki ; et al.	2014-09-18
Bonding-substrate Fabrication Method, Bonding Substrate, Substrate Bonding Method, Bonding-substrate Fabrication Apparatus, And Substrate Assembly App 20140048805 - Suga; Tadatomo ; et al.	2014-02-20
Joining method and device produced by this method and joining unit Grant 8,651,363 - Suga , et al. February 18, 2	2014-02-18
Bonding-substrate Fabrication Method, Bonding Substrate, Substrate Bonding Method, Bonding-substrate Fabrication Apparatus, And Substrate Assembly App 20140037945 - Suga; Tadatomo ; et al.	2014-02-06
Fullerene hollow structure needle crystal and C60-C70 mixed fine wire, and method for preparation thereof Grant 8,246,926 - Miyazawa , et al. August 21, 2	2012-08-21
Joining Method And Device Produced By This Method And Joining Unit App 20120104076 - SUGA; TADATOMO ; et al.	2012-05-03
Joining method and device produced by this method and joining unit Grant 8,091,764 - Suga , et al. January 10, 2	2012-01-10
Fullerene derivative fine wire and its manufacturing method Grant 7,976,814 - Miyazawa , et al. July 12, 2	2011-07-12
Joining Method And Device Produced By This Method And Joining Unit App 20100252615 - Suga; Tadatomo ; et al.	2010-10-07
Joining method and device produced by this method and joining unit Grant 7,784,670 - Suga , et al. August 31, 2	2010-08-31
Semiconductor device and process for manufacturing the same Grant 7,776,735 - Suga , et al. August 17, 2	2010-08-17
Method for bonding substrates and method for irradiating particle beam to be utilized therefor Grant 7,686,912 - Suga , et al. March 30, 2	2010-03-30
Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object Grant 7,688,088 - Komatsu , et al. March 30, 2	2010-03-30
Device for bonding a metal on a surface of a substrate Grant 7,591,293 - Suga , et al. September 22, 2	2009-09-22
Method for bonding substrates and device for bonding substrates Grant 7,550,366 - Suga , et al. June 23, 2	2009-06-23
Semiconductor device and process for manufacturing the same App 20080254610 - SUGA; Tadatomo ; et al.	2008-10-16
Joining Method and Device Produced by this Method and Joining Unit App 20080245843 - Suga; Tadatomo ; et al.	2008-10-09
Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object App 20080174325 - Komatsu; Shigekazu ; et al.	2008-07-24
Inspection apparatus to break the oxide of an electrode by fritting phenomenon Grant 7,319,339 - Iino , et al. January 15, 2	2008-01-15
Fullerene Hollow Structure Needle Crystal and C60-C70 Mixed Fine Wire, and Method for Preparation Thereof App 20080003165 - Miyazawa; Kun'ichi ; et al.	2008-01-03
Inspection method and inspection apparatus Grant 7,304,489 - Iino , et al. December 4, 2	2007-12-04
High-reliable semiconductor device using hermetic sealing of electrodes Grant 7,301,243 - Suga , et al. November 27, 2	2007-11-27
Inspection Method And Inspection Apparatus App 20070229101 - Iino; Shinji ; et al.	2007-10-04
Semiconductor device and process for manufacturing the same Grant 7,268,430 - Suga , et al. September 11, 2	2007-09-11
Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object Grant 7,262,613 - Komatsu , et al. August 28, 2	2007-08-28
Method for bonding substrates and device for bonding substrates App 20070128825 - Suga; Tadatomo ; et al.	2007-06-07
Semiconductor device and method for fabricating the device Grant 7,217,631 - Suga May 15, 2	2007-05-15
Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object App 20070063725 - Komatsu; Shigekazu ; et al.	2007-03-22
Fullerene derivative fine wire and its manufacturing method App 20070053822 - Miyazawa; Kun'ichi ; et al.	2007-03-08
Semiconductor device and fabrication method therefor Grant 7,183,190 - Saijo , et al. February 27, 2	2007-02-27
Fullerene shell tube and process for producing the same App 20070009420 - Miyazawa; Kun'ichi ; et al.	2007-01-11
Method of mounting an electronic part Grant 7,100,279 - Suga , et al. September 5, 2	2006-09-05
Inspection method and inspection apparatus App 20060192578 - Iino; Shinji ; et al.	2006-08-31
Semiconductor device and method for fabricating the device Grant 7,078,811 - Suga July 18, 2	2006-07-18
Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object App 20060145716 - Komatsu; Shigekazu ; et al.	2006-07-06
Inspection method and inspection apparatus Grant 7,061,259 - Iino , et al. June 13, 2	2006-06-13
Bonding device and method App 20060085965 - Suga; Tadatomo ; et al.	2006-04-27
High-reliable semiconductor device using hermetic sealing of electrodes App 20060043604 - Suga; Tadatomo ; et al.	2006-03-02
Semiconductor device and process for manufacturing the same App 20060043552 - Suga; Tadatomo ; et al.	2006-03-02
Circuit structure and semiconductor integrated circuit Grant 6,975,489 - Otsuka , et al. December 13, 2	2005-12-13
Reflow soldering method Grant 6,935,553 - Suga , et al. August 30, 2	2005-08-30
Method for bonding substrates and method for irradiating particle beam to be utilized therefor App 20050173057 - Suga, Tadatomo ; et al.	2005-08-11
Semiconductor device and method for fabricating the device App 20050170626 - Suga, Tadatomo	2005-08-04
Residue-free solder paste Grant 6,887,319 - Suga , et al. May 3, 2	2005-05-03
Method of mounting an electronic part App 20040211060 - Suga, Tadatomo ; et al.	2004-10-28
Inspection method and inspection apparatus App 20040174177 - Iino, Shinji ; et al.	2004-09-09
Inspection method and inspection apparatus Grant 6,777,967 - Iino , et al. August 17, 2	2004-08-17
Reflow soldering method App 20040007610 - Suga, Tadatomo ; et al.	2004-01-15
Residue-free solder paste App 20040000355 - Suga, Tadatomo ; et al.	2004-01-01
Circuit structure and semiconductor integrated circuit App 20030184311 - Otsuka, Kanji ; et al.	2003-10-02
Method and apparatus for mounting App 20030168145 - Suga, Tadatomo ; et al.	2003-09-11
Installation device App 20030164394 - Suga, Tadatomo ; et al.	2003-09-04
Mounting method and device App 20030164396 - Suga, Tadatomo ; et al.	2003-09-04
Semiconductor device and fabrication method therefor App 20030155662 - Saijo, Kinji ; et al.	2003-08-21
Method for manufacturing an interconnect structure for stacked semiconductor device Grant 6,472,293 - Suga October 29, 2	2002-10-29
Interconnect structure for stacked semiconductor device Grant 6,465,892 - Suga October 15, 2	2002-10-15
Method For Manufacturing An Interconnect Structure For Stacked Semiconductor Device App 20020074670 - Suga, Tadatomo	2002-06-20
Inspection method and inspection apparatus App 20020021142 - Iino, Shinji ; et al.	2002-02-21
Semiconductor device and method for fabricating the device App 20020003307 - Suga, Tadatomo	2002-01-10

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