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Patent applications and USPTO patent grants for Sueoka; Koji.The latest application filed is for "thermal processing method for silicon wafer".
Patent | Date |
---|---|
Thermal processing method for silicon wafer Grant 11,162,191 - Maeda , et al. November 2, 2 | 2021-11-02 |
Thermal Processing Method For Silicon Wafer App 20200181802 - MAEDA; Susumu ;   et al. | 2020-06-11 |
Silicon wafer Grant 10,648,101 - Maeda , et al. | 2020-05-12 |
Silicon Wafer App 20190119828 - MAEDA; Susumu ;   et al. | 2019-04-25 |
High resistance silicon wafer and its manufacturing method Grant 7,397,110 - Takase , et al. July 8, 2 | 2008-07-08 |
High-resistance silicon wafer and process for producing the same Grant 7,316,745 - Sadamitsu , et al. January 8, 2 | 2008-01-08 |
High resistance silicon wafer and method for production thereof App 20050253221 - Takase, Nobumitsu ;   et al. | 2005-11-17 |
High-resistance silicon wafer and process for producing the same App 20050250349 - Sadamitsu, Shinsuke ;   et al. | 2005-11-10 |
Evaluation method of IG effectivity in semiconductor silicon substrates Grant 6,803,242 - Kihara , et al. October 12, 2 | 2004-10-12 |
Evaluation method of IG effectivity in semiconductor silicon substrates App 20030203519 - Kihara, Takayuki ;   et al. | 2003-10-30 |
Heat shrinkable polypropylene laminate film Grant 5,620,803 - Oyama , et al. April 15, 1 | 1997-04-15 |
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