loadpatents
name:-0.006882905960083
name:-0.0071408748626709
name:-0.003450870513916
Sueoka; Koji Patent Filings

Sueoka; Koji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sueoka; Koji.The latest application filed is for "thermal processing method for silicon wafer".

Company Profile
3.6.5
  • Sueoka; Koji - Okayama JP
  • Sueoka; Koji - Tokyo JP
  • Sueoka; Koji - Kumamoto JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Thermal processing method for silicon wafer
Grant 11,162,191 - Maeda , et al. November 2, 2
2021-11-02
Thermal Processing Method For Silicon Wafer
App 20200181802 - MAEDA; Susumu ;   et al.
2020-06-11
Silicon wafer
Grant 10,648,101 - Maeda , et al.
2020-05-12
Silicon Wafer
App 20190119828 - MAEDA; Susumu ;   et al.
2019-04-25
High resistance silicon wafer and its manufacturing method
Grant 7,397,110 - Takase , et al. July 8, 2
2008-07-08
High-resistance silicon wafer and process for producing the same
Grant 7,316,745 - Sadamitsu , et al. January 8, 2
2008-01-08
High resistance silicon wafer and method for production thereof
App 20050253221 - Takase, Nobumitsu ;   et al.
2005-11-17
High-resistance silicon wafer and process for producing the same
App 20050250349 - Sadamitsu, Shinsuke ;   et al.
2005-11-10
Evaluation method of IG effectivity in semiconductor silicon substrates
Grant 6,803,242 - Kihara , et al. October 12, 2
2004-10-12
Evaluation method of IG effectivity in semiconductor silicon substrates
App 20030203519 - Kihara, Takayuki ;   et al.
2003-10-30
Heat shrinkable polypropylene laminate film
Grant 5,620,803 - Oyama , et al. April 15, 1
1997-04-15

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