Suen; Wei-Luen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Suen; Wei-Luen.The latest application filed is for "antenna device and manufacturing method thereof".
- Suen; Wei-Luen - Taoyuan TW
- SUEN; Wei-Luen - Taoyuan City TW
- SUEN; Wei-Luen - New Taipei City TW
- Suen; Wei-Luen - New Taipei TW
| Patent | Date |
|---|---|
| Chip package and manufacturing method thereof Grant 11,387,201 - Lee , et al. July 12, 2 | 2022-07-12 |
| Antenna Device And Manufacturing Method Thereof App 20220069454 - LAI; Jiun-Yen ; et al. | 2022-03-03 |
| Chip Package And Manufacturing Method Thereof App 20210269303 - SUEN; Wei-Luen ; et al. | 2021-09-02 |
| Chip package and manufacturing method thereof Grant 11,107,759 - Suen , et al. August 31, 2 | 2021-08-31 |
| Chip Package And Method For Forming The Same App 20210210538 - LAI; Jiun-Yen ; et al. | 2021-07-08 |
| Chip Package And Manufacturing Method Thereof App 20210104455 - SUEN; Wei-Luen ; et al. | 2021-04-08 |
| Chip Package And Manufacturing Method Thereof App 20210082841 - LEE; Po-Han ; et al. | 2021-03-18 |
| Chip package and method for forming the same Grant 10,153,237 - Ho , et al. Dec | 2018-12-11 |
| Semiconductor structure and manufacturing method thereof Grant 9,780,251 - Suen , et al. October 3, 2 | 2017-10-03 |
| Chip Package And Method For Forming The Same App 20170271276 - HO; Yen-Shih ; et al. | 2017-09-21 |
| Semiconductor Structure And Manufacturing Method Thereof App 20170179330 - SUEN; Wei-Luen ; et al. | 2017-06-22 |
| Chip Package And Manufacturing Method Thereof App 20170148752 - HO; Yen-Shih ; et al. | 2017-05-25 |
| Electrical contact structure with a redistribution layer connected to a stud Grant 9,640,683 - Suen , et al. May 2, 2 | 2017-05-02 |
| Chip Package And Manufacturing Method Thereof App 20160355393 - LIU; Tsang-Yu ; et al. | 2016-12-08 |
| Chip package and method for forming the same Grant 9,437,478 - Ho , et al. September 6, 2 | 2016-09-06 |
| Chip package Grant 9,425,134 - Ho , et al. August 23, 2 | 2016-08-23 |
| Chip package and method for forming the same Grant 9,355,970 - Huang , et al. May 31, 2 | 2016-05-31 |
| Chip package and method for forming the same Grant 9,355,975 - Ho , et al. May 31, 2 | 2016-05-31 |
| Chip Package And Method For Forming The Same App 20160086896 - HUANG; Yu-Lung ; et al. | 2016-03-24 |
| Semiconductor chip package and method for manufacturing thereof Grant 9,287,417 - Suen , et al. March 15, 2 | 2016-03-15 |
| Chip package Grant 9,209,124 - Huang , et al. December 8, 2 | 2015-12-08 |
| Chip package comprising alignment mark and method for forming the same Grant 9,165,890 - Ho , et al. October 20, 2 | 2015-10-20 |
| Semiconductor Structure And Manufacturing Method Thereof App 20150179831 - SUEN; Wei-Luen ; et al. | 2015-06-25 |
| Chip Package And Method For Fabricating The Same App 20150097286 - SUEN; Wei-Luen ; et al. | 2015-04-09 |
| Stacked chip package and method for forming the same Grant 8,963,312 - Ho , et al. February 24, 2 | 2015-02-24 |
| Chip package and method for forming the same Grant 8,952,501 - Huang , et al. February 10, 2 | 2015-02-10 |
| Stacked Chip Package And Method For Forming The Same App 20140332983 - HO; Yen-Shih ; et al. | 2014-11-13 |
| Chip Package App 20140332968 - HO; Yen-Shih ; et al. | 2014-11-13 |
| Chip Package And Method For Forming The Same App 20140332908 - HO; Yen-Shih ; et al. | 2014-11-13 |
| Chip Package And Method For Forming The Same App 20140332969 - HO; Yen-Shih ; et al. | 2014-11-13 |
| Semiconductor Chip Package And Method For Manufacturing Thereof App 20140203387 - SUEN; Wei-Luen ; et al. | 2014-07-24 |
| Chip Package And Method For Forming The Same App 20140054786 - HUANG; Yu-Lung ; et al. | 2014-02-27 |
| Chip Package And Method For Forming The Same App 20140015111 - HO; Yen-Shih ; et al. | 2014-01-16 |
| Chip Package And Method For Forming The Same App 20130307125 - HUANG; Yu-Lung ; et al. | 2013-11-21 |
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