loadpatents
name:-0.0044770240783691
name:-0.0097079277038574
name:-0.00049996376037598
Suehiro; Masatoshi Patent Filings

Suehiro; Masatoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Suehiro; Masatoshi.The latest application filed is for "via-filling conductive paste composition".

Company Profile
0.7.0
  • Suehiro; Masatoshi - Kyoto JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Via-filling conductive paste composition
Grant 6,080,336 - Suehiro , et al. June 27, 2
2000-06-27
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
Grant 5,977,490 - Kawakita , et al. November 2, 1
1999-11-02
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
Grant 5,914,358 - Kawakita , et al. June 22, 1
1999-06-22
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
Grant 5,733,467 - Kawakita , et al. March 31, 1
1998-03-31
Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste
Grant 5,652,042 - Kawakita , et al. July 29, 1
1997-07-29
Copper conductor composition
Grant 4,937,016 - Suehiro , et al. June 26, 1
1990-06-26
Copper conductor composition
Grant 4,906,404 - Suehiro , et al. March 6, 1
1990-03-06

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