loadpatents
name:-0.013888120651245
name:-0.0066928863525391
name:-0.0075159072875977
Sudo; Shingo Patent Filings

Sudo; Shingo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sudo; Shingo.The latest application filed is for "sole and baseball spike shoe with the sole".

Company Profile
7.4.14
  • Sudo; Shingo - Osaka JP
  • Sudo; Shingo - Tokyo JP
  • SUDO; Shingo - Osaka-shi JP
  • SUDO; Shingo - Chiyoda-ku Tokyo
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Sole And Baseball Spike Shoe With The Sole
App 20220031020 - Sudo; Shingo ;   et al.
2022-02-03
Power semiconductor device, method for manufacturing power semiconductor device, and power conversion device
Grant 11,217,514 - Iwai , et al. January 4, 2
2022-01-04
Sole Structure for a Shoe, Shoe having Same, and Method for Manufacturing Same
App 20210298415 - KITA; Kenjiro ;   et al.
2021-09-30
Shoes
App 20210251339 - YOSHIDA; Yohei ;   et al.
2021-08-19
Method for Manufacturing a Sole of an Article of Footwear
App 20210146644 - KITA; Kenjiro ;   et al.
2021-05-20
Sole Structure for a Shoe and Method for Manufacturing the Same
App 20210137211 - KITA; Kenjiro ;   et al.
2021-05-13
Power Semiconductor Device, Method for Manufacturing Power Semiconductor Device, and Power Conversion Device
App 20210020551 - IWAI; Takamasa ;   et al.
2021-01-21
Method For Producing Sole Structure Member
App 20200307134 - Yoshida; Yohei ;   et al.
2020-10-01
Sole Structure
App 20200093218 - Kajiwara; Yo ;   et al.
2020-03-26
Sole Structure and Shoe with the Sole Structure
App 20200093223 - Iuchi; Kazunori ;   et al.
2020-03-26
Sole Structure and Shoe with the Sole Structure
App 20200093219 - Iuchi; Kazunori ;   et al.
2020-03-26
Ultrasonic Bonding Apparatus, Ultrasonic Bonding Inspection Method And Ultrasonically-bonded Portion Fabrication Method
App 20200035642 - EGUSA; Minoru ;   et al.
2020-01-30
Semiconductor device
Grant 7,768,118 - Yoshida , et al. August 3, 2
2010-08-03
Semiconductor device with thermoplastic resin to reduce warpage
Grant 7,671,382 - Sudo , et al. March 2, 2
2010-03-02
Semiconductor Device
App 20090321900 - Yoshida; Hiroshi ;   et al.
2009-12-31
Semiconductor device
Grant 7,589,412 - Kashimoto , et al. September 15, 2
2009-09-15
Semiconductor Device
App 20070215999 - KASHIMOTO; Hironori ;   et al.
2007-09-20
Semiconductor Device
App 20070138624 - Sudo; Shingo ;   et al.
2007-06-21

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