loadpatents
Patent applications and USPTO patent grants for Sudo; Shingo.The latest application filed is for "sole and baseball spike shoe with the sole".
Patent | Date |
---|---|
Sole And Baseball Spike Shoe With The Sole App 20220031020 - Sudo; Shingo ;   et al. | 2022-02-03 |
Power semiconductor device, method for manufacturing power semiconductor device, and power conversion device Grant 11,217,514 - Iwai , et al. January 4, 2 | 2022-01-04 |
Sole Structure for a Shoe, Shoe having Same, and Method for Manufacturing Same App 20210298415 - KITA; Kenjiro ;   et al. | 2021-09-30 |
Shoes App 20210251339 - YOSHIDA; Yohei ;   et al. | 2021-08-19 |
Method for Manufacturing a Sole of an Article of Footwear App 20210146644 - KITA; Kenjiro ;   et al. | 2021-05-20 |
Sole Structure for a Shoe and Method for Manufacturing the Same App 20210137211 - KITA; Kenjiro ;   et al. | 2021-05-13 |
Power Semiconductor Device, Method for Manufacturing Power Semiconductor Device, and Power Conversion Device App 20210020551 - IWAI; Takamasa ;   et al. | 2021-01-21 |
Method For Producing Sole Structure Member App 20200307134 - Yoshida; Yohei ;   et al. | 2020-10-01 |
Sole Structure App 20200093218 - Kajiwara; Yo ;   et al. | 2020-03-26 |
Sole Structure and Shoe with the Sole Structure App 20200093223 - Iuchi; Kazunori ;   et al. | 2020-03-26 |
Sole Structure and Shoe with the Sole Structure App 20200093219 - Iuchi; Kazunori ;   et al. | 2020-03-26 |
Ultrasonic Bonding Apparatus, Ultrasonic Bonding Inspection Method And Ultrasonically-bonded Portion Fabrication Method App 20200035642 - EGUSA; Minoru ;   et al. | 2020-01-30 |
Semiconductor device Grant 7,768,118 - Yoshida , et al. August 3, 2 | 2010-08-03 |
Semiconductor device with thermoplastic resin to reduce warpage Grant 7,671,382 - Sudo , et al. March 2, 2 | 2010-03-02 |
Semiconductor Device App 20090321900 - Yoshida; Hiroshi ;   et al. | 2009-12-31 |
Semiconductor device Grant 7,589,412 - Kashimoto , et al. September 15, 2 | 2009-09-15 |
Semiconductor Device App 20070215999 - KASHIMOTO; Hironori ;   et al. | 2007-09-20 |
Semiconductor Device App 20070138624 - Sudo; Shingo ;   et al. | 2007-06-21 |
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