loadpatents
Patent applications and USPTO patent grants for Sudo; Haruo.The latest application filed is for "evaluation method of silicon wafer".
Patent | Date |
---|---|
Thermal processing method for silicon wafer Grant 11,162,191 - Maeda , et al. November 2, 2 | 2021-11-02 |
Evaluation method of silicon wafer Grant 11,060,983 - Sudo , et al. July 13, 2 | 2021-07-13 |
Evaluation Method Of Silicon Wafer App 20210055232 - SUDO; Haruo ;   et al. | 2021-02-25 |
Thermal Processing Method For Silicon Wafer App 20200181802 - MAEDA; Susumu ;   et al. | 2020-06-11 |
Silicon wafer Grant 10,648,101 - Maeda , et al. | 2020-05-12 |
Silicon Wafer App 20190119828 - MAEDA; Susumu ;   et al. | 2019-04-25 |
Silicon wafer and method for manufacturing the same Grant 10,141,180 - Araki , et al. Nov | 2018-11-27 |
Method For Manufacturing A Silicon Wafer App 20160293446 - SUDO; Haruo ;   et al. | 2016-10-06 |
Silicon wafer and method for heat-treating silicon wafer Grant 8,999,864 - Senda , et al. April 7, 2 | 2015-04-07 |
Silicon Wafer And Method For Manufacturing The Same App 20150044422 - ARAKI; Koji ;   et al. | 2015-02-12 |
Method of manufacturing single crystal silicon wafer from ingot grown by Czocharlski process with rapid heating/cooling process Grant 8,476,149 - Isogai , et al. July 2, 2 | 2013-07-02 |
Method For Heat-treating Silicon Wafer App 20130078588 - Senda; Takeshi ;   et al. | 2013-03-28 |
Method for heat treating a silicon wafer Grant 8,399,341 - Senda , et al. March 19, 2 | 2013-03-19 |
Method of heat treating silicon wafer Grant 8,252,700 - Senda , et al. August 28, 2 | 2012-08-28 |
Method For Heat Treating A Silicon Wafer App 20120184091 - Senda; Takeshi ;   et al. | 2012-07-19 |
Silicon Wafer And Method For Heat-treating Silicon Wafer App 20120139088 - Senda; Takeshi ;   et al. | 2012-06-07 |
Method of heat treating silicon wafer App 20100197146 - Senda; Takeshi ;   et al. | 2010-08-05 |
Silicon Wafer, Method For Manufacturing The Same And Method For Heat-treating The Same App 20100038757 - Isogai; Hiromichi ;   et al. | 2010-02-18 |
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