Suda; Seiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Suda; Seiichi.The latest application filed is for "optical selective film".

Company Profile

0.7.11

Suda; Seiichi - Nagoya JP
SUDA; Seiichi - Nagoya-shi JP
Suda; Seiichi - Aichi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Optical selective film Grant 9,970,684 - Tsutsui , et al. May 15, 2	2018-05-15
Solar-thermal conversion member, solar-thermal conversion device, and solar thermal power generation device comprising a .beta.-FeSi2 phase material Grant 9,546,801 - Sato , et al. January 17, 2	2017-01-17
Optical Selective Film App 20150316291 - TSUTSUI; Takuhito ; et al.	2015-11-05
Heat Conversion Member And Heat Conversion Laminate App 20150300695 - TAKEUCHI; Norihito ; et al.	2015-10-22
Solar-thermal Conversion Member, Solar-thermal Conversion Device, And Solar Thermal Power Generation Device App 20140305123 - Sato; Akinori ; et al.	2014-10-16
Stack structure for laminated solid oxide fuel cell, laminated solid oxide fuel cell and manufacturing method Grant 8,658,328 - Suda , et al. February 25, 2	2014-02-25
Method Of Evaluating Adhesion Property, Low-adhesion Material, And Mold For Molding Resin App 20120076886 - KUNO; Takaki ; et al.	2012-03-29
Stack Structure For Laminated Solid Oxide Fuel Cell, Laminated Solid Oxide Fuel Cell And Manufacturing Method App 20110111320 - Suda; Seiichi ; et al.	2011-05-12
Method Of Evaluating Adhesion Property, Low-adhesion Material, And Mold For Molding Resin App 20110042857 - KUNO; Takaki ; et al.	2011-02-24
Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material Grant 7,784,764 - Kuno , et al. August 31, 2	2010-08-31
Method Of Evaluating Adhesion Property, Low-adhesion Material, And Mold For Molding Resin App 20100012816 - Kuno; Takaki ; et al.	2010-01-21
Method of evaluating adhesion property, low-adhesion material, and mold for molding resin Grant 7,614,293 - Kuno , et al. November 10, 2	2009-11-10
Low Adhesion Material, Resin Molding Die, and Soil Resistant Material App 20080296532 - Kuno; Takaki ; et al.	2008-12-04
Method of Evaluating Adhesion Property, Low-Adhesion Material, and Mold for Molding Resin App 20080254286 - Kuno; Takaki ; et al.	2008-10-16
Low-adhesion material and mold for molding resin using the same App 20060093693 - Kuno; Takaki ; et al.	2006-05-04

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